Computational and analytical study on CPU heat sink cooling by single and double stack air-foil micro pin fins

Abstract

The computational and analytical study was carried to study thermal performance of airfoil shaped pin–fin heat sinks. The cooling capacity of heat sink is important for central processing unit (CPU). The heat removal is achieved using air cooling techniques. The computational results of different shapes of pin fins are validated with equation from the available literature. In the present study micro pin fin heat sink with revolved airfoil shape and single, double stack arrangement is used in CFD simulation and results are obtained. The double stack arrangement shows more heat dissipation from heat sink as compare to single stack arrangement.The heat transfer is obtained at different Reynolds number (Re) (using various inlet velocities). The Nusselt number (Nu) increases with increase in air flow velocity which enhance the heat extraction from CPU. The percentage rise in heat transfer using double stack micro pin–fin observed is 12.88% as compare to single stack micro pin–fin when CFD simulation is carried.