Thick Film Hybrid Circuit Research Articles

Non-noble metal inks for thick film hybrid circuits : M. Hinoul, W. Vermeirsch and R. Vlaeminck. Electl Commun.57 (2), 137 (1982)

Non-noble metal inks for thick film hybrid circuits : M. Hinoul, W. Vermeirsch and R. Vlaeminck. Electl Commun.57 (2), 137 (1982)

DATEP: 120 channel PM high-voltage regulator

DATEP (Distributore Alta Tensione Programmabile) has been designed to distribute high voltage to some 1500 PMs for the gamma detectors (part C) of EHS. Each unit has its own microprocessor controller which performs continuous checking of the 120 channels and allows operator interaction. Channel regulators are based on a specially developed thick film hybrid circuit that allows to get an overall temperature coefficient better than 50 ppm/°C.

Fabrication of large-area thick-film hybrid circuits on RCA porcelain-coated steel substrates: A. N. Prabhu, E. J. Conlon, A. Z. Miller, J. H. McCusker and T. T. Hitch. RCA Review42, 259 (June 1981)

Fabrication of large-area thick-film hybrid circuits on RCA porcelain-coated steel substrates: A. N. Prabhu, E. J. Conlon, A. Z. Miller, J. H. McCusker and T. T. Hitch. RCA Review42, 259 (June 1981)

A method for the computer-assisted design of the topology of thick-film hybrid circuits: W. Burkhardt, D. Hennig, H. Hager and U. Schroter Nachrichtentech. Elektron. 30(9), 359 (1980). (In German)

A method for the computer-assisted design of the topology of thick-film hybrid circuits: W. Burkhardt, D. Hennig, H. Hager and U. Schroter Nachrichtentech. Elektron. 30(9), 359 (1980). (In German)

An MDS Down Converter of Thick-Film MIC for 2 GHZ Pay TV

An MIC down converter which converts a 2150-MHz TV signal to a 60 MHz (U. S. ch. 3) signal was developed by using thick-film technology. 2 GHz frequency band belongs to so-called microwave band. MIC technology for industrial microwave communication equipment was basically completed in the 1960' s [1]. Microwave circuits generally need adjustment (which raises cost) in order to carry out full operation of each circuit device. The converter shown in this report must have feasibility for mass-production as well as other consumer equipment characteristics such as low cost and large quantity, and must have performance satisfying quasi-communication equipment specifications. In order to develop such a microwave consumer device (converter), we employed thick-film technology. Thick-film is inferior in precision of dimension and conductivity of circuit pattern to thin-film. However, the low production cost of thick-film hybrid circuits is a very effective point for consumer equipment production. The demerit points mentioned above can be improved by system and circuit design idea.

Multichannel implantable stimulator for control of paralyzed muscle.

An implantable stimulator has been developed for excitation of paralyzed muscle. The stimulator is radio frequency powered and controlled, and has four output channels; there are three sequentially fired and the fourth is independently controlled. The width of each stimulus pulse and the group stimulus frequency are controlled independently by the absence of the 25 MHz powering carrier. The stimulator has been implemented in a thick film hybrid circuit. The circuitry is encapsulated in a ceramic (Macor®) , which has hermetically sealed feed throughs for electrode lead wires.

The Influence of Air-Abrasive Trimming on the Current Noise of Thick Film Resistors

The purpose of this study was to investigate the effect of some air abrasive trim cuts on the current noise of thick film resistors. It was found that the current noise changed on trimming the resistors and that the percentage change in the current noise enabled important conclusions to be drawn. From these conclusions it was possible to specify optimum trim cuts for resistors for high power and high frequency thick film hybrid circuits.

Thick-Film Thermistor and Its Applications

The electrical properties, reliability, and several successful applications of a thick-film thermistor are described. The thick-film thermistor is composed of a semiconducting oxide, precious metal (RuO 2 ), and glass. The resistivity and thermistor constant are affected to a great extent by the electrical properties of the semiconducting oxide, the particle size of RuO 2 , and the characteristics of the glass. The thermal expansion coefficient of the semiconducting oxide is required to be less than 105 x 10-7K-1in order to prevent the cracks in as-fired film. A resistivity ranging from I \Omega 2.cm to 10 M \Omega .cm together with a thermistor constant from 100 to 4500 K can be obtained by controlling these factors. These glass coated thick-film thermistors exhibit extremely high stability. An accelerated life test shows the drift rate as less than 0.02 percent/year in the resistance of a thick-film thermistor with a crystallized glass coating. A thick-film thermistor can be used widely as an accurate and stable temperature sensor and as an exact temperature compensating element in a thick-film hybrid circuit.

The Telemetered Measurement of Strain on the Surface of a Maxillary Denture in Function

This paper describes the development of a biotelemeter for the measurement of the strain on the surface of a complete maxillary denture. A thick film hybrid circuit has been developed giving up to three channels of strain data from three separate semiconductor strain gauges. The telemeter has a volume of approximately 1.5 cm3 and has been incorporated into a maxillary denture to provide functional assessment of the denture. Recordings of surface strain in the denture have been made from a subject while chewing various foods and these are presented together with a simple analysis of them.

Thick-film circuits for high-reliability applications

The microminiaturisation of electronic circuitry offers not only small size, but also, and more importantly, increased ruggedness and reliability. With thick-film hybrid-circuit technology, large numbers of components and interconnections are produced simultaneously, and with multilayer substrates the multitude of interconnections of digital circuits are made in a few conductor layers

Recent Trends in Thick-Film Hybrid Circuits

Thick-film hybrid technology provides a high degree of flexibility in the design and fabrication of electronic circuits. This has resulted in wider applications of this technology. Present research is directed towards search for new substrate materials, new thick-film paste compositions with a view to reduce the cost of the thick-film hybrid circuits and to increase their applicability.This paper reviews the recent trends in this area outlining the commonly used and newly developed materials and components. Some information is also given on the technology aspects of hybrid circuits. The possible applications of hybrid circuits have been listed. Some data on cost analysis, as applicable abroad, has been provided. Smaller initial investment, smaller prototype development time and economy even at smaller production levels are some of the distinct advantages of hybrid circuits when compared with monolithic integrated circuits.

Thick film hybrid circuits for telecommunications equipment : Robert L. Waer. Proc. Electron. Components Conf. Arlington, Va., (May 16–18 1977). p. 307

Thick film hybrid circuits for telecommunications equipment : Robert L. Waer. Proc. Electron. Components Conf. Arlington, Va., (May 16–18 1977). p. 307

Development and Production of Hybrid Circuits for Microwave Radio Links

During the last few years, the use of hybrid integrated circuits in microwave radio links has increased significantly. This paper reports on a range of microwave hybrid circuits now in production at our plant. These include transistor high power amplifiers, low noise mixers and various other circuits. The hybrid technology has proven to be cost competitive with the more conventional waveguide and coaxial technologies, and gives quite a few other advantages as well. Among these, the standardization of packages and modules is discussed in some detail. The trend is now to use the hybrid technology in VHF circuits as well. This opens up the possibility of integrating related functions in one package. The production cost in this case must be related to printed circuit boards, and it remains to be seen if there is anything to gain in this respect. However the reduction of the size of modules and the time for circuit alignment will certainly give an improvement in the overall system cost. In order to reduce the cost of microwave hybrid circuits, thick film technology is currently being investigated for use up to 15 GHz. There is probably no specific upper frequency for thick film circuits, but the possibility of using conventional thick film technology depends on the actual circuits under consideration. Preliminary results of this work are reported, together with a cost comparison between thick film and thin film microwave hybrid circuits.

Decapsulation of Epoxy Potted Electronic Assemblies for Failure Analysis

Decapsulation of epoxy potted electronic assemblies helps in failure analysis of electronic components. The paper describes the methods of decapsulation of cured epoxy either for failure analysis or for recovery of costly and important components. Decapsulation of polyamide cured epoxy is chemically done by epoxy 85% formic acid. Decapsulation is achieved by swelling of the epoxy, 85 % formic acid does not affect most of the other polymers like polyethylene, phenolics, PVC and also metals which are used in assembly of various circuits. Conformal coatings are removed faster than volumetric encapsulation.The analysis done on some resistors indicated that these require tougher lead connections as well as ceramic base while thick film hybrid circuits indicated that these are to be mounted properly in the pot before encapsulation for high ‘g’ applications.

Thick film hybrid circuits in medical applications : David Hetherington. Electronic Components, 10th September, 1974 p. 23

Thick film hybrid circuits in medical applications : David Hetherington. Electronic Components, 10th September, 1974 p. 23

The design of broad-band active delay line/90° phase difference networks

The general configuration of a delay line/90° phase difference network having a single input and two outputs is defined. The group delay from the input to each output is specified over a frequency range as well as the phase difference between the two outputs. A procedure is outlined for obtaining the singularities associated with this type of configuration. The general procedure for realizing active networks corresponding to the singularities is discussed. The actual active network realizations are obtained in a form that is easily implemented as a thickfilm hybrid circuit.

Undergraduate Thick Film Hybrid Circuit Layout Design and Fabrication

This paper describes that portion of an undergraduate laboratory course in which the layout of an active, thick film hybrid circuit is designed and the circuit is fabricated. Design and fabrication procedures are presented together with suggestions for alternative means of accomplishing the same or similar tasks. It is shown that only a modest amount of specialized equipment is required.

An overview of today's thick-film technology

How thick-film systems are used in all facets of today's electronic industry, starting with their initial application in the computer and defense industries, is described. As the state of the art grew, composition suppliers broadened their lines, developing new higher performance materials to meet changing and more sophisticated packaging requirements. The present technology offers advantages of simple processing, fast and inexpensive tooling systems, economy, quick tumaround time between need and prototype, using wider tolerance active devices, high reliability, and multilevel circuit capabilities. As a result, virtually all sectors of today's electrical and electronics industries are turning to solid-state systems which utilize thick-film hybrid microcircuitry. Consumer and automotive electronic uses are exhibiting the highest rate of new thick-film circuitry adoption at the present time. Industrial usage for high power, measuring and control systems, is also increasing rapidly, and thick-film hybrid circuits are strong candidates to replace electromechanical switching devices. The use of. hybrid microcircuits is forecasted to double or triple current usage on a worldwide basis by 1975. In the future, thick films are expected to play an ever increasing role in the packaging of semicpnductor devices because of their low production cost and high performance advantages.

A Digitally Controlled Color Television Camera

Today's trend toward extensive on-the-spot live color broadcasting of news and sports events has pointed up the need for a highly mobile studio-performance color camera. Approximately two and a half years ago a system design was formulated with prime consideration given to the requirement for a compact, rugged, lightweight camera that would be highly mobile and still maintain the high performance and operational features of the studio-type camera. Its small size and light weight were made possible by improved circuit design and new state-of-the-art components and construction techniques. The following items were of particular importance in reducing the size and weight of the system: a 1-in broadcast quality Plumbicon pickup tube; a small-size, lightweight lens with elements of higher light transmission; specialized integrated and thick-film hybrid circuits; computer-type digital control circuits; high-density multi-layer printed circuit cards; and multiplexing techniques enabling the use of triaxial cable