Abstract
This chapter deals with the synthesis, characterization, structure and property relationship, as well as the applications of advanced polyimide films. The polyimide film-forming process involves very complicated chemical reactions and physical changes. Precise control of the chemical reactions and physical changes is the key issue in the production of high-quality advanced polyimide films. The chemical reactions in preparation of polyimide film including thermal imidization and chemical imidization are first introduced. The chemical and physical changes during the conversion of the precursor-poly(amic acid) into polyimide films are described. The effects of chemical structures on the combined properties of the several important polyimide films are discussed in detail. The surface modifications of polyimide films by plasma technology are also introduced. Finally the applications of advanced polyimide films on electrical insulating, electronic packaging, and aerospace and aviation industries are briefly described.
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