Abstract
Problems during reflow are categorized into two groups: metallurgical phenomena and abnormal solder joint conformation. The first group includes cold joints, nonwetting, dewetting, leaching, and excessive intermetallics. The second group includes tomb stoning, skewing, wicking, bridging, voiding, opening, solder bailing, solder beading, and spattering. Problems during the surface mount technology reflow process often require rework to correct them. With all the parts already soldered onto the PCB, the rework process may compromise the reliability of products, not to mention the increase in costs of manufacturing. Although the problems can be corrected from all three aspects, including materials, designs, and processes, the most frequently used approaches appears to be designs and processes because of the relatively short turnaround time for change implementation.
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