9 - Rapid Isothermal Processing (RIP)

Abstract

This chapter provides an overview of rapid isothermal processing (RIP) and discusses future trends in RIP. As a single-wafer processing technique, RIP plays a major role in the cost effective flexible fastcycle-time manufacturing of IC's and photoelectronic integrated systems. Photoeffects play an important role in RIP. The use of vacuum ultraviolet (VUV) and ultraviolet (UV) incoherent light sources, in conjunction with tungsten halogen lamps, can further reduce the processing temperature of various steps used in the fabrication of semiconductor devices and circuits. Thus, the objective of short time processing is to basically reduce the process time–temperature product such that desired physical or chemical processes are completed while unwanted processes are suppressed or not given a chance to take place. Thus, short time processing is the possible solution to many processing steps. This process is ideally suited for the flexible manufacturing of integrated circuits and advanced photoelectronic integrated systems, as well as for the discovery of not invented and smart materials and devices.