An optimization algorithm for pre-bond TSV probing tests and fault localization

Abstract

The pre-bond through silicon via (TSV) probing tests and fault localization are important for yield assurance in 3D-SICs. This paper proposes an optimization algorithm to generate the preferable set of test sessions for pre-bond TSV probing tests. Test sessions generated by the optimization algorithm can not only get localization of faulty TSVs in TSV network, but also reduce test time and cost of the pre-bond TSV test. By using the proposed optimization algorithm, the reduction in pre-bond TSV test time is 10% for the pinpointing of four faulty TSVs in 13-TSV network and even 20.5% for one faulty TSV in 6-TSV network compared to the original one [4].