Abstract Due to the intrinsic brittleness of epoxy-based solder masks (SMs), hyperbranched polymers have emerged as potential alternatives for permanent SMs. However, the low glass transition temperature (Tg) of pure hyperbranched polymers is undesirable for SMs. Instead, they are more suitable to be used as toughening agent. Hence, this study investigates the influence of adding hyperbranched polyester polyol (HBP) on the thermal, mechanical, and electrical properties of epoxy composites. 15 wt% SiO2/epoxy composites were formulated with 0, 20 and 40 wt% HBP and dispersed via probe ultrasonication. The resulting composites were evaluated using Fourier transform infra-red (FT-IR), thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), universal testing machine, dielectric and surface resistivity tests. Findings revealed that adding HBP increased the elongation at break by 10.34 % but reduced both tensile strength and tensile modulus. This may relate to the absence of an increasing absorption peak of O-H group in FT-IR. For thermal stability, the addition of 20 wt% HBP raised the Tmax by 13.38°C but lowered both T5% and Tonset. Tg and storage modulus also decreased with the addition of HBP. The surface resistivity and dielectric constant of the SiO2/epoxy composites increased with the addition of HBP, while a higher addition (40 wt%) of HBP caused a high dielectric loss. In short, 20 wt% HBP/15wt% SiO2/epoxy composite shows the best elongation at break, thermal and surface resistivity, which leads to less brittle and thermally stable SMs.
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