Thermal Management Of Electronic Packages Research Articles

Improved hollow cathode magnetron deposition for producing high thermal conductivity graphite_copper composite

High thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. State-of-the-art heat sinks have thermal conductivities, K, generally less than 180 W mK−1, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology for producing graphite fiberreinforced copper (Cf/Cu) composite has been developed that produces thermal conductivities up to 454 W mK−1 utilizing a K= 640 W mK−1 fiber reinforcement (with a potential for 800 W mK−1 when utilizing a K=1100 W mK−1 P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80%. In heat sink applications, where the electrical conductivity of the graphite fiber-reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity (ca. 1100 W mK−1) and acts as a heat spreader.

High Thermal Conductivity Graphite Copper Composites with Diamond Coatings for Thermal Management Packaging Applications

ABSTRACTHigh thermal conductivity heat sinks for thermal management in electronic packaging is enabling to a variety of advanced electronic applications. Heat sinks in industrial semiconductor application have thermal conductivities generally less than 180 W/mK, and frequently have large expansion mismatch with chips such as silicon and gallium arsenide. A unique technology of producing graphite fiber reinforced copper (Cf/Cu) composite has been developed that produced thermal conductivities up to 454 W/mK utilizing a K=640 W/mK fiber reinforcement (with a potential for 800 W/mK when utilizing a K = 1100 W/mK P130 fiber) and thermal expansion that can be matched to chip materials. The process consists of utilizing a hollow cathode sputtering process to deposit a bonding layer followed by copper on spread graphite fibers, which are then consolidated into composites with architectures to achieve desired thermal conductivity and thermal expansion. The copper thickness determines graphite fiber loading up to 80 %. In heat sink applications, where the electrical conductivity of the graphite fiber reinforced copper composite is a problem, processing has been developed for applying electrically insulating diamond film, which has high thermal conductivity and acts as a heat spreader.

Thermal Management of Electronic Packages for Space Applications

This paper describes the state of the art for thermal mathematical modeling of electronic packages during transient operation. The methods for calculating thermal contact conductance, view factors, and heat transfer coefficients are reviewed, and an algorithm for computer software is provided. Monte Carlo treatment of the data uncertainties is explained. The computer algorithm uniquely incorporates the subroutines for calculating the thermal contact conductance, absorption factor, and statistical representation of the thermal parameters for Monte Carlo analysis.

Thermal management of electronic packages: R.E. Simons Solid St. Technol. 131 (October 1983)

Thermal management of electronic packages: R.E. Simons Solid St. Technol. 131 (October 1983)

Thermal management of electronic packages : R. E. Simons. Solid St. Technol. 131 (October 1983)

La demande de circuits a plus haute densite, de puissance plus importante et de fiabilite amelioree contraint a une reduction continue des resistances thermiques internes et externes des conditionnements. D'ou la necessite d'une participation de l'ingenieur thermicien a la conception du conditionnement depuis le tout debut