Abstract
A detailed experimental study on the effect of Platinum (Pt) inclusion on the microstructural evolution, shear strength and failure behaviour of SAC solder joint is presented in this paper. Commercial Sn-3.0Ag-0.5Cu (SAC305) lead-free solder paste was mixed with various contents of Pt nanoparticles to form SAC305-xPt (x = 0, 0.10, 0.30 wt.%) composite solder. Single lap shear joint was formed by overlapping two copper plates together at one end. The solder joints were isothermally aged at 150 °C for 500 and 1000 h respectively to study the microstructure evolution and their influences on the solder joint strength. Microstructure studies showed that Pt effectively refined the β-Sn grain and suppressed the growth of intermetallic compound (IMC) during the isothermal aging. Shear strength of the joints increased with increasing Pt contents in the as-reflowed condition. For the isothermally aged specimens, lower degradation rate in shear strength was found in Pt reinforced solder joints as compared to plain SAC solder joints. Fracture behaviour study showed that Pt reinforced SAC305 composite solder joints were more resistive to the ductile to brittle transition as compared to its Pt-free counterparts. In general, Pt incorporation effectively improves the mechanical properties of SAC solder joint by suppressing IMC growth and refining the grain sizes.
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