Copper Titanium Research Articles

Cu膜/Ti基板における薄膜中の拡散挙動

The diffusion behavior of titanium (Ti) in copper (Cu) films was studied. Cu films were deposited on Ti substrate by the r. f. magnetron sputtering method.When the deposited Cu film was heated above 630 K in a vacuum, the substrate element Ti diffused through the Cu film very rapidly and concentrated on the surface of the Cu film. The diffusion coefficient was obtained by measuring the time required to diffuse. The pre-exponential factor of the diffusion coefficient was 3.5×10−5 m2 s1, and the activation energy was 127 kJmol−1. The obtained activation energy is about 65% of that of Ti in the bulk Cu.Above 800 K, after Ti diffused rapidly onto the surface of the Cu film, intermetallic compounds were formed at the interface between the Cu film and the Ti substrate. The intermetallic compounds formed were γ-TiCu, Ti3Cu4 and TiCu3. It has been reported that Ti2Cu, γ-TiCu, Ti3Cu4, Ti2Cu3, TiCu2 and Ti2Cu7 are formed from ‘bulk cu’-‘bulk Ti’ couple. In this work, from the ‘film Cu’-‘bulk Ti’ couple, we did not observe the formation of Ti2Cu, Ti2Cu3, TiCu2 and Ti2Cu7. We observed the formation of TiCu3 which is not formed from the ‘bulk Cu’-‘bulk Ti’ couple.

Effect of Radiation on the Corrosion of Candidate Materials for Nuclear Waste Containers

ABSTRACTThe published information on the effect of radiation on the corrosion of potential waste container materials is reviewed. The materials discussed are irons and carbon steels, copper and copper alloys, stainless steels, nickel-based alloys, and titanium alloys. In general, a dose rate of >5 Gy·h-1 is required to accelerate the general corrosion of corrosionallowance materials. The effects of radiation on the localized corrosion of corrosion-resistant materials appear to be contradictory. In some cases, localized corrosion is induced, whereas in others it is inhibited.

The nasicon-type copper(I) titanium phosphate CuTi 2(P0 4) 3: structure and chemical properties

The structure of Nasicon-type copper(I) titanium phosphate CuTi 2(PO 4) 3 has been investigated by neutron diffraction. The copper environment is a compromise between the usual linear coordination of copper(I) and the octahedral surrounding of the M(1) site within the 3-D [Ti 2(PO 4) 3] skeleton. Preliminary results concerning the various mechanisms able to lead to the redox reaction Cu 2+ + e − → Cu + are reported.

Lithium insertion into the normal thiospinel CuZr 2S 4 and the defect thiospinel Cu 0.05Zr 2S 4

Lithium was inserted into the normal thiospinel CuZr 2S 4 by chemical and electrochemical means up to a limiting composition Li 1.0CuZr 2S 4. X-ray and neutron-diffraction data indicate that this lithiation is accompanied by displacement of the copper atoms from 8a tetrahedral sites to 16c octahedral sites of the spinel structure. The open-circuit voltage of a Li⋎Li +⋎CuZr 2S 4 cell (3.4V) was higher than that of a cell containing the corresponding copper titanium thiospinel as cathode (2.9 V). Unlike CuTi 2S 4, oxidative extraction of copper from CuZr 2S 4 required strong oxidising agents and could not be carried to completion. These surprising observations could be accounted for by a qualitative band model of CuTi 2S 4 and CuZr 2S 4. The lithium-ion mobility in Li x CuZr 2S 4 (0⩽ x⩽1.0) was found to be extremely low. Treatment of CuZr 2S 4 with a large excess of concentrated n-butyl lithium resulted in expulsion of almost all the copper as copper metal; subsequent treatment with iodine in acetonitrile enabled the defect thiospinel Cu 0.05Zr 2S 4 to be isolated in high yield. The lattice parameter of Cu 0.05Zr 2S 4 is 0.4% less than that of CuZr 2 S 4. Chemical and electrochemical lithiations of Cu 0.05Zr 2S 4 were carried out up to the limiting composition Li 1.95Cu 0.05Zr 2S 4; the lithiation was found to be topotactic with a lattice expansion of 0.3% when fully lithiated. The open-circuit voltage of a Li⋎ Li +⋎ Li x Cu 0.05 Zr 2 S 4 cell varied smoothly from 2.32 V at x=0.25 to 1.55 V at x=1.9; the corresponding voltages for the defect titanium thiospinel are 2.50 V and 2.10 V. The lithium-ion mobility in Li x Cu 0.05Zr 2S 4 is high.

Neutron diffraction study of the crystallization of hydrogenated CuTi amorphous alloys

Neutron diffraction experiments have been performed while heating amorphous copper titanium hydrides between 295 and 920 K at a constant rate of 0.7 K min −1. CuTiH 1.68 alloys crystallize at 360 K into TiH x and copper. From 670 K, TiH x decomposes, leading first to a metastable copper-rich CuTi phase and then to the stable γ-CuTi phase. For CuTiH 0.86 alloys, the decomposition into TiH x and copper extends over a large temperature range. The remaining amorphous phase crystallizes at 630 K into small γ-CuTi crystals whose parameters show an unexpected thermal variation. Hydrogen starts to desorb at a higher temperature than for CuTiH 1.68 alloys but also leads to the successive formation of Cu 3Ti and γ-CuTi. The presence of a small-angle scattering maximum in both alloys and its thermal evolution suggests that phase separation already exists at room temperature.

Calculation of thermodynamic characteristics of diluted alloys of scandium and titanium in copper with the structure of its d-band taken into account

Calculation is performed of first partial heats of solution and of initial curvatures of isotherms of enthalpies of formation of diluted alloys of scandium and titanium in copper, using information on the detailed structure of copper d-band. Influence of s-electrons and the effect of s-d hybridization was not taken into account in the calculation. Comparison is performed of the values obtained with experimental data.

Neutron scattering study of hydrogen vibrations in polycrystal and glassy TiCuH

Neutron vibrational spectra have been measured for both crystalline and amorphous titanium copper hydride from 40-200 meV. A rather narrow distribution of optical (hydrogen) vibrations is observed for the crystalline alloy TiCuH0.93 with maxima at 142 and 157 meV, very close to previous results for gamma -TiH2. Amorphous TiCuH1.3, however, exhibits a very broad band of hydrogen vibrations ( approximately 76 meV FWHM) peaked at about 145 meV. This density of states provides a probe of the local environments of the hydrogen atoms residing in holes in the metallic glass structure and suggests an 'average' occupation of tetrahedral holes, but considerable fluctuations in local symmetry around these sites.

ChemInform Abstract: ELECTRONIC STRUCTURE OF THE TRANSITION‐METAL NITRATES TITANIUM TETRANITRATE, VANADYL TRINITRATE, COBALT TRINITRATE, AND COPPER DINITRATE. STUDIED BY LOW‐ENERGY PHOTOELECTRON SPECTROSCOPY AND AB INITIO MOLECULAR ORBITAL AND SCATTERED WAVE‐Xα CALCULATIONS

Chemischer InformationsdienstVolume 11, Issue 37 Physical Inorganic Chemistry ChemInform Abstract: ELECTRONIC STRUCTURE OF THE TRANSITION-METAL NITRATES TITANIUM TETRANITRATE, VANADYL TRINITRATE, COBALT TRINITRATE, AND COPPER DINITRATE. STUDIED BY LOW-ENERGY PHOTOELECTRON SPECTROSCOPY AND AB INITIO MOLECULAR ORBITAL AND SCATTERED WAVE-Xα CALCULATIONS C. D. GARNER, C. D. GARNERSearch for more papers by this authorR. W. HAWKSWORTH, R. W. HAWKSWORTHSearch for more papers by this authorI. H. HILLIER, I. H. HILLIERSearch for more papers by this authorA. A. MACDOWELL, A. A. MACDOWELLSearch for more papers by this authorM. F. GUEST, M. F. GUESTSearch for more papers by this author C. D. GARNER, C. D. GARNERSearch for more papers by this authorR. W. HAWKSWORTH, R. W. HAWKSWORTHSearch for more papers by this authorI. H. HILLIER, I. H. HILLIERSearch for more papers by this authorA. A. MACDOWELL, A. A. MACDOWELLSearch for more papers by this authorM. F. GUEST, M. F. GUESTSearch for more papers by this author First published: September 16, 1980 https://doi.org/10.1002/chin.198037002AboutPDF ToolsRequest permissionExport citationAdd to favoritesTrack citation ShareShare Give accessShare full text accessShare full-text accessPlease review our Terms and Conditions of Use and check box below to share full-text version of article.I have read and accept the Wiley Online Library Terms and Conditions of UseShareable LinkUse the link below to share a full-text version of this article with your friends and colleagues. Learn more.Copy URL Share a linkShare onFacebookTwitterLinkedInRedditWechat No abstract is available for this article. Volume11, Issue37September 16, 1980 RelatedInformation

Grandeurs thermodynamiques de formation des solutions solides binaires diluées CuM lorsque m décrit la première longue période

The enthalpies of mixing of binary dilute solutions of the solutes manganese, iron, cobalt, nickel, gallium and germanium in copper were measured by liquid tin calorimetry. The excess free enthalpies of binary dilute solutions of the solutes titanium, chromium, manganese, iron, cobalt, nickel, gallium and germanium in copper were determined by solid cell e.m.f. measurements. The experimental results for chromium, manganese, iron and cobalt in copper are compared with data calculated using phase diagrams. This method is also used to calculate data for CuV. In the final discussion enthalpies of mixing and excess free enthalpies are compared. The experimental results are discussed in relation to the theoretical calculations of Parlebas.

ChemInform Abstract: DISSOLUTION PROCESSES OF TITANIUM‐COPPER ALLOYS. ESCA STUDIES OF SURFACE LAYERS IN ACTIVE AND PASSIVE STATES

AbstractMit fortschreitender Auflösung reichert sich die Oberfläche von Ti‐Cu‐Legierungen (0.025, 15,20, 39.88 Gew.‐% Cu) mit metallischem Cu an.

Dissolution processes of titanium—copper alloys. ESCA studies of surface layers in active and passive states

The use of photoelectron spectroscopy has shown that the surface of titanium—copper alloys is enriched with metallic copper as their dissolution progresses. In the active state, the cathodic dissolution of copper through an intermediate reaction product, Cu hydride, seems to occur simultaneously with the anodic dissolution of titanium; the dissolution of copper from the alloys is immediately followed by copper redeposition. In the passive state the active anodic dissolution of copper, which is mass transfer controlled, occurs through the TiO 2 passive film.

Determination of copper solubility in titanium and study of TiCu solid solution stability by thermoelectric power measurements

The stability of copper in titanium as a function of temperature is determined by thermoelectric power measurements on a Ti-Cu alloy. The stability of the solid solutions which were obtained after quenching from various homogenization temperatures is studied, especially for martensitic solid solutions.

The structure of the β-phase in dilute copper–titanium alloys

An experimental study is made of the β-phase in a copper alloy containing 5.7 at% titanium. A number of electron microscope techniques are used and in particular a large collection of diffraction data from the β-phase is obtained. It is shown that this data cannot be systematically interpreted within the framework of the usual choice of unit cell (due to Karlsson) but that the cell shape proposed by Pfeifer et al. is correct for the data presented here and in previous papers. Some modifications to the atomic positions within the Pfeifer et al. cell are required in order to account for the overall distribution of reflections in these diffraction patterns. Die β-Phase einer Kupferlegierung mit 5,7 at% Titan wird experimentell untersucht. Mehrere elektronenmikroskopische Techniken werden benutzt und insbesondere eine grose Zahl von Beugungswerten von der β-Phase gesammelt. Es wird gezeigt, das diese Daten nicht systematisch interpretiert werden konnen im Rahmen der gewohnlich benutzten Einheitszelle (nach Karlsson), das jedoch die von Pfeifer et al. vorgeschlagene Zellenform fur die hier vorgestellten und in fruheren Arbeiten erhaltenen Daten korrekt ist. Einige Modifikationen bezuglich der Atomlagen innerhalb der Zelle von Pfeifer et al. sind erforderlich, um die Gesamtverteilung der Reflexe in diesen Beugungsdiagrammen zu erklaren.

Adhesion of thin films of evaporated titanium–copper after electroplating

Titanium–palladium–gold is a highly reliable multilayer metallization for thin-film integrated circuits. Efforts to reduce the amount of Au and hence the cost of the circuits have led to development of a Ti–Cu–Ni–Au metallization. This system is fabricated by selectively electroplating Cu–Ni–Au onto evaporated Ti–Cu. During the introduction of the new metallization into manufacture, it was observed that evaporated Cu frequently delaminated from evaporated Ti after Cu–Ni–Au plating. The factors investigated were the nature of the substrate surface, residual gas pressure during evaporation of the Ti and/or Cu, thickness of the evaporated Cu, various combinations of plated films and postplating heat treatment. Adherence was evaluated by a tape test, thermocompression bonding and pull testing of leads, and by a simple substrate break-and-peel test. In-depth profiles of the evaporated TiCu interface were obtained by sputter removal and Auger electron spectroscopy techniques. Oxidation of the evaporated Ti layer at pressures greater than 2.7×10−4 Pa prior to evaporation of the Cu layer was found to be a significant factor leading to subsequent delamination after electroplating. Solutions to the delamination problem include optimization of the evaporation equipment, use of a thin layer (∠150 Å) of Pd between the Ti and Cu, elimination of a distinct interface between the Ti and Cu by coevaporation techniques to produce a graded film, or sputtering of the films rather than evaporation.

Diffusion of titanium in copper

Interdiffusion coefficients in copper-titanium alloys have been determined by Matano's method in the temperature range between 973 and 1283 K on (pure Cu)-(Cu-1.98 at. pct Ti alloy) and (pure Cu)-(Cu-2.91 at. pct Ti alloy) couples. Temperature dependence of the impurity diffusion coefficient of titanium in copper, determined by extrapolation of the concentration dependence of the interdiffusion coefficient to zero mole fraction of titanium, is expressed by the following Arrhenius equation along with the probable errors:D Ti/Cu=(0.693 −0.135 +0.169 )×10−4exp[−(196±2)kJ mol−1/RT] m2/s. The difference in the activation energies for the impurity diffusion of the 3d-transition metals and self-diffusion in copper has been calculated by applying LeClaire's model with the oscillating potential of the impurity atom in copper. The calculated values agree well with the experimental values including the present one.

Ti–Cu–Ni–Au (TCNA) compatibility with resistor and bilevel crossover circuit processing

Titanium–copper–nickel–gold (TCNA), a new low‐cost replacement for the titanium–palladium–gold thin film metallization system, employing a thick Cu film (35 kÅ) to replace Au (50 kÅ), has been shown to be a highly stable and reliable film integrated circuit (FIC) metallization system. Two selective electroplating process sequences have been employed—TCNA and TCN+A. TCNA resistor–conductor FIC’s have a 15–20 kÅ Au film covering the entire conductor pattern. For TCN+A, Au (15–20 kÅ) is plated only in thermocompression‐bond pad sites. Bilevel conductor‐crossover circuits have been fabricated using TCNA with adequate ground via coverage (∠7 mΩ resistance). In the case of TCNA, beam‐lead electroplated‐Au crossovers are fabricated using a Cu spacing layer in conjunction with a Ni protection layer (10 kÅ thick) and a selective Cu etchant. A batchbonded crossover approach must be used with TCN+A. Both processes have been found suitable for the fabrication of resistor–conductor and bilevel crossover‐conductor circuits.

The precipitation of titanium in copper and copper-nickel base alloys

A metallographic survey is presented of precipitation of titanium from supersaturated Cu-Ti and 70 Cu-30Ni-Ti alloys. In all the alloys the first precipitate had a metastable ordered f.c.c. (Ll 2) structure analogous to γ 1 in nickel base systems. In the binary alloys during coarsening of this pbase the cuboid precipitate particles showed a strong tendency for periodic alignment along 〈100〉 directions, this effect giving rise to the side-bands observed in X-ray studies. When fully developed the precipitates changed to a ‘hexagonal’ prism shape with orientation:- [100] ppt. // [201] matrix [010] ppt. // [1̄02] matrix These precipitates eventually transformed in situ to the equilibrium Cu 3Ti which also formed by a competing cellular reaction. In the ternary alloy the metastable precipitate was spherical in form and coarsened classically following a t 1 3 law. This too was eventually replaced by equilibrium Ni 3Ti forming by a cellular reaction. Hardness and tensile results are also reported.

Mass spectra of covalent inorganic nitrates: copper(II) nitrate and titanium(IV) nitrate

Mass spectra of covalent inorganic nitrates: copper(II) nitrate and titanium(IV) nitrate

Polarographic determination of titanium in nickel, copper and iron-chromium-aluminum alloys using CyDTA

In diluted sulfuric acid solution containing 1, 2-cyclohexanediaminetetraacetic acid (CyDTA) as chelating agent, the cathodic reduction of titanium(IV) occurs at about-0.1V (vs. S.C.E.). Its half wave potential depends on pH value of the supporting electrolyte solution. Optimum conditions for determining titanium in nickel, copper and iron-chromium-aluminum alloys by using this reduction wave together with the interfering substances were studied.In the recommended procedure, 5 mM of CyDTA solution is added to the sample solution containing 0.22.6 mg of titanium, pH is controlled to 2.0 and the polarogram is recorded between 0 and-0.6 V (vs. Hg pool). The reproducibilities represented by relative standard deviation are 1.96% for the titanium in nickel, . 3.17% for titanium in copper, and 2.56% for titanium in iron-chromium-aluminum alloys.Cu2+, Fe3+, WoO42-, MoO42-, UO22+, PO43-, F-, I-, H2O2, citrate and tartrate interfere.

塗料中での酸化チタンとフタロシアニン顔料の分散安定性と色分かれ現象

塗料中での酸化チタンとフタロシアニン顔料の分散安定性と色分かれ現象