Recently, fabrication procedure has become a key factor directly related to the efficiency and cost reduction of products. Despite the importance of process improvement, due to the limitations of the application range, many fabrication processes are limited to laminating one by one. Particularly, when applied to a roll-to-roll process, since the only method is to increase the length of the rail for heat treatment and drying time, realization of the separated fabrication process can minimize waste. One of the separated imprinting processes, transfer process using by soft mold, has been considered by advanced technology to overcome limits of conventional lamination process (spin-casting, dip-coating, etc.), because a layer is previously formed on the other medium substrate, as well as the material loss and penetration of solvents are minimized in the process.In this research, we introduced polyurethane acylate (PUA) of which the surface property was modified by applying the various functional group of the monomer, because control of the surface property of the medium was required to minimize interfacial wettability with a material. As a result, we designed the proper PUAs to enable the transfer process of each organic semiconductor via adhesion control between each interface. First, we applied the transfer process to inter-layer in planer-type perovskite photovoltaics. We successfully transferred two types of inter-layer, poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS) [1], and 6,6-phenyl-C71 butyric acid methyl ester (PC71BM) [2]. Interestingly, when the PEDOT:PSS was transferred onto Indium tin oxide (ITO) substrate, the corrosion of ITO was extremely suppressed due to solid-state film formation, which enhanced the stability of the perovskite devices. Especially, the device with transferred PC71BM exhibited the performance improvement caused by improved coverage of inter-layer on perovskite layer, correlated with increased electron mobility and exciton dissociation. Finally, the transfer process was introduced to organic photodiode (OPD) fabrication [3]. Despite the separated imprinting system, a comparable performance was confirmed in the OPD from the transfer process. Furthermore, the OPD with transferred sensitive layer showed a superior durability (over 95%) to the device from conventional process, owing to morphology stabilization of organic semiconductor layers. This work provides a strategy for promising next-generation technologies of separated imprinting fabrication process, and at the same time can make a significant contribution to increase of process yield and reduction of unit prices.[1] M. Yi, W. Jang, J. S. Cho, and D. H. Wang, Appl. Surf. Sci., 2019, 467, 168.[2] S. Ahn, W. Jang, S. Park, and D. H. Wang, ACS Appl. Mater. Interfaces, 2017, 9, 15623.[3] W. Jang, and D. H. Wang, ACS Appl. Mater. Interfaces, 2018, 10, 38603.
Read full abstract