Fast Fourier transform impedance spectroscopy (FFT-IS) is a well established technique to study in-situ e.g. the involved electrochemical dissolution and deposition phenomena at the electrolyte / substrate interface [1,2]. In contrast to conventional electrochemical impedance spectroscopy (EIS), FFT-IS allows for the simultaneous application of all probing frequencies at the same and thus highly time-resolved investigations of the ongoing electrochemical phenomena.FFT-IS has been employed to study the electrochemical deposition process of Cu on nano-scale-sculptured Al during the entire deposition process, since such a nanoscale-sculptured Al surface exhibits a high multitude of different-sized cubic undercut structures that must be enclosed and overgrown by Cu to generate a good mechanically interconnection between Al and Cu.The analysis of the IS data reveals that the deposition process can be modeled by an equivalent circuit consisting of a series resistance Rs and three Voigt-Kelvin elements, all connected in series to each other. The first one is a capacitor Cp1 and a resistor Rp1, followed by a Warburg element Zw and a resistor Rp2, and finally by another capacitor Cp3 and resistor Rp3 as last Voigt-Kelvin element, see Fig. 1.The time resolved analysis of the above described parameters reveals that three major processes are involved in the Cu deposition process that occur locally in series on the surface, but parallel in time. Based on the time evolution of these fit parameters the Cu deposition process can be sub-divided into three stages that were identified by investigating the nanoscale sculptured Al surface during Cu deposition at characteristic points of each stage by scanning electron microscopy. The knowledge and understanding of these processes allows tailoring and fine-tuning the Cu electrolyte and the deposition process itself.Fig. 1 Nyquist plot of recorded impedance data (boxes) and corresponding fit data (solid line) of the used equivalent circuit model[1] M. Leisner, J. Carstensen, and H. Föll, J. Electroanal. Chem. 615(2), 124 (2008). Figure 1
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