New challenges in solder-paste printing

Abstract

Journal of Electronics ManufacturingVol. 01, No. 01, pp. 29-40 (1991) PapersNo AccessNew challenges in solder-paste printingN.N. EKERE and E.K. LON.N. EKEREDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author and E.K. LODepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author https://doi.org/10.1142/S0960313191000059Cited by:14 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe stencil printing of solder paste for the reflow soldering of surface-mounted components is at present an art. Although the process is known to be governed by complex interactions between large numbers of variables, and empirical data have been accumulated to define their interrelationships, there is a lack of fundamental knowledge of the process and, consequently, inadequate understanding of printing capabilities. The increasing availability and use of fine-pitch components in surface-mount applications have shown the need for more accurate solder-paste prints. Recent developments in fine-particle pastes, water-soluble and no-clean pastes have also introduced additional requirements for printing. To meet these and other new challenges promptly and effectively, process models representing stencil printing are required to explain the effects of key operational parameters and process variables. They, together with other empirical data, will provide the basis for formulating fundamental and equipment-independent rules for solder-paste printing. This paper examines up-to-date industrial challenges in solder-paste printing. It outlines the urgent need to control the printing process better, reviews new developments in solder-paste formulation, printer design and printing methods, and describes existing analytical models developed to represent the off-contact screen printing of ink in thick-film technology. The applicability of these models to solder-paste stencil printing is discussed. The paper concludes with the suggestion of studying the mechanisms of solder-paste printing. The results of the study will provide a tool kit designed to enable the surface-mount industry to maximize the flexibility of its production equipment in handling a wide range of products.Keywords:Surface mount technologysolder-paste printingfine pitch components FiguresReferencesRelatedDetailsCited By 14Analysis of solder mask roughness and stencil shape influence on void formation in solder jointsMartin Kozak, Petr Vesely and Karel Dusek3 March 2023 | Welding in the World, Vol. 60Particle Level Modelling of Solder Pastes Rheological Behaviour in Viscosity MeasurementTareq Al-Ma'aiteh and Oliver Krammer1 May 2019A new coating technology on solder powders to improve solderabilityChen-Yi Chen, Ruei-Ying Sheng and Hsiang-Chuan Chen1 Oct 2017A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder depositsE.H. Amalu, W.K. Lau, N.N. Ekere, R.S. Bhatti and S. Mallik et al.1 Jul 2011 | Microelectronic Engineering, Vol. 88, No. 7Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing processE.H. Amalu, N.N. Ekere and S. Mallik1 Jun 2011 | Materials & Design, Vol. 32, No. 6Fine pitch stencil printing using enclosed printing systemsLing Chunxian Zou, Milos Dusek, Martin Wickham and Christopher Hunt1 Apr 2003 | Soldering & Surface Mount Technology, Vol. 15, No. 1Using computer models to identify optimal conditions for flip‐chip assembly and reliabilityChristopher Bailey, Hua Lu, Greg Glinski, Daniel Wheeler and Phil Hamilton et al.1 Mar 2002 | Circuit World, Vol. 28, No. 1Very fast transmission line pulsing of integrated structures and the charged device modelHorst Gieser and Markus Haunschild1 Oct 1998 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part C, Vol. 21, No. 4A Study of Solder Paste Rheology for The Alternative Assembly and Reflow Technology (AART) ProcessS.T. Murthy, D. Manessis, K. Srihari and G.R. Westby10 February 2011 | MRS Proceedings, Vol. 515Solder Paste Dispensing in Robotic SMD ReworkN. Geren and N.N. Ekere1 Jan 1994 | Soldering & Surface Mount Technology, Vol. 6, No. 1Making Circuits More than Once: The Manufacturing Challenges of Electronics Intensive ProductsD J Williams, P P Conway and D C Whalley9 August 2016 | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture, Vol. 207, No. 2Experimental Study of the Printing of Solder Paste Using the Metal Blade Squeegee SystemI. Ismail, S. H. Mannan, N. N. Ekere and E. K. Lo1 Jan 1993Simulation of the stencil printing process [solder pastes]G.P. Glinski, C. Bailey and K. PericleousThe study of the response of solder pastes under sinusoidal vibrationD. He, N.N. Ekere and M.A. Currie Recommended Vol. 01, No. 01 Metrics History Received 1 May 1991 Accepted 1 June 1991 KeywordsSurface mount technologysolder-paste printingfine pitch componentsPDF download