Assembly Technology for FO-MCM with HBM in HPC Application

Abstract

As the industry moves forward the age of more than Moore, the next generation of packaging moves forward high density of chiplet or die splitting package integration. Especially for high performance computing applications, the advance packaging is to provide the economic benefits to integrate multiple chiplet dies by silicon or organic interposer. Organic interposer is one of the alternative interface for die to die interconnection. It is well-known by FO-MCM to apply in chiplets integration and ASIC to Serdes dies integration by the homogeneous package integration concept. Due to the motivation of AI computing and HPC market growth, the trend is formed to integrate the packaged HBM into packaging module as the heterogeneous integration package (HIP). Both of the platforms, 2.5D with silicon interposer base and FO-EB with partial bridge die as interconnection media, have already launched to market in recent years. FO-MCM with purely organic interposer, is also discussed to implement into the heterogeneous integration field. The fully organic interposer can provide the flexible design in multiple RDL layers and line / space for HPC products. In this study, it is to address FO-MCM platform with purely organic interposer to implement heterogeneous packaging with integrated HBMs. Chip last approach in FO-MCM has the advantage to control RDL quality and take “known-good RDL” for top die cost rescuing. The fan-out RDL configuration is 4 layers with min, L/S of 2/2um. In the verification processes, based on the simulation analysis, the warpage and stress are optimized by material and under-fill selections in this discussion. The assembly results indicated the warpage and reliability validation passed by MSL4, TCT700x, uHAST96, and HTST1000hrs conditions.