Wire Package Research Articles

Position control of linear switched reluctance motors for high-precision applications

Most advanced manufacturing processes require precise motions for material transfer, packaging, assembly, and electrical wiring. To achieve precise linear motions, most of these high-performance manufacturing machines use X-Y sliding tables with permanent-magnet rotary motors and rotary to linear couplers. Though this method is the most widely used, it has disadvantages of low accuracy, complex mechanical adjustments, high cost, and low reliability. This paper describes the position control of a linear switched reluctance motor for high-performance motions in manufacturing automation. The proposed actuator has a very simple structure and it can be manufactured easily. There is no need for magnets and no limitation on the travel distance. The actuator is extremely robust and can be used in a hostile environment. A novel current-force-position lookup table is first developed to perform the force linearization. Then, a plug-in robust compensator using H/sub /spl infin// loop-shaping design is employed to improve the system robustness and the tracking performance. Experimental results of the motion system indicate that the system has fast tracking responses with good accuracy.

Development and control of a low-cost linear variable-reluctance motor for precision manufacturing automation

Most advanced manufacturing processes require precise linear-position control for material transfer, packaging, assembly, and electrical wiring. To achieve precise linear motion, most of these high-performance manufacturing machines use X-Y sliding tables with permanent-magnet rotary motors and rotary-to-linear couplers. Though this method is the most widely used, it has disadvantages of low accuracy, complex mechanical adjustments, high cost, and low reliability. This paper describes the use of the variable-reluctance-driving principle to construct a novel linear direct-drive actuator system for high-performance position control in manufacturing automation. The proposed actuator has a very simple structure and it can be manufactured easily. There is no need for magnets and no limitation on the traveling distance. The actuator is extremely robust and can be used in hostile environment. A novel control method, using cascade control and the force-linearization technique, is developed and implemented for precision position control of the actuator. Experimental results of the motion system indicate that the system has fast responses with good accuracy.

Using variable‐reluctance actuators in automated manufacturing machines

Most advanced manufacturing processes require high‐speed and high‐precision assembly machines for material transfer, packaging, assembly, and electrical wiring. To achieve the precise motion control, most of the machines use rotary electrical motors as their prime motion actuators, and couple their output shafts to mechanical motion translators. In this paper, the author proposes a new direction in high performance automated machine design, and suggests that the future high performance motion systems should be designed through the philosophy of “simplifying the mechanics through direct‐drive actuators and advanced control methodologies”. For this purpose, this paper investigates a class of direct‐drive variable reluctance (VR) motion actuators for high performance motions, and also looks into a number of VR actuators suitable for robotic applications. It also highlights their features and advantages, and describes the challenges of controlling these devices.

A fast 3D modeling approach to electrical parameters extraction of bonding wires for RF circuits

Bonding wires are extensively used in integrated circuit (IC) packaging and circuit design in RF applications. An approach to fast three-dimensional (3D) modeling of the geometry for bonding wires in RF circuits and packages is demonstrated. The geometry can readily be used to extract electrical parameters such as inductance and capacitance. An equivalent circuit is presented to model the frequency response of bonding wires. To verify simulation accuracy, test structures have been made and measured. Excellent agreement between simulated and measured data is achieved for frequencies up to 10 GHz. The model is well suited for the design and analysis of circuits for cellular phone communication (i.e., order 2 GHz) and future wireless communication (i.e., order 5 GHz).

Improvement of Solder Joint Reliability between Multilayer Ceramic Package and Printed Wiring Board.

Improvement of Solder Joint Reliability between Multilayer Ceramic Package and Printed Wiring Board.

Effects of package parasitics on the performance of SAW filters

Effects of package parasitics on the performance of SAW filters were evaluated. A quasi-static approach based on the finite difference method (FDM) in conjunction with the current simulation method (CSM) was used to extract lumped element parameter values of common interconnections that are found in typical SAW packages. The influence of bond wire connections and package leads on the performance of common interdigital transducers (IDTs) was evaluated.

High rate magnetron RIE of thick polyimide films for advanced computer packaging applications

High performance (high speed and high wiring density) computer packaging can be obtained by applying thin film technology to the multichip interconnection structure. The thickness of the layers, as determined by the electrical requirements, necessitates the use of a via-fill process in conjunction with straight-wall openings in the dielectric layers. The packaging performance and wiring density is improved through reduced via areal dimensions (increased number of lines per layer), through elimination of stepcoverage limitations, and through better planarity thus increasing the number of signal and power layers. The MCNC split cathode magnetron was found to be the best RIE system for obtaining high rate low pressure oxygen RIE of polyimide films. The polyimide etch process was studied, characterized and optimized for the anisotropic residue free etch of 4 µm to 12 µm thick polyimide films. The etched wafers were then processed through the subsequent via filling step and reproducible planar via-filling was achieved with an electroless Ni plating process.

Device Limitations

ABSTRACTPackaging technology must deal with the inexorable trend of semiconductor technology towards higher levels of integration. Extrapolation of present trends suggests that chips with 100 million devices will be produced by the end of the present century. The ability of technology to miniaturize pin-outs will limit the utilization of all of these devices for purposes other than memory. This limitation plus problems of supplying power and removing heat means that chips for high-performance large systems, where the demand for pins follows a well known rule, will probably be limited to levels of integration less than 100,000. A model of large system wiring shows that large increases in the density of wires in system packages and in the rate at which heat can be removed will be needed.Less severe limitations apply to low cost applications. No large increase in power per chip can be anticipated. However, more powerful microprocessors will become available and will need increased amounts of input-output capability.

Corrosion failure of Al-Mg alloy bonding wires in plastic packages : T. H. Ramsey, J. Peterson, P. Douglas and B. L. Gehman. Solid St. Technol., 181 (June 1986)

Corrosion failure of Al-Mg alloy bonding wires in plastic packages : T. H. Ramsey, J. Peterson, P. Douglas and B. L. Gehman. Solid St. Technol., 181 (June 1986)