Interfacial thermal resistance between metal and dielectric materials is a bottleneck of the thermal management for modern integrated circuits as interface density increases with thinner films. In this work, we have observed that the interfacial resistance across gold and aluminum oxide can be reduced from 4.8×10−8m2K/W to 1.4×10−8m2K/W after adding a nickel layer in between, which represents a 70% reduction. The two temperature model is applied to explain the reduction of interfacial resistance, and the results show that the nickel layer functions as a bridge that reduces the phonon mismatch between gold and aluminum oxide. Moreover, nickel has strong electron-phonon coupling, which reduces the thermal resistance caused by the weak electron-phonon coupling in gold.
Read full abstract