In this investigation, TiCN/TiN thin solid film was selected as a protective coating and deposited onto AZ31 alloy through reactive magnetron sputtering. To mitigate the potential failure resulting from the significant physical disparity between the ceramic film and the metal substrate, a Ti thin film was employed as a base layer. Following the deposition process, an analysis was conducted on the structural features, residual stress, fracture morphology, adhesion strength, and corrosion characteristics of the film/substrate system utilizing X-ray diffraction, scanning electron microscopy, scratch testing, and electrochemical workstation. The findings indicate that the incorporation of a Ti metallic underlayer significantly improves the adhesion and corrosion resistance of the TiCN film. However, when the thickness of the Ti layer surpasses 0.37 μm (deposition of 15 min), it leads to the formation of a distinct columnar crystal microstructure, increased residual stress, and diminished adhesion and corrosion resistance. Additionally, this study delves into the corrosion failure mechanisms in a chloride environment and explains the principles of residual stress measurement through XRD.
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