Abstract
The field effect diode (FED) is an attractive device to use in various digital and analog applications, but all previously proposed FEDs are based on the silicon-on-insulator (SOI) technology. In this article, a bulk version of FED (BFED) is proposed for the first time. Both SOI-FED and BFED are simulated using TCAD tools as a semiconductor drift-diffusion solver. The proposed bulk FED can operate as well as a regular SOI-FED. Most sensitive parameters in the design of the BFED are doping and thickness of <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{p}^{+}$ </tex-math></inline-formula> -drain and <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{n}^{+}$ </tex-math></inline-formula> -source. The effect of these parameters is investigated on the output characteristics of the BFED.
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