Abstract
Innovations and novel development in substrate thinning and planarization processes driven by advanced packages fabrications are surveyed. For direct 3D die-stacking process approach, a novel methodology for bonded wafer grinding has been put in place based on feedforward wafer thickness metrology and in-situ Auto-TTV Adjustment grinding. This scheme can minimize post-thinning RST variations leading to downstream TSV process improvements. For over-mold facilitated, multi-functional packages and wafer-level fan-out packages, grinding process improved in ways of fixed abrasives and equipment automation. For glass devices processing, new grinding and polishing have been developed on existing Si-compatible equipment. For ductile materials planarization, the surface planer process is presented.
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