A Review on Electronics Cooling using Nanofluids

Abstract

Continuous reduction in the size of the electronics for space limitations with higher processing speed generates high heat flux density from the electronics chips during its operational mode. However, this increased heat flux density causes a major problem for the electronics and leads to the failure of the components if not removed properly. This paper investigates the various cooling techniques especially the liquid cooling system operated with nanofluids-a special kind of fluid with the dispersion of nanometre sized particles. This paper quantifies the various kinds of nanofluids used for electronics cooling along with its thermal performance by targeting on the thermal characteristics such as heat transfer coefficient, thermal resistance, thermal conductance, interface temperature, etc. This paper also quantifies the operation of nanofluids over the various geometries of micro channel heat exchangers that serve as a heat sink for power dissipation from the electronics.