Experimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow soldering

Abstract

Journal of Electronics ManufacturingVol. 03, No. 01, pp. 25-29 (1993) PAPERSNo AccessExperimental study of stencil/substrate separation speed in on-contact solder paste printing for reflow solderingN. N. EKERE, I. ISMAIL, E. K. LO and S. H. MANNANN. N. EKEREDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , I. ISMAILDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author , E. K. LODepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author and S. H. MANNANDepartment of Aeronautical and Mechanical Engineering, University of Salford, Salford M5 4WT, UK Search for more papers by this author https://doi.org/10.1142/S0960313193000048Cited by:9 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe paper reports on an experimental study on solder paste printing in which the speed of separation between stencil and substrate was varied and the resulting prints were examined for height and defects. The main conclusion of the study is that the speed of separation does not significantly affect the number of printing defects for some solder pastes whereas for others a very low value of separation speed results in more defects. These differing responses reflect the differing solder particle size distributions and chemical structures of the four solder pastes tested. The flow behaviour of the pastes is a crucial factor in determining defect rates.Keywords:Surface mount technologysolder paste printingstencil/substrate separation speed FiguresReferencesRelatedDetailsCited By 9Stencil printing of adhesive-based fuel cell sealings: The influence of rheology on bubble formation during the separation stepFabiano I Indicatti, Michael Rädler, Friedhelm Günter, Elisabeth Stammen and Klaus Dilger24 September 2022 | Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, Vol. 542Rheological Characterisation and Empirical Modelling of Lead-Free Solder Pastes and Isotropic Conductive Adhesive PastesR. Durairaj, Lam Wai Man, S. Ramesh and S. W. Dean1 Jan 2010 | Journal of ASTM International, Vol. 7, No. 7Correlation between jamming and skipping during solder paste printingS.R. Hillman, S.H. Mannan, R. Durairaj, A. Seman and N.N. Ekere et al.1 Dec 2005 | Soldering & Surface Mount Technology, Vol. 17, No. 4Neural network modeling with confidence bounds: a case study on the solder paste deposition processS.L. Ho, M. Xie, L.C. Tang, K. Xu and T.N. Goh1 Oct 2001 | IEEE Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4Characterization of a solder paste printing process and its optimizationGary K.K. Poon and D.J. Williams1 Dec 1999 | Soldering & Surface Mount Technology, Vol. 11, No. 3Analysis of Solder Paste Release in Fine Pitch Stencil Printing ProcessesG. Rodriguez and D. F. Baldwin1 September 1999 | Journal of Electronic Packaging, Vol. 121, No. 3Squeegee deformation study in the stencil printing of solder pastesS.H. Mannan, N.N. Ekere, I. Ismail and E.K. Lo1 Sep 1994 | IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, Vol. 17, No. 3Process Modelling Maps for Solder Paste PrintingN.N. Ekere, E.K. Lo and S.H. Mannan1 Feb 1994 | Soldering & Surface Mount Technology, Vol. 6, No. 2A study of solder paste flow inside a sealed printing headD. He and N.N. Ekere Recommended Vol. 03, No. 01 Metrics History Received 1 September 1992 Accepted 1 October 1992 KeywordsSurface mount technologysolder paste printingstencil/substrate separation speedPDF download