Abstract

Abstract In this work, an innovative structure of a novel double gate tunnel field-effect transistor (TFET) is proposed with a channel length of 20 nm.The gate dielectric regions have been renovated by inserting metal strips and using stacked gate-oxide concept. The device exhibits suppressed ambipolar current, excellent subthreshold swing and good ION/IOFF ratio. The proposed structure proves to be a promising candidate for high speed applications as it shows lesser gate-capacitance than conventional stacked-oxide gate structure. The surface potential and electric field have been modelled considering the depletion regions, using 2-D Poisson's equation with appropriate boundary conditions, based on parabolic potential approximation. A semi-empirical method has been utilized to incorporate the effect of mobile charges on the device characteristics. A physics-based model for charge and terminal capacitances has been derived, following the potential model. The drain current model is able to accurately predict the ambipolar current as well as the effects of drain voltage in saturation region. Proper optimization of the device structure has been performed to derive the best desired electrical characteristics. SILVACO ATLAS simulation data have been used to validate the analytical results of the proposed structure, thereby corroborating the precision of the present analytical model. Finally, an inverter circuit has been designed in CADENCE circuit-simulation environment to justify the usage of our device in low power and high speed digital circuit applications.

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