Abstract
The increase in usage of high performance micro-electronic components leads to increase in high heat generation. In order to increase the life time of the electron devices proper ventilation of heat needs to be planned with the available space. In the electronic system the space occupied by the heat sink is small, as well as the heat has to be dissipated without disturbance. There are two types of cooling arrangement namely active cooling and passive cooling. Active cooling requires additional system such as blower and fan over passive cooling. In this study rectangular and square fin micro-fins are fabricated on copper and aluminium for a height of 0.25mm, with spacing and thickness of 5mm to study the natural convective heat transfer. The study reveals that the rectangular geometry enhances the heat transfer rate by 3% compared to the square fin.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
