Abstract
This paper describes the state of the art for thermal mathematical modeling of electronic packages during transient operation. The methods for calculating thermal contact conductance, view factors, and heat transfer coefficients are reviewed, and an algorithm for computer software is provided. Monte Carlo treatment of the data uncertainties is explained. The computer algorithm uniquely incorporates the subroutines for calculating the thermal contact conductance, absorption factor, and statistical representation of the thermal parameters for Monte Carlo analysis.
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