Chapter 8 - Soluble and Low-κ Polyimide Materials

Abstract

This chapter deals with the progress of soluble and low-dielectric constant (low-κ) polyimide materials. With the rapid development of ultralarge-scale integration circuits (ULSI) to high-speed transmission and high integration in the semiconductor industry, and the continuing miniaturization in the dimensions of microelectronic devices, an urgent need for low- and ultralow-κ dielectric materials (low-κ: κ ≤ 2.5; ultralow-κ: κ ≤ 2.0) has arisen. Compared with inorganic dielectric materials, soluble aromatic polyimides often have lower dielectric constants due to the lower materials density and lower individual bond polarizability. Soluble polyimides with ultralow dielectric constants are of great significance. The structures and solubility of aromatic polyimides have been discussed in detail. The design, preparation, and properties of low-κ dielectric constant polyimide materials, especially focusing on the methods for achieving the low-κ properties have been introduced. The methods for achieving low-κ polyimides have been systematically discussed, especially regarding the design and synthesis of polyimides with porous structures, and of intrinsic low-κ polyimides, etc.