Abstract

Data stability, performance and leakage currents are the few important issues of Static Random Access Memory (SRAM) due to scaling down the technology. We revisited these issues by making a comparative study of N-Controlled SRAM cell (NC-SRAM) and PMOS pass transistor SRAM cell (PP-SRAM) with conventional 6T SRAM cell. We observe decrease in Static Noise Margin (SNM) of NC-SRAM and PP-SRAM cells with 6T SRAM cell in hold mode by 60.09% and 0.22% at temperature (T) = 25°C, 63.25% and 3.34% at T = 50°C, 63.82% and 3.37% at T = 100°C respectively. For our transistors sizing we obtain a degradation in write operation of NC-SRAM cell by 7.31% compare to 6T SRAM cell, While it is unchanged in case of PP-SRAM cell. Significant reduction in total leakage power is obtained for NC and PP-SRAM cells compared to 6T SRAM cell by 77.06% and 47.42% at T = 25°C, 76.89% and 48.98% at T = 50°C, 76.87% and 50.94% at T = 100°C respectively, which is due to the gate and sub-threshold leakage currents. We also design a 16 bit memory array of 6T, NC and PP SRAM cells. There is a reduction in total leakage power for 16 bit array of NC and PP-SRAM cells by 69.86 %, 50.75 % respectively compared to the 16 bit array of 6T SRAM cell. All the simulations are performed by Cadence Virtuoso (version IC 6.1.6.500.1) tool using gpdk 45nm CMOS process technology.

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