Thermal Resistance Research Articles

Transcriptome sequencing of garlic reveals key genes related to the heat stress response

With global warming, heat stress has become an important factor that seriously affects crop yield and quality. Therefore, understanding plant responses to heat stress is important for agricultural practice, but the molecular mechanism of high-temperature tolerance in garlic remains unclear. In this study, ‘Xusuan No. 6’ was used as the experimental material. After heat stress for 0 (CK), 2 and 24 h, transcriptome sequencing was used to screen metabolic pathways and differentially expressed genes (DEGs) closely related to heat stress and was further verified by quantitative real-time polymerase chain reaction (qRT-PCR). A total of 86,110 unigenes obtained from the raw transcriptome sequencing data were spliced. After 2 h of heat treatment, the expression levels of 8898 genes increased, and 3829 genes were decreased in leaves. After 24 h, the expression levels of 7167 genes were upregulated, and 3176 genes were downregulated. Gene Ontology enrichment analysis showed that DEGs were mainly enriched in seven categories: cellular processes, metabolic processes, binging, catalytic activity, cellular anatomical entity and protein-containing complex response to stimulus. Kyoto Encyclopedia of Genes and Genomes pathway enrichment showed that DEGs are involved in protein processing in the endoplasmic reticulum, plant hormone signal transduction, phenylpropanoid biosynthesis, and photosynthetic antenna proteins. Six genes were selected and further verified by qRT-PCR. In this study, the full-length transcriptome of garlic was constructed, and the regulatory genes related to the heat resistance of garlic were studied. Taken together, these findings can provide a theoretical basis for the cloning of heat resistance genes in garlic and for the analysis of heat resistance mechanisms.

Copper-Graphene Composite (CGC) Conductors: Synthesis, Microstructure, and Electrical Performance.

Improving the electrical performance of copper, the most widely used electrical conductor in the world is of vital importance to the progress of key technologies, including electric vehicles, portable devices, renewable energy, and power grids. Copper-graphene composite (CGC) stands out as the most promising candidate for high-performance electrical conductor applications. This can be attributed to the superior properties of graphene fillers embedded in CGC, including excellent electrical and thermal conductivity, corrosion resistance, and high mechanical strength. This review highlights the recent progress of CGC conductors, including their fabrication processes, electrical performances, mechanisms of copper-graphene interplay, and potential applications.

Superspreading Surface with Hierarchical Porous Structure for Highly Efficient Vapor-Liquid Phase Change Heat Dissipation.

Superspreading surfaces with excellent water transport efficiency are highly desirable for addressing thermal failures through the liquid-vapor phase change of water in electronics thermal management applications. However, the trade-off between capillary pressure and viscous resistance in traditional superspreading surfaces with micro/ nanostructures poses a longstanding challenge in the development of superspreading surfaces with high cooling efficiency in confined spaces. Herein, a heat-treated hierarchical porous enhanced superspreading surface (HTHP) for highly efficient electronic cooling is proposed. Compared with the single porous structures in nanograss, nanosheets, and copper foam, HTHP with hierarchical honeycomb pores effectively resolves the trade-off effect by introducing large vertical through-pores to reduce viscous resistance, and connected small pores to provide sufficient capillary pressure synergistically. HTHP exhibits excellent capillary performance in both horizontal spreading and vertical rising. Despite a thickness of only 0.33mm, the as-prepared ultrathin vapor chamber (UTVC) fabricated to exploit the superior capillary performance of HTHP achieved effective heat dissipation with outstanding thermal conductivity (12121 Wm-1K-1), and low thermal resistance (0.1 KW-1) at a power of 5W. This regulation strategy based on hierarchical honeycomb porous structures is expected to promote the development of high-performance superspreading surfaces with a wide range of applications in thermal management.

Highly flexible and temperature-tolerant phase change devices for dual-band camouflage

Here, we have developed a more temperature-tolerant emitter with a gradient emittance, which can enable adaptation to changing environmental conditions. Such a thermal emitter is mainly constructed by multilayered films composed of nitrogen (N)-doped Ge2Sb2Te5 (N-GST) and an underlying metal film. The proposed device not only possesses special wavelength selectivity in the middle infrared range but can also dynamically adjust average emissivity (from 0.13 to 0.83) through the degree of crystallization. Besides, N doping can elevate the phase transition temperature of GST and enhance its thermal resistance, which renders it particularly well-suited for applications in higher temperature environments than pure GST. This emitter also shows strong adhesion capability and high flexibility against bending, enabling more practical and widespread situations. By using a multi-layer structure, we combined the more temperature-tolerant and dynamically modulating N-GST emitter with an optical thin film, successfully achieving dual camouflage for both infrared and visible light. The element doping technology and multi-layer stacking approach presented in this research will provide valuable insight for the development of dynamic emissive materials in multi-spectral camouflage scenarios.

Synergistic effect of multifunctional POSS and carbon nanotubes on mechanical properties and thermal stability of silicone rubber composites

AbstractThe over‐loading of heat‐resistant fillers in silicone rubber creates a contradiction between heat resistance and mechanical properties, thus greatly limiting the durability of silicone rubber products in cutting‐edge applications and complex scenarios. To address this issue, silicone rubber was filled with octavinyl polyhedral oligomeric silsesquioxane (POSS) and carbon nanotubes (CNT) and crosslinked with 2,5‐dimethyl‐2,5‐di(tert‐butylperoxy)hexane (DBPMH) in an attempt to obtain composites with excellent mechanical properties and great thermal stability. Optical microscopy and X‐ray diffraction analyses revealed the size of POSS crystals decreased and the characteristic peaks disappeared after the peroxide crosslinked the polymer at elevated temperature. Specifically, silicone rubber composite filled with 0.1 phr POSS and 1.0 phr CNT exhibited a tensile strength of 10.2 MPa and elongation at a break of 450%. Further, the strength and elongation could be kept after thermo‐oxidative aging at 250°C for 32 h. Thermogravimetric analysis results demonstrate that the addition of POSS and CNT into silicone rubber exhibits a synergistic effect, markedly improving the thermal stability of the material. This method provides a valuable reference for manufacturing silicone rubber products that possess both excellent mechanical properties and high thermal stability under extreme working conditions.Highlights A novel silicone rubber composite with excellent mechanical properties and thermal stability was prepared. A small amount of octavinyl polyhedral oligomeric silsesquioxane (POSS) and carbon nanotubes exhibited a synergistic effect to improve thermal stability. The dependence of the morphological evolution of POSS crystals in SR on the 2,5‐dimethyl‐2,5‐di(tert‐butylperoxy)hexane and temperature was studied.

Durability of metal oxide nanostructures synthesized by hot water treatment

AbstractMetal oxide nanostructures (MONSTRs) have become popular in various fields. This study investigates the durability of MONSTRs synthesized through hot water treatment (HWT) using copper, aluminum, and zinc as the source metals of choice. The physical durability tests include pressure, scratch, and scotch tape adhesion tests, and chemical durability tests such as corrosion resistance tests, heat resistance, and solar exposure tests. Results showed that MONSTRs synthesized from HWT are highly durable under the tested conditions except for NaOH and HCl immersion tests for copper oxide and zinc oxide. The study concluded that HWT is a sustainable synthesis method for MONSTRs. Graphical Abstract

Optimizing Processing Parameters for NR/EBC Thermoplastic Vulcanizates: A Comprehensive Full Factorial Design of Experiments (DOE) Strategy

Abstract: This research explores the development of thermoplastic vulcanizate (TPV) blends derived from natural rubber (NR) and ethylene–butene copolymer (EBC) using a specific blend ratio and melt mixing technique. A comprehensive full factorial design of experiments (DOE) methodology is employed to optimize the processing parameters. TPVs are produced through dynamic vulcanization, combining rubber crosslinking and melt blending within a thermoplastic matrix under high temperatures and shear. The physico-mechanical properties of these TPVs are then analyzed. The objective is to enhance their mechanical performance by assessing the influence of blend ratio, mixing temperature, rotor speed, and mixing time on crucial properties, including tensile strength, elongation at break, compression set, tear strength, and hardness. Analysis of variance (ANOVA) identifies the optimal processing conditions that significantly improve material performance. Validation is achieved through atomic force microscopy (AFM), confirming the phase-separated structure and, thus, the success of dynamic vulcanization. Rubber process analyzer (RPA) and dynamic mechanical analyzer (DMA) assessments provide insights into the viscoelastic behavior and dynamic mechanical responses. Deconvolution analysis of temperature-dependent tan δ peaks reveals intricate microstructural interactions influencing the glass transition temperature (Tg). The optimized TPVs exhibit enhanced stiffness and effective energy dissipation capabilities across a wide temperature range, making them suitable for applications demanding thermal and mechanical load resistance. This study underscores the pivotal role of precise processing control in tailoring the properties of NR/EBC TPVs for specialized industrial uses. It highlights the indispensable contribution of the DOE methodology to TPV optimization, advancing material science and engineering, particularly for industries requiring robust and flexible materials.

Energy-based devices and hyaluronic acid filler, polymer filler, and threads: Cadaveric study.

The objective of this experiment was to investigate the thermal effects on hyaluronic acid fillers, PCL fillers, and PDO threads when exposed to controlled heat. This study aims to provide insights into how these materials respond to thermal energy, which is crucial for safe and effective cosmetic procedures involving combined modalities. Cadaveric tissue was utilized to simulate clinical conditions. Hyaluronic acid fillers were injected at approximately 1 mm and 5 mm thicknesses, with variations in G' value (high and low). PCL fillers were similarly injected in 1 mm and 5 mm thicknesses. PDO threads were also inserted. All materials were injected at a depth of 2 cm. A thermometer was used to measure heat penetration, and a multi-wavelength laser was applied to the tissue. The temperature was maintained at 60°C for 5 min to assess whether heat penetrated more than 3 cm in thickness. Observations were made regarding the heat distribution and any physical changes in the fillers and threads. In thick layers, heat accumulated above the PCL filler without penetrating deeper layers. In thin layers, heat penetration was observed. For the HA fillers, heat energy was not blocked, regardless of the G' value or thickness. For the threads, no significant heat blockage effect was observed. For all materials, no visual changes were detected in any of the materials due to temperature exposure. The findings suggest that the thickness and composition of fillers significantly influence heat penetration. Thick PCL fillers act as a thermal barrier, whereas thin PCL fillers allow deeper heat penetration. Hyaluronic acid fillers do not impede heat transfer, regardless of their physical properties. PDO threads do not exhibit any notable thermal resistance. These insights are essential for optimizing the safety and efficacy of combined filler and energy-based device treatments in esthetic medicine.

Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components

Purpose This paper aims to investigate the influence of composite solder joint preparation on the thermal properties of metal-oxide-semiconductor field-effect transistors (MOSFETs) and the mechanical strength of the soldered joint. Design/methodology/approach Reinforced composite solder joints with the addition of titanium oxide nanopowder (TiO2) were prepared. The reference alloy was Sn99Ag0.3Cu0.7. Reinforced joints differed in the weight percentage of TiO2, ranging from 0.125 to 1.0 Wt.%. Two types of components were used for the tests. The resistor in the 0805 package was used for mechanical strength tests, where the component was soldered to the FR4 substrate. For thermal parameters measurements, a power element MOSFET in a TO-263 package was used, which was soldered to a metal core printed circuit board (PCB) substrate. Components were soldered in batch IR oven. Findings Shear tests showed that the addition of titanium oxide does not significantly increase the resistance of the solder joint to mechanical damage. Titanium oxide addition was shown to not considerably influence the soldered joint’s mechanical strength compared to reference samples when soldered in batch ovens. Thermal resistance Rthj-a of MOSFETs depends on TiO2 concentration in the composite solder joint reaching the minimum Rthj at 0.25 Wt.% of TiO2. Research limitations/implications Mechanical strength: TiO2 reinforcement shows minimal impact on mechanical strength, suggesting altered liquidus temperature and microstructure, requiring further investigation. Thermal performance: thermal parameters vary with TiO2 concentration, with optimal performance at 0.25 Wt.%. Experimental validation is crucial for practical application. Experimental confirmation: validation of optimal concentrations is essential for accurate assessment and real-world application. Soldering method influence: batch oven soldering may affect mechanical strength, necessitating exploration of alternative methods. Thermal vs mechanical enhancement: while TiO2 does not notably enhance mechanical strength, it improves thermal properties, highlighting the need for balanced design in power semiconductor assembly. Practical implications Incorporating TiO2 enhances thermal properties in power semiconductor assembly. Optimal concentration balancing thermal performance and mechanical strength must be determined experimentally. Batch oven soldering may influence mechanical strength, requiring evaluation of alternative techniques. TiO2 composite solder joints offer promise in power electronics for efficient heat dissipation. Microstructural analysis can optimize solder joint design and performance. Rigorous quality control during soldering ensures consistent thermal performance and mitigates negative effects on mechanical strength. Social implications The integration of TiO2 reinforcement in solder joints impacts thermal properties crucial for power semiconductor assembly. However, its influence on mechanical strength is limited, potentially affecting product reliability. Understanding these effects necessitates collaborative efforts between researchers and industry stakeholders to develop robust soldering techniques. Ensuring optimal TiO2 concentration through experimental validation is essential to maintain product integrity and safety standards. Additionally, dissemination of research findings and best practices can empower manufacturers to make informed decisions, fostering innovation and sustainability in electronic manufacturing processes. Ultimately, addressing these social implications promotes technological advancement while prioritizing consumer trust and product quality in the electronics industry. Originality/value The research shows the importance of the soldering technology used to assemble MOSFET devices.

Lossless Phonon Transition Through GaN‐Diamond and Si‐Diamond Interfaces

AbstractAdvancing Silicon (Si) technology beyond Moore's law through 3D architectures requires highly efficient heat management methods compatible with foundry processes. While continued increases in transistor density can be achieved through 3D architectures, self‐heating in the upper tiers degrades the performance. Self‐heating is a critical problem for high‐power, high‐frequency, wide bandgap, and ultra‐wide bandgap devices as well. Diamond, known for its exceptional thermal conductivity, offers a viable solution in both these cases. Since thermal boundary resistance (between the channel/junction and diamond plays a crucial role in overall thermal resistance, this study investigates various dielectrics for interface engineering, such as Silicon dioxide (SiO2), amorphous‐ Silicon Carbide (a‐SiC), and Silicon Nitride (SiNx), to make a phonon bridge at gallium nitride (GaN)‐diamond and Si‐diamond interfaces. The a‐SiC interlayer reduces diamond/GaN (<5 m2K per GW) and diamond/Si (<2 m2K per GW) thermal boundary resistances by linking low‐ and high‐frequency phonons, boosting phonon transport through the interface. Engineered interfaces enhance heat spreading from the channel/junction and rule out premature failure.

Synthesis of Responsive Membranes for Water Recovery through Desalination of Saline Industrial Effluents

Polysulfone (PSF) and smart polymers (SRPs)—including polyacrylic acid (AAc), poly N-isopropylacrylamide (NIPA), and sulfonated poly(1,4-phenylene ether-ether-sulfone) (SPEES)—were used in the synthesis of responsive membranes (PSF-SRP) for application in sustainable desalination processes involving food industry effluents for water recovery and recycling. With the inclusion of SRPs, PSF-SRP membranes showed different characteristics when compared to the PSF membrane. AAc caused fibers to occur in the surface structure, increasing the MWCO of the PSF membrane, whereas NIPA and SPEES diminished the MWCO, resulting in ultrafiltration and nanofiltration membranes. Furthermore, NIPA and SPEES provided high mechanical and thermal resistance when incorporated into the PSF membrane. The performance of the membranes also showed important changes. In comparison with only PSF, PSF-SPEES and PSF-NIPA increased the water flux and salt rejection percentage by 20–30%. In addition, the highest membrane fouling resistance was observed with PSF-NIPA, while PSF-AAc and PSF-NIPA-AAc presented the lowest resistances. Therefore, PSF-NIPA and PSF-SPEES resulted in membrane improvement, including stimuli-responsive properties, allowing for effective saline effluent treatment.

A novel contact thermal resistance model for heat transfer in granular systems: Leveraging the force-heat analogy

A novel particle-to-particle contact thermal resistance model is proposed in this study, based on the concept of analogy between force and heat transfer. The distribution of heat flux on the contact surface is assumed to resemble the distribution of stress, eliminating the issue of temperature singularity at the contact edge. The model is validated against existing theories and experiments, showing good agreement. The combined use of the model and the thermal discrete element method is applied to analyze temperature and effective thermal conductivity distributions in a pebble bed within a high-temperature test unit. The average effective thermal conductivity obtained from thermal conduction is found to be 2.99 and 2.61 W/(m·K) for power inputs of 20 kW and 82 kW, respectively. An increase in the outer wall temperature from 200 °C to 1000 °C results in an approximate 20 % increase in the effective thermal diffusivity.

Influence of Water-Solid Interaction and Surface Charge on Thermal Resistance Length

Influence of Water-Solid Interaction and Surface Charge on Thermal Resistance Length

Bio‐based semi‐aromatic waterborne PIEK‐C sizing agent to construct a robust interface for CF/PEEK composites

AbstractDespite the impressing advances on sizing agents for CF/PEEK composites, the aromatic backbone of the polymer precursors utilized in the vast majority of reports compromises the dispersity and ductility of the slurry, subsequently resulting in inferior overall performance of the composites. Meanwhile, most resins employed for sizing agents in existing reports are based on petroleum resources. Herein, a bio‐based waterborne sizing agent utilizing semi‐aromatic poly ether ketones (PIEK‐C) derived from isosorbide and phenolphthalein has been disclosed, featured by its salutary dispersity, exceptional thermal stability, higher glass transition temperatures, and broader applicability. Due to the structural similarity between the sizing and resin matrix, the protocol endowed CF/PEEK composites with ameliorated overall performance, addressing issues related to inadequate adhesion of CF with PEEK resin, as well as environmental pollution commonly associated with existing commercial epoxy and solvent‐based sizing agents. The Tg and T5% of PIEK‐C‐5050 were 205.08 and 427.16°C, respectively. The particle size range of the PIEK‐C sizing agents spanned from 66.32 to 84.63 nm. The flexural strength and interlaminar shear strength of the composites experienced a respective 993.92 MPa (30.73%) and 83.32 MPa (36.97%) increase compared to untreated CF/PEEK composites following sizing treatment with PIEK‐C‐5050, underscoring expedient intermolecular interactions based on comparable solubility and π‐π stacking effects between the PEEK and PIEK‐C components. This study introduced an efficient and eco‐friendly approach to enhance the interfacial properties of CF/PEEK composites.Highlights PIEK‐C resin is employed for the first time to prepare carbon fiber sizing agents. The PIEK‐C sizing agent significantly fortified the surface energy and wettability of carbon fibers. The CF/PEEK composites after treatment with PIEK‐C sizing agent showed excellent heat resistance. The ILSS and bending strength of the composites were significantly increased by 36.97% and 30.73%, respectively.

Effects of Wind Speed and Heat Flux on De-Icing Characteristics of Wind Turbine Blade Airfoil Surface

The icing on wind turbines reduces their aerodynamic performance and can cause other safety issues. Accordingly, in this paper, the de-icing characteristics of a wind turbine blade airfoil under different conditions are investigated using numerical simulation. The findings indicate that when the de-icing time is 10 s, the peak ice thickness on the leading edge of the airfoil surface decreases from 0.28 mm to 0.068 mm and from 0.77 mm to 0.45 mm at low (5 m/s) and high (15 m/s) wind speeds, respectively. This is due to the fact that the ice melting rate is much greater than the icing rate at low wind speeds, while the icing rate increases at high wind speeds. When the de-icing time is 20 s, ice accretion on the leading edge of the airfoil is completely melted. At a low heat flux (8000 W/m2) and high heat flux (12,000 W/m2), the peak ice thickness decreases by 31.2% and 64.9%, respectively. With an increase in de-icing time and heat flux, the peak thickness of runback ice increases. This is due to an increase in runback ice as a result of more ice melting on the leading edge of the airfoil. The surface temperature in the ice-free area is significantly higher than that in the ice-melting area, due to high thermal resistance in the ice-free area. This study will provide guidance for the thermal distribution and coating layout of a wind turbine blade airfoil to make the anti-/de-icing technology more efficient and energy-saving.

Ti4+ doped high-entropy fluorite oxide ceramics ((ZrHfCeYEr)(1-x)/5Tix)O2-δ: Thermal, mechanical and cyclic thermal shock resistance properties studies

High-entropy fluorite oxide ceramics are promising candidates for spacecraft applications due to their excellent high-temperature thermal-mechanical properties. In this work, four kinds of high-entropy fluorite oxide ceramics ((ZrHfCeYEr)(1-x)/5Tix)O2-δ (HEFOs, x = 0, 0.025, 0.05, 0.075) with different Ti4+ contents were successfully synthesized through solid-state reaction method with conventional sintering. They all exhibited phase stability when annealed at 1500 ℃ for 20 h. When the content of Ti4+ was increased to x = 0.075, the thermal conductivity reduced to1.34 W·m−1·K−1 at 1100 ℃, and the hardness and elastic modulus increased to 14.01 GPa and 205.70 GPa, respectively. Furthermore, the cyclic thermal shock resistance of HEFOs at different temperatures was investigated. The initial flexural strength reached 219.03 MPa when the content of Ti4+ was increased to x = 0.075. After 60 thermal shock cycles at 1200 ℃ and 1500 ℃, the residual strength ratios were 97.56 % and 83.36 %, respectively. The results of this study establish the foundation for future applications of high-entropy fluorite oxide ceramics in spacecraft hot-end components.

Molecular dynamics study on the thermal properties of DGEBA/DETA/Ag/SWCNT-Ag composite materials.

Traditional conductive adhesives based on epoxy resin system often encounter problems such as high brittleness and low heat resistance. Therefore, it is particularly important to improve the thermal and mechanical properties of the conductive adhesive. In this study, the effects of SWCNT-Ag and SWCNT fillers on the thermal properties of DGEBA/DETA/Ag conductive adhesive system were studied by using molecular dynamics to construct different cross-linking models. The final results show that the addition of SWCNT and SWCNT-Ag can significantly improve the thermal properties of the conductive adhesive. However, the nanosilver particles on the surface of SWCNT-Ag act as a bridge for the connection between SWCNT and Ag in the conductive adhesive. Therefore, SWCNT-Ag has a more positive impact on the thermal properties of DGEBA/DETA/Ag conductive adhesive system. In this paper, the influence of SWCNT-Ag on the thermal properties of traditional DGEBA/DETA/Ag conductive adhesive system was studied by using Materials Studio software. The volume shrinkage, glass transition temperature, thermal expansion coefficient, and thermal conductivity of the material were calculated based on COMPASS force field. The thermal conductivity is calculated by using reverse non-equilibrium molecular dynamics method. Finally, it is found that SWCNT-Ag has a positive effect on the thermal properties of the conductive adhesive system by comparing several groups of calculation data.

Controlled Structural Relaxation of Aramid Nanofibers for Superstretchable Polymer Fibers with High Toughness and Heat Resistance.

Polymer fibers that combine high toughness and heat resistance are hard to achieve, which, however, hold tremendous promise in demanding applications such as aerospace and military. This prohibitive design task exists due to the opposing property dependencies on chain dynamics because traditional heat-resistant materials with rigid molecular structures typically lack the mechanism of energy dissipation. Aramid nanofibers have received great attention as high-performance nanoscale building units due to their intriguing mechanical and thermal properties, but their distinct structural features are yet to be fully captured. We show that aramid nanofibers form nanoscale crimps during the removal of water, which primarily resides at the defect planes of pleated sheets, where the folding can occur. The precise control of such a structural relaxation can be realized by exerting axial loadings on hydrogel fibers, which allows the emergence of aramid fibers with varying angles of crimps. These crimped fibers integrate high toughness with heat resistance, thanks to the extensible nature of nanoscale crimps with rigid molecular structures of poly(p-phenylene terephthalamide), promising as a template for stable stretchable electronics. The tensile strength/modulus (392-944 MPa/11-29 GPa), stretchability (25-163%), and toughness (154-445 MJ/cm3) are achieved according to the degree of crimping. Intriguingly, a toughness of around 430 MJ/m3 can be maintained after calcination below the relaxation temperature (259 °C) for 50 h. Even after calcination at 300 °C for 10 h, a toughness of 310 MJ/m3 is kept, outperforming existing polymer materials. Our multiscale design strategy based on water-bearing aramid nanofibers provides a potent pathway for tackling the challenge for achieving conflicting property combinations.

Geopolymers for Space Applications

Geopolymers are cementitious materials with exceptional mechanical and physical properties, making them suitable for aerospace applications. Considering their excellent performance, the present investigation aims to develop geopolymers with designed physical properties to address some issues in the aerospace industry. In this sense, the influence of the alkaline activator on the final properties was evaluated. For the development of the geopolymers, sodium hydroxide and sodium metasilicate solutions were preparedto obtain the alkaline activator. The synthesis process also consisted of a mixing stage using a mixer to obtain a homogenous paste. After mixing, the curing process consisted of a first thermal treatment at 60 °C for 4 h to evaporate the excess water, avoid excessive contraction, and promote strength at early ages. Subsequently, the geopolymers were left at rest for 28 days until the final properties were achieved. The influence of the solid-to-liquidratio (S/L) on the microstructure of the geopolymers was evaluated. For this purpose, X-ray fluorescence spectrometry, X-ray diffraction, and infrared spectrometry analyses were performed. The results show that the content of the alkaline activator promotes variations inthe presence of different crystalline phases, which is more noticeable as the S/L ratio increases. Likewise, the infrared spectra display peaks at different wavelengths regarding the variations in elemental composition, which are more evident with the changes in the S/L ratio. In addition, physical studies, such as thermal conductivity and resistance to gamma radiation were conducted for different geopolymer compositions. The results indicate that changes in properties are not too sensitive to compositional variations, although slight modifications exist. Finally, these studies are significant as aerospace-focused materials are directly exposed to this kind of phenomena. The designed geopolymers have to be able to resist and maintain their properties through exposure to any energy.

On the stabilization mechanisms of a diffusion edge flame in a cross-flow configuration

This work focuses on the stabilization and combustion efficiency of a gaseous diffusion flame at the lip of a hole where pure methane is injected into a crossflow of air. This configuration mimics the flame base of many flares, used to burn excess gas in the oil and gas industry. In a flare, the flame base, near the lips of the fuel jet duct, is a critical zone where the flame attaches or not. When the cross flow air speed is too high or the torch lips too cold, the flame cannot attach to the lips so that methane can leak below the lifted flame front near the injector lip and avoid combustion totally. This cannot be accepted for climate change since unburnt fuel like methane has a radiation forcing larger than 20 times the value reached for CO2. Combustion efficiencies close to unity are expected for the flares of the future. Two main parameters control the anchoring of the diffusion flame on a thin lip: the air cross-flow velocity uair and the temperature of the lip or equivalently its cooling, measured here by a thermal resistance Rth. Dimensional analysis is used to construct two reduced parameters controlling stabilization and simulations are performed to populate this diagram. The resulting diagram shows how uair and Rth control flame anchoring. Large values of Rth (adiabatic lips) lead to high lips temperatures and to flames which can resist high air cross-flow velocities. For low values of Rth (cold lips), the flame lifts off for smaller values of uair. The simulations also reveal that triple flames are the flame elements controlling the flame anchoring and how these triple flames interact with the lips forming a flame topology called RS (Rim Stabilized) edge flame.