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Abstract
Decapsulation of epoxy potted electronic assemblies helps in failure analysis of electronic components. The paper describes the methods of decapsulation of cured epoxy either for failure analysis or for recovery of costly and important components. Decapsulation of polyamide cured epoxy is chemically done by epoxy 85% formic acid. Decapsulation is achieved by swelling of the epoxy, 85 % formic acid does not affect most of the other polymers like polyethylene, phenolics, PVC and also metals which are used in assembly of various circuits. Conformal coatings are removed faster than volumetric encapsulation.The analysis done on some resistors indicated that these require tougher lead connections as well as ceramic base while thick film hybrid circuits indicated that these are to be mounted properly in the pot before encapsulation for high ‘g’ applications.
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