The nano ribbon FET (NR-FET) is an emerging device as multigate structure can be designed on a single substrate, which leads to improvement in device performance. However, the presence of multiple gate oxide and semiconductor interface creates a number of interface trap charges (ITCs), which leads to variation in device performance. In this paper, the assessment of reliability for NR-FET is performed under the impact of ITCs for different polarity. We have incorporated the ITCs along with wide variations in temperature from 200 to 500 K to study the DC, RF/analog, and linearity performance of NR-FET. It is seen that the increase in amount of positive ITCs (PITCs) leads to improvement in ON state current and less gate voltage is required to turn on the device. Also, the cut-off frequency and speed of the device can be improved through increasing the PITCs in NR-FET. The degradation in OFF state current and device efficiency (gm/ID) is observed with increased in temperature from 200 to 500 K. However, the linearity characteristics is improved at high temperature for different polarity in ITCs. This device provides ION = 9.77 × 10−4 A, IOFF = 6.23 × 10−13 A, maximum transconductance of 1.4 mS, maximum transconductance generation factor of 36.56 V−1, maximum cut-off frequency of 4.36 × 1012 Hz, delay of 39.6 ps, threshold voltage of 0.4301 V at trap level concentration of 1012 Ccm−2. It is also seen that NR-FET outperforms in terms of DC and RF/analog characteristics with the variation in temperature from 200 to 500 K. The temperature sensitivity is 150 (80) under PITC (NITC) for this NRFET. Due to its improved behaviour in wide range of temperature 200–500 K, this NR-FET can be applicable for defense and space applications.