Advanced Test Technologies for Heterogeneous & 2.5D/3D Packaging

Abstract

Automotive, AI/ML and 5G markets are demanding increasing levels of integration with respect to memory and compute density. To meet the demand for high-performance products in mission-critical, high-bandwidth applications, the semiconductor industry must look for innovative technologies to continue scaling beyond the silicon manufacturing processes. This is often referred to as “More than Moore”, and one of the most promising methods is heterogenous integration of multiple dies inside the same package (System in Package, or SiP). These dies are typically referred to as chiplets and their interfaces are optimized to operate within a multi-die package for both power, drive strength, interface mechanics and ESD protection. Heterogeneous packages at manufacturing test are faced with quality and reliability challenges due to the accessibility and visibility of traditional test approaches. Dies are assembled over the silicon interposer using very small micro-bumps which may suffer from latent defects such as voids or cracks, potentially posing a reliability risk to the assembled product. On organic substrates, rare resistive shorts, known as bridging shorts, can cause signal integrity and performance degradation. These types of latent defects, although rare, could cause a system failure over time if not screened out during final test or detected during in-field operation. To address these challenges, proteanTecs and Advantest have deployed a joint solution at manufacturing test. proteanTecs provides a monitoring solution for heterogeneous packaging based on chip telemetry, combining deep data with machine learning algorithms. proteanTecs’ patent-protected solution is comprised of small-footprint, digital-only agents for monitoring the performance of the parallel interface. These agents (monitoring IP) are designed for analytics. The fact that they have a small footprint, allows them to be placed next to each pin inside the parallel die-to-die (D2D) PHY, to achieve 100% coverage and with no impact on the signal behavior, quality, or timing. proteanTecs’ data analytics platform then trains models that are deployed at test or in the field. To achieve the highest levels of performance, proteanTecs has partnered with Advantest on the ACS Edge™ for real-time decision-making. ACS Edge™ is a high-performance, highly secure edge compute and analytics solution that enables ultra-fast algorithmic AI decision-making with millisecond latencies during test execution. It connects to the user’s test equipment via a private, high-speed encrypted link and uses the advanced container hub to run the user’s protected applications while protecting and keeping secure the user’s data and analytics. Another key piece of the ACS ecosystem is the ACS Solution Store which provides ease of access to ACS real-time data infrastructure solutions. In this paper, we will provide details for the integrated solution and silicon results. We will highlight how the solution provides new levels of visibility for real-time adaptive testing.