This paper describes the vapor epitaxy of indium phosphide using the phosphorus trichloride chloride system. In the dynamic equilibrium between the gaseous reactants (PCl 3, H 2, HCl, P 4), a solid (InP) and a liquid (In-InP solution), three factors are known to influence the growth rate and impurity incorporation rate during epitaxial deposition: (1) the phosphorus trichloride mole fraction; (2) the indium to phosphorus ration over the seeds; (3) the temperature gradient across the indium-indium phosphide source metal. These system constraints are interrelated and prove difficult to optimize; nevertheless, unintentionally doped layers of InP with residual doping levels below 1 x 10 13 cm -3 have been produced along with superimposed submicron doping profiles for Transferred Electron Oscillators (TeOs) and Field Effect Transistors (FETs). TEO layers with controlled carrier concentration profiles containing narrow highly doped layers less than 300 Å thick have been fabricated using advanced doping techniques. Recent work on FET structures has provided semi-insulating buffer layers on iron doped InP substrates with sulfur doped, 0.5–0.3 μm thick surface channel layers which have demonstrated an electron mobility of 3800 cm 2/V·s at 1 x 10 17 cm -3 carrier concentration at 298 K. A discussion of the vapor phase reactor design, the reaction mechanism and crystal morphology is given and a modified method for indium phosphide epitaxy is discussed.