Abstract

The negative bias temperature instability (NBTI) is investigated in ultrathin body ultrathin box (UTBB) fully depleted silicon-on-insulator (FD-SOI) p-MOSFETs with zero back gate bias and small drain bias voltage. The threshold voltage shifts during stress at different temperatures and gate bias voltage conditions show that the NBTI is dominated by the trapping of holes in preexisting traps of the gate dielectric, while the recovery transient follows a logarithmic-like time dependence. Considering the hole-trapping/detrapping mechanisms, NBTI modeling has been proposed capturing the temperature and gate voltage dependence.

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