Abstract
This chapter discusses the assembly and rework procedure for BGA and CSP, and the associated challenges. One of the major advantages of BGA is its robustness in handling. Assembly and rework of BGA typically result in high yield if processed properly. The downside of BGA is the difficulty in inspecting the interior solder joints. CSP behaves in a similar way to BGA, except for the fact that CSP is more sensitive to mis-handling. Assembly of BGA and CSP follows a typical surface mount technology (SMT) process: print solder paste, place components, reflow, and inspection. The chapter also provides the general stencil design guideline. As solder joint reliability is a strong function of the solder volume as well as the package type, the stencil design should be tailored for each type of package, such as for CSP. The solder volume of a CSP solder ball is considerably smaller than that of a BGA. As a result, the solder joint of CSP will be quite vulnerable if insufficient additional solder volume is added through the solder paste printed. Critical solder volume for the CSP joint is a strong function of CSP type, ball size, CSP pad size, pitch, and PCB pad size.
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