Abstract
“The need for high performance and smarter devices with increased functionalities is driving the industry to develop new, innovative and advanced solutions. While scaling continues, the need for bringing in more functionalities into the package is driving the increased adoption of chiplets and heterogeneous integration. While various packaging platforms are being adopted, the requirements of the application will drive the adoption of the suitable platform. With the increase in high performance computing, the need for more advanced substrates has become more critical, from technology as well as supply chain availability. The current presentation will focus on market drivers, industry challenges and solutions that AT&S is bringing to the market to address next generation industry needs.”
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
