Thermal Solution Research Articles

Substrate dependence of the self-heating in lead zirconate titanate (PZT) MEMS actuators

Lead zirconate titanate (PZT) thin films offer advantages in microelectromechanical systems (MEMSs) including large motion, lower drive voltage, and high energy densities. Depending on the application, different substrates are sometimes required. Self-heating occurs in the PZT MEMS due to the energy loss from domain wall motion, which can degrade the device performance and reliability. In this work, the self-heating of PZT thin films on Si and glass and a film released from a substrate were investigated to understand the effect of substrates on the device temperature rise. Nano-particle assisted Raman thermometry was employed to quantify the operational temperature rise of these PZT actuators. The results were validated using a finite element thermal model, where the volumetric heat generation was experimentally determined from the hysteresis loss. While the volumetric heat generation of the PZT films on different substrates was similar, the PZT films on the Si substrate showed a minimal temperature rise due to the effective heat dissipation through the high thermal conductivity substrate. The temperature rise on the released structure is 6.8× higher than that on the glass substrates due to the absence of vertical heat dissipation. The experimental and modeling results show that the thin layer of residual Si remaining after etching plays a crucial role in mitigating the effect of device self-heating. The outcomes of this study suggest that high thermal conductivity passive elastic layers can be used as an effective thermal management solution for PZT-based MEMS actuators.

Analysing the Techno-Economic Viability of Different Solar Heating Systems in South African Beverage Plants

With ongoing real-term reductions in the cost of renewable energy technologies, opportunities to reduce carbon emissions within industry have improved. While the South African industrial sector has been investing in photovoltaics to meet electricity requirements, little has been done to replace fossil fuels used for the generation of process heat, representing two-thirds of the energy consumed. While previous studies have demonstrated the benefits and limitations of solar thermal (ST) energy solutions for industrial applications, recent developments in high-temperature heat pumps (HTHP) offer opportunities for novel configurations, including the use of renewable energy like photovoltaics (PV). This study compares the techno-economic benefits of solar thermal energy systems with PV-supported HTHP systems within the South African beverage sector. After a general consideration, simulation calculations are presented for selected applications. The cost of heat is determined for PV-heat pump systems operating on a stand-alone basis and with heat storage. The study finds that the levelised cost of heat of US$0.050-0.073/kWhth is at least twice that of coal-fired steam boilers. The study, therefore, calls for further work on optimising systems minimising steam requirements, and thereby improving the economics of heat pumps and for a coordinated effort to support the development and financing of high-temperature heat pumps for industrial applications.

The Human Insulin Thermal Solution project—a private sector initiative to address the thermostability of insulin

The Human Insulin Thermal Solution project—a private sector initiative to address the thermostability of insulin

An Ultralight Capillary-Driven Heat Pipe.

Capillary-driven heat pipes are an effective thermal solution for compacting electronic cooling systems. We advance such a heat pipe thermal solution with ultralightweighting for mobile applications. In our advancement, the envelope that encapsulates the phase-change process of a working fluid is fabricated via electroless plating being ∼40 μm thick. Furthermore, the wick structure that transports condensate to a heat source via capillarity is also electroless-plated onto the envelope's inner surfaces, creating a 100-μm-thick, microporous layer. This wick structure is sequentially superhydrophilized by blackening that forms a nanotexture on the microporous wick layer. An effective density of our prototype ultralight heat pipes (uHPs), as a measure of lightweighting, indicates, on average, a remarkable 73% weight reduction of commercial counterparts with sintered copper powder wick in similar exterior dimensions (e.g., ∼2.7 g, compared to ∼10.0 g) while providing equivalent heat spreading. Furthermore, the uHP operates at a 25% lower evaporator temperature, due to additional heat rejection to the surroundings through the ultrathin-walled envelope and wick.

Reduced temperature in lateral (AlxGa1−x)2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond

The low thermal conductivity of β-Ga2O3 is a significant concern for maximizing the potential of this ultra-wide bandgap semiconductor as a power switching device technology. Here, we report on the use of nanocrystalline diamond (NCD) deposited via microwave plasma enhanced chemical vapor deposition (MP-CVD) as a top-side, device-level thermal management solution on a lateral β-Ga2O3 transistor. NCD was grown via MP-CVD on β-(AlxGa1−x)2O3/β-Ga2O3 heterostructures prior to the gate formation of the field-effect transistor. A reduced growth temperature of 400 °C and a SiNx barrier layer were used to protect the oxide semiconductors from etching in the MP-CVD H2 plasma environment. Raman spectroscopy showed a highly sp3-bonded NCD film was obtained at 400 °C, with grain size of about 50–100 nm imaged via atomic force microscopy. The incorporation of the NCD heat-spreading layer resulted in a β-(AlxGa1−x)2O3/β-Ga2O3 heterostructure field-effect transistor showing a decrease in the total thermal resistance at the gate by 42%. The fabrication process, including the NCD etch in the gate region, will need to be improved to minimize the impact of these processes on important device characteristics (i.e., drain current, threshold voltage, and leakage current).

A joint sustainable order-packing vehicle routing optimisation for the cold chain e-fulfilment

AbstractDue to the new normal caused by the pandemic, consumer behaviour has now shifted to online shopping not only for general commodities but also for food and other perishable products. Therefore, e-commerce fulfilment is now integrated with cold chain capabilities to satisfy stringent requirements on time-criticality and product quality, leading to the concept of cold chain e-fulfilment. In the cold chain e-fulfilment process, perishable orders are packed in thermal packaging solutions and delivered to consumers before the quality preservation time window. To secure a sufficient time buffer during last mile delivery, excessive use of thermal packaging materials is applied, which creates an adverse environmental impact on our eco-system. Aligning with low-carbon business practices, this study proposes a novel joint optimization model, namely the Joint Optimization of Sustainable Order Packing and Multi-Temperature Delivery Problem (JOSOPMDP), for order packing and vehicle routing decisions, where the sustainable use of thermal packaging materials is promoted without negatively influencing product quality and customer satisfaction. To evaluate its viability and performance, three sets of computational experiments are subsequently conducted. It is found that the proposed model is feasible to strike a balance between order packing and vehicle routing decisions. Compared with the traditional strategy, the average total cost and satisfaction level are improved by 3.26% and 47.88%, respectively. Consequently, this research fosters sustainable thinking in the cold chain e-fulfilment process, minimizing environmental impact.

Performance of power dissipation on semiconductor module for different configuration of heat SINK with thermal pad

An experimental and numerical investigation to assess the impact of the number of fin arrangements on heat dissipation and its subsequent influence on junction temperature under natural convection. The experimental phase incorporated a thermal pad with a thermal conductivity of 12 W/mK and an aluminum heat spreader measuring (17x16.5) mm. By utilizing the finite volume method (FVM), a numerical model was developed that closely resembles the experimental setup, with errors for temperature package and heat spreader measured at 0.08% and 4.49%, respectively. The analysis was carried out for five different numbers of fins, specifically s1=4fins, s2=6fins, s3=8fins, s4=10fins and s5=12fins. According to the numerical analysis, the increase in the number of fins from 4 to 12 led to a reduction in the average junction temperature from 79.11 °C to 75.97 °C. This denotes a decrease of 3.97% in the average junction temperature. The inclusion of fins on the heat spreader brought about an upsurge in conduction resistance from 55.77 °C/W to 56.19 °C/W, while the convective resistance observed a decline from 152.35 °C/W to 139.62 °C/W. By increasing the number of fins from 4 to 12, the Nusselt number experiences a monotonic decrease from 14.44 to 14.141 due to the reduction in fin-to-fin spacing. As a result, this would lead to a decrease in the natural convection flow. Hence, it was concluded that increasing number of fins beyond the optimal number of fins, signifying the point where thermal benefits become insignificant. The results of this study yield significant insights into the optimization and design of thermal solutions for semiconductor modules, ultimately providing a pathway to boost their operational efficiency and longevity in real-world applications.

Effect of ultrasonic shot peening on microstructure and mechanical properties of GH3230 superalloy during selective laser melt solution heat treatment

Additive manufacturing (AM) is widely used because of its well-known advantages, but there are some disadvantages including microstructure inconsistencies and harmful residual stresses, which can lead to premature part failure. In this study, the microstructure, and mechanical properties of GH3230 alloy processed by AM are changed by a new post-treatment method, which combines thermal solution treatment (ST) and ultrasonic shot peening (USP). The microstructure evolution of GH3230 after ST and USP after ST is investigated experimentally. The experimental results show that equiaxed crystals and M23C6 carbides appear after solution treatment. After ST, USP is performed, and the gradient microstructure is formed perpendicular to the shot peening surface. Dislocation entanglement and grain refinement occur in the plastically deformed layer. In addition, the carbide interacts with the dislocation. After ST, USP can produce a high level of residual compressive stress in the plastic deformation layer. This combination of ST and USP helps to improve the mechanical properties of additive manufactured parts by changing their microstructure and residual stress distribution.

Modeling and analysis of the triple diffusion unsteady flow of couple stress nanofluid with variable viscosity and distinct thermal sources

Thanks to their optimal thermal characteristics, nanomaterials stand out for their varied applications in heat transfer systems, energy storage, industrial processes, and biomedical research. Recently, scientists explored various dynamic properties in nanofluid flow to develop an even better thermal model. In this context, the phenomenon of triple diffusion in nanofluids constitutes an active area of research, offering promising applications in nanotechnology, metallurgical processes, chemical reactors, and thermo-diffusion processes. This paper analyzes the triple diffusion flow of a torque-constrained nanofluid, induced by a periodically oscillating porous surface, taking into account the importance of variations in thermal consequences. The viscosity of the torque-constrained nanofluid is assumed to be temperature-dependent. The analysis takes into account the variable role of thermal conductivity, mass diffusivity, and solute volume fraction. The modeling of the problem is expressed by coupled nonlinear partial differential equations. The semi-analytic technique, known as the homotopic analysis scheme, is used for resolution. The solution is validated and confirms the convergence region. The physical aspects of the parameters are examined with regard to the parameters involved. The simulated observations reveal that with the Dufour–Lewis factor and varying mass diffusivity, an increase in solute concentration is seen. The concentration of nanoparticles decreases with the nano-Lewis number.

Directional vapor mobility from asymmetric microstructured surfaces in an adverse gravity orientation

Stagnant vapor growth on a downward-facing flat surface leads to increased surface temperature and dryout at relatively low heat fluxes. The current study investigates boiling from a surface with periodic 60°-30° or 75°-15° asymmetric sawtooth microstructures to passively remove vapor slugs in adverse gravity. Bubble dynamics is experimentally investigated in an 8-mm square borosilicate glass tube and visualized using a high-speed camera to measure vapor bubble morphology and velocity in the FC-72 dielectric liquid. The vapor bubble's morphology is observed to change based on its relative size to the ratchets. This change manifests as a decrease in the curvature ratio between the crest and trough of the microstructure as the vapor bubble gets larger. The pattern of vapor slugs nucleating from intended, engineered sites, coalescing to form larger slugs that slide across the microstructure, is observed at different frequencies at different heat fluxes. The microstructure supports increased vapor volume at higher heat fluxes, suggesting that a passive and self-regulating thermal management solution for adverse gravity applications is feasible. An empirical force balance model is developed based on the curvature-induced Young-Laplace pressure difference and retarding forces due to drag and buoyancy. The interplay between these forces is analyzed at different liquid film thicknesses, and the force balance is compared with a 75°-15° sawtooth structure. For a vapor slug spanning four sawteeth, the 75°-15° structure supported a 54 % increase in the feasible liquid film thickness range due to the increased long slope area.

Towards the use of natural thermal insulation on the exterior of vertical building walls in desert regions: A case study in the city of Bechar, Algeria

The use of natural-based exterior thermal insulation systems constitutes a significant challenge for achieving energy efficiency of construction. The purpose of this article is to propose new exterior thermal insulation solutions based on natural materials such as wood wool, cellulose wadding, expanded cork, hemp fiber, and sheep’s wool, in order to minimize energy consumption, address durability concerns, maintain thermal comfort, and promote the use of natural materials in thermal insulation system designs. The methodology followed consists of presenting a comparative numerical study of different exterior insulation techniques (ETI) using a dynamic thermal simulator for desert regions. The study evaluated ETI systems for vertical walls attached to a concrete block wall, including one EPS system with coating (wet process) and six systems with cladding (dry process). The results show that applying exterior insulation to walls using the two cladding systems based on hemp fiber and sheep wool resulted in a total reduction in building energy consumption of 42.21% and 42.81%, respectively. These results confirm the effectiveness of natural materials in improving the energy performance of buildings, particularly the system based on sheep wool.

Fundamental limits of dynamic phase change materials

To accommodate societal electrification and decarbonization, renewable energy resources continue to expand their share of the global energy market. The intermittency of renewable energy technologies as well as the high power density of modern electrified platforms necessitates the need for both efficient thermal management and high-density thermal storage. Phase change materials are a promising passive thermal energy storage solution. However, difficulties with efficient system implementation stemming from the inherent melt pool formation hinder their potential. We develop an innovative strategy, termed dynamic phase change material “dynPCM,” to address this thermal transport issue by ensuring a constant, thin, melt layer. We analyze the fundamental limits of dynPCMs, characterize the peak achievable heat flux and energy/power densities, estimate the power consumption of dynPCM systems, and investigate the fundamental physics which govern dynPCM behavior. We show that dynPCM can eliminate the classical trade-off seen between energy density and power density and achieve ultrahigh heat fluxes, ∼105 W/cm2, with heat flux-to-required power ratios as high as ∼107. We also demonstrate achievable power densities as high as ∼100 W/cm3 at energy densities as high as ∼10 kJ/cm3. Throughout this work, we develop a methodology to evaluate the operating limits, enabling adaptation of the dynPCM system concept to a variety of applications and industries.

Study of a Thermochemical Heat Storage Reactor Filled with Polyaluminum Sulfate for Low-Temperature Application

This paper investigates comprehensively the operational dynamics of a thermochemical heat storage (TCHS) reactor for low-temperature applications using polyaluminum sulfate and takes into consideration a developed simulation model with an experimentation validation. Significant concordances were found between the developed simulation model and the experimental results. Results reveal optimized conditions for the charging process using an electrical heater, with a heating temperature of 120°C at 10 K/min over 500 minutes. This achieves full material charging, with stabilized pressure drops at an equilibrium of 80 mbar, corresponding to a temperature of approximately 108°C, and yielding a thermal power of 950 W. An inlet vapor pressure of 18 mbar at 10°C for 5 hours is sufficient to completely discharge the bed, with pressure drops reaching around 30 mbar and a thermal power of 300 after reaction completion. Insights into conversion extents during both processes are provided, along with a remarkable thermal efficiency of 90% and a coefficient of performance (COP) of 97%, surpassing recommended theoretical values (50%). The study suggests further enhancing system performance through the design and implementation of a dedicated heat exchanger. The achievement of 75% of the targeted thermal power specification represents a significant milestone, offering valuable contributions towards the realization of sustainable technological advancements of both the reactor technology of TCHS and state-of-the-art thermal energy storage solutions. From the research, it is possible to infer further suggestions for enhancing this performance by designing and implementing a dedicated heat exchanger for both heat supply and retrieval mechanisms.

Experimental study on ultra-thin silicon-based VC for chip-level heat dissipation

The trend towards miniaturization and integration of integrated circuits has led to the emergence of local hotspots with high heat flux and high temperature frequently. Integrating vapor chamber (VC) directly on the surface of semiconductor electronic devices, can effectively address the problem of overheating on the chip surface, and is therefore considered as a promising thermal management solution. However, the challenge of reducing the size of the VC while improving its heat transfer performance cannot be ignored. To address this, a silicon-based VC with thickness of 0.6 mm is designed and fabricated in this study. Structural optimization is carried out, including the design of three types of wicks using square micropillar arrays and two types of support columns including solid and porous and an experimental system is built to study the influence of these structures on the heat transfer performance of VC. The results indicate that the VC can still function normally under the highest heat flux of 123.6 W/cm2, resulting in lowest thermal resistance of 1.54 °C/W. For wicks, the thermal resistance of VC with characteristic size of 10 μm is reduced compared with that of 20 μm. The introduction of gradient wick, that is, using small-size (10 μm) micropillar arrays in heating area and big-size (20 μm) micropillar arrays in non-heating area, can effectively reduce the thermal resistance of VC. Moreover, the solid support columns are found being advantageous in reducing the thermal resistance of VC, while porous support columns improve the surface temperature uniformity of VC. This work provides a feasible path to optimize silicon-based VC.

Potentials and Limits of PMN-PT and PIN-PMN-PT Single Crystals for Pyroelectric Energy Harvesting

Waste heat is inherent to industrial activities, IT services (e.g., data centers and microprocessors), human mobility, and many other common processes. The power lost each year in this way has been estimated in the 1000 TWh in the EU which, owing to skyrocketing energy prices and not least the urgent need for decarbonizing the economy, has engendered tremendous research efforts among scientists and engineers to recover/recycle this waste energy. Beyond established thermal engineering solutions for waste heat, advances in multifunctional materials open new paradigms for waste heat harvesting. Two smart material types are of particular focus and interest at present; these are thermoelectric and pyroelectric materials, which can both transform heat to electrical power, though via different effects. The present paper summarizes our research work on a new class of pyroelectric materials, namely <111> oriented (1-x)(Pb(Mg1/3Nb2/3)O3–xPbTiO3 (PMN-PT) and x-Pb(In1/2 Nb1/2)O3-y-Pb(Mg1/3 Nb2/3)O3-(1-x-y)-PbTiO3 (PIN-PMN-PT) single crystals that exhibit some of the highest pyroelectric properties ever measured. First, a figure of merit for pyroelectric energy harvesting is derived, followed by a detailed assessment of the properties of the said crystals and how they depend on structure, poling, thickness, and temperature. The properties are further contrasted with those of conventional pyroelectric crystals. It is concluded that the PMN-PT-base single crystals are best suited for harvesting devices with a working temperature range from 40 to 100 °C, which encompasses waste heat generated by data centers and some chemical and industrial processes, affording the highest figure of merit among pyroelectric materials.

Biomimetic design of building facades: an evolutionary-based computational approach inspired by elephant skin for cooling in hot and humid climates

The built environment faces significant challenges in managing energy demands amidst rising temperatures and increasing concerns linked to climate change. Meeting carbon emissions targets and resource management goals necessitates urgent innovation in more energy-efficient cooling solutions. Nature offers a large database of adaptive and efficient thermal solutions that can be harnessed through biomimetic methods in building design and systems. Emerging biomimetic and computational approaches hold promise in facilitating practical application efforts. This paper investigates the translation of morphological features from elephant skin to building facades, optimizing their inherent cooling capabilities through computational design using evolutionary algorithms. Through this exploration, we propose a set of generalized evolutionary principles, offering a foundational framework for the development of textured facade tiles with the aim of mitigating heat gain from solar radiation. This study provides an in-depth analysis of how assembly, texture depth, and orientation impact thermal performance, enabling the design of more effective passive cooling systems through an understanding of the relationship between morphological variations in textured surfaces and environmental performance. Future research may involve studying natural convection dynamics, optimizing capillary networks, evaluating materials for water adhesion and cleaning, assessing impacts on biological growth, and exploring biodiversity integration within textured facade panels.

Rigorous Reliability Testing of an Encapsulated Thermal Pyrolytic Graphite (TPG) Heat Spreader for Passive Thermal Management Applications

Continued microelectronic miniaturization has resulted in higher power density, increasing the need for high performance thermal management. One possible solution for board-level thermal management is to fully encapsulate a high thermal conductivity material, such as Thermal Pyrolytic Graphite (TPG; ~1700 W/mK) in a metal (such as 6061 aluminum), producing an efficient passive heat spreader for thermal dissipation. The metal shell provides sufficient mechanical strength at a small detriment to the overall thermal conductivity. Reliability and consistent performance over time are critical for thermal management systems, especially in Defense and Aerospace applications. MIL-STD-883H provides test parameters for reliability involving exposure to mechanical shock (Method 2002.5), mechanical vibration (Method 2005.2), and thermal shock (Method 1011.9), with traditional evaluation criteria involving microelectronic device performance and/or a visual examination. For this work, the reliability of aluminum encapsulated TPG test coupons was evaluated with more demanding criteria: a visual examination, X-ray inspection, acoustic microscopy, and thermal conductivity performance testing, both before and after the previously discussed MIL-STD-883H exposures. The encapsulated coupons showed excellent robustness; the thermal conductivity properties remained constant with an average value around 965 W/mK, and the non-destructive imaging revealed excellent bond quality for the metal encapsulation, with no evidence of delamination. This more stringent evaluation criteria after MIL-STD-883H testing provides a better way to evaluate the reliability of passive thermal management systems. The study results also demonstrate the metal encapsulated TPG heat spreader as a superior thermal management solution with high performance and high reliability for demanding applications.

Sustainable Super‐Insulating Packaging Composite from Recycled Wood

AbstractThermal insulation materials (TIMs) have been widely used over the past century. In this landscape, expandable polystyrene (EPS) is the dominant choice; however, the waste management of EPS is hampered by recycling challenges and lack of economic incentives. Concurrently, the order delivery and pharmaceutical distribution have experienced significant growth due to lifestyle shifts after the pandemic. For instance, the utilization of drones for transportation is illustrated (see abstract figure) as a prospective alternative transportation protocol. In this work, a synthetic method is developed to prepare bio‐degradable thermal insulator material from recycled wood and silica aerogel. The silica aerogel wood composite (SAWc) has the following properties: 1) low carbon emission (4.932 kg CO2e kg−1); 2) low thermal conductivity (0.032 W mK−1) with an anisotropy of 1.5; 3) high compressive strength (yield stress = 8.60 Mpa); 4) excellent resistance to organic solvents; 5) high biodegradability (49.4% weight loss after 28 days); 6) excellent flame retardancy, both of which are above EPS. The scalable, super‐insulating, and robust thermal insulator, as demonstrated in this work, holds high potential as an alternative packaging material poised to shape the next era in thermal insulation solutions.

Thermoelectric cooler with embedded teardrop-shaped milli-channel heat sink for electronics cooling

Thermoelectric coolers (TECs) offer a site-specific, on-demand, and solid-state thermal management solution for on-chip electronics cooling. To maximize their cooling performance, it is essential to integrate an effective heat exchanger, such as microchannels, on the TEC’s hot side. However, traditional microchannel heat sinks pose challenges, including the necessity for high-cost equipment and the manifestation of deleterious parasitic contact thermal resistance with the TEC. Recent studies have demonstrated the superior performance of teardrop-shaped microchannels compared to their conventional counterparts, yet their effectiveness at the milli-scale remains unexplored. In this work, through systematic numerical simulations across nine milli-channels with distinct variable cross-sections, we propose a teardrop-shaped milli-channel heat sink designed for fabrication through cost-effective mechanical machining. The optimized teardrop-shaped milli-channel exhibits a superior overall thermo-hydraulic performance evaluation factor (PEC) of approximately 1.8 with respect to its rectangular cross-sectional counterpart. Furthermore, we seamlessly embed the designed milli-channel heat sink into the substrate of the TEC to mitigate the parasitic contact thermal resistance. Measurements on the TEC embedded with the teardrop-shaped milli-channel heat sink show that the cold end temperature reaches a minimum value of −18.6 °C at an optimal input electrical current of 3.5 A and an inlet coolant flow velocity of 0.2 m/s. This temperature represents an improvement of approximately 3.5 °C and 4.4 °C compared to the TEC with an attached teardrop-shaped milli-channel and a conventional water block heat sink, respectively, under identical operating conditions. Additionally, a prototype TEC cooling system with the embedded teardrop-shaped milli-channel for high-power field-effect transistor (FET) cooling is demonstrated. Operating at an input electrical current of 3.5 A and an inlet flow velocity of 0.6 m/s, our proposed TEC cooling system achieves a steady-state working temperature of 51.3 °C for the FET at a high heat flux of 75 kW/m2, outperforming the TEC with an attached teardrop-shaped milli-channel and a conventional water block heat sink by approximately 1.4 °C and 2 °C, respectively.

Operating condition optimization of liquid metal heat pipe using deep learning based genetic algorithm: Heat transfer performance

Liquid metal heat pipes play a critical role in various high-temperature applications, with their optimization being pivotal to achieving optimal thermal performance. In this study, a deep learning based genetic algorithm is suggested to optimize the operating conditions of liquid metal heat pipes. The optimization performance was investigated in both single and multi-variable optimization schemes, considering the operating conditions of heat load, inclination angle, and filling ratio. The single-variable optimization indicated reasonable performance for various conditions, reinforcing the potential applicability of the optimization method across a broad spectrum of high-temperature industries. The multi-variable optimization revealed an almost congruent performance level to single-variable optimization, suggesting that the robustness of optimization method is not compromised with additional variables. Furthermore, the generalization performance of the optimization method was investigated by conducting an experimental investigation, proving a similar performance. This study underlines the potential of optimizing the operating condition of heat pipes, with significant consequences in sectors such as high temperature field, thereby offering a pathway to more efficient, cost-effective thermal solutions.