In the present study we show a detailed investigation into the influence of 700 keV O3+ ion implantation in Cr/p-GaN SBDs on electrical characteristics / current transport properties. Also the damage events along the trajectory of the ion beam were quantitatively estimated through SRIM and TRIM simulations. The Current-voltage (I-V) characteristics were analyzed using different methods such as Cheung and Cheung's method and Norde’s method to obtain different electrical parameters. The values of n and ϕB decrease up to a fluence of 1 × 1014 ions cm−2, and show a fractional increase at a fluence of 1 × 1015 ions cm−2. Further, a drastic increase in values of series resistance (RS ) of SBDs with an increase in fluence was observed. In the forward-bias voltage regions, the Cr/p-GaN SBDs conduction mechanism shows an increasingly ohmic behavior with an increase in fluence, which may be attributed to thermally generated carriers. At low voltage, the reverse current conduction mechanism is due to Poole-Frenkel emission. For the high voltage region, Schottky emission mechanism becomes more prominent. The changes in electrical parameters are closely related to the defect and damage profiles estimated through SRIM/TRIM simulations, which are strongly dependent on the dose of the 700 keV O3+ ion implantation. Additionally, we found that at high doses, the charge transport mechanism changes, with additional defects affecting not only the thermionic emission mechanism but also various current transport mechanisms.