There are fundamental differences between conventional furnace processing (CFP) and rapid isothermal processing (RIP). The radiation spectrum of a conventional furnace consists of photons in the infrared and longer wavelength regions, whereas the spectrum of the incoherent light sources used in RIP consists of some UV, visible, and infrared photons. As compared to CFP, the photophysical and photochemical effects associated with RIP provide the capability of lower temperature processing. However, a further reduction in processing temperature can be achieved by the use of vacuum ultraviolet (VUV) and UV light sources in conjunction with a single spectral source RIP. We provide experimental results for the dual spectral source curing of polyimide dielectric films. Our findings indicate that simultaneous exposure of polyimide samples to both VUV and conventional RIP sources during processing cured the polyimide more rapidly and at lower temperatures than did single spectral source RIP alone. These results may be of great importance for the RIP of the future generation of semiconductor devices.
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