Thermal Management Of Electronic Devices Research Articles

Development of copper-boron nitride core-shell structured fillers and surface treatment for thermally conductive composites

Core-shell structured copper-boron nitride (Cu@BN) spherical fillers were synthesized to fabricate thermally conductive composites. To enhance the interaction between the fillers and the matrix, polysilazane (PSZ) was coated on the surface of the filler. The resultant composite exhibited remarkable characteristics, including a substantial tensile strength of 32.36MPa, excellent electrical insulation properties, and impressive thermal conductivity of 3.47W/mK. When applied in a light-emitting diode (LED) application, the composite effectively managed heat, reducing the operating temperature by 34 °C. The epoxy/PSZ-Cu@BN composites hold great promise for improving thermal management in electronic devices.

Capillary compression induced outstanding n-type thermoelectric power factor in CNT films towards intelligent temperature controller

One-dimensional carbon nanotubes are promising candidates for thermoelectrics because of their excellent electrical and mechanical properties. However, the large n-type power factor remains elusive in macroscopic carbon nanotubes films. Herein, we report an outstanding n-type power factor of 6.75 mW m−1 K−2 for macroscopic carbon nanotubes films with high electrical and thermal conductivity. A high-power density curl-able thermoelectric generator is fabricated with the obtained carbon nanotubes films, which exhibits a high normalized power output density of 2.75 W m−1 at a temperature difference of 85 K. The value is higher than that of previously reported flexible all-inorganic thermoelectric generators (<0.3 W m−1). An intelligent temperature controller with automated temperature-controlling ability is fabricated by assembling these thermoelectric generators, which demonstrates the potential application of the carbon nanotubes films in automated thermal management of electronic devices where requires a large thermoelectric power factor and a large thermal conductivity simultaneously.

Experimental and numerical investigations on the intermittent heat transfer performance of phase change material (PCM)-based heat sink with triply periodic minimal surfaces (TPMS)

The excessive heat generated during the operation of electronic components leads to significant temperature increases, posing a significant risk to their service life. For the problem of efficient thermal management of electronic devices in confined spaces experiencing high heat flow, a scheme using triply periodic minimal surfaces and a phase change material-based active–passive cooling heat sink is proposed to control the temperature of electronic equipment. The apparent heat capacity method is employed to simulate the intermittent process of the phase change material-based heat sink. The optimization based on Box-Behnken Design and Nondominated Sorting Genetic Algorithm II is analyzed to obtain an improved triply periodic minimal surface structure. The effect of thermal performance (including base temperature, liquid fraction, and Grashof number) of an intermittent heat sink based on an improved structure is discussed. Visualization and temperature testing platforms are established. Through visualization experiments, the internal temperature and liquid fraction distribution of the heat sink are obtained, and the simulation results are in good agreement with the test results. The results show that the base temperature, liquid fraction, and Grashof number achieve a steady periodic variation during the intermittent process. Specifically, the base temperature remains stable in the range of 314 K to 340 K, the liquid fraction stabilizes between 0.8 and 1.0, and the Grashof number stabilizes between 100 and 1000. At heating power of 30 W or below, the base temperature of the heat sink exhibits a steady periodic variation. At the heating power of 40 W, the maximum base temperature of the heat sink exceeds 370 K.

Analysis of nanofluid and nano-enhanced phase change material (NEPCM) in a heat exchanger for thermal management of electronic devices

Thermal management of high-power electronic devices is essential to control their enormous heat generation, which is usually the cause of their damage. Scientists have found several solutions for cooling electronic devices, but a counter-current heat exchanger has never been used. In the same context, numerical research on the thermal performance of a proposed new cooling system based on a counterflow heat exchanger combined with a heat sink is conducted in this article. Cu-H2O nanofluid, n-Docosane nano-enhanced phase change material, and water were selected as coolants, and they are compared in terms of temperatures, Nusselt number, heat transfer coefficient, pressure drop, friction factor, and performance enhancement coefficient using a two-phase mixture transient model based on Finite Volume method. Two cases of the proposed system are studied to find the optimal distance between heat exchanger pipes and the hot surface. Results are compared with previous experimental data to demonstrate that the system under study is accurate. They revealed that integrating the heat exchanger with the heat sink using Cu-H2O nf as a coolant maintained the hot surface temperature below 308 K with improved heat transfer by 31.22% compared to water. 0.25 mm is the optimum distance to find the highest thermal performance of the cooling system.

Carbon-Enhanced Hydrated Salt Phase Change Materials for Thermal Management Applications.

Inorganic hydrated salt phase change materials (PCMs) hold promise for improving the energy conversion efficiency of thermal systems and facilitating the exploration of renewable thermal energy. Hydrated salts, however, often suffer from low thermal conductivity, supercooling, phase separation, leakage and poor solar absorptance. In recent years, compounding hydrated salts with functional carbon materials has emerged as a promising way to overcome these shortcomings and meet the application demands. This work reviews the recent progress in preparing carbon-enhanced hydrated salt phase change composites for thermal management applications. The intrinsic properties of hydrated salts and their shortcomings are firstly introduced. Then, the advantages of various carbon materials and general approaches for preparing carbon-enhanced hydrated salt PCM composites are briefly described. By introducing representative PCM composites loaded with carbon nanotubes, carbon fibers, graphene oxide, graphene, expanded graphite, biochar, activated carbon and multifunctional carbon, the ways that one-dimensional, two-dimensional, three-dimensional and hybrid carbon materials enhance the comprehensive thermophysical properties of hydrated salts and affect their phase change behavior is systematically discussed. Through analyzing the enhancement effects of different carbon fillers, the rationale for achieving the optimal performance of the PCM composites, including both thermal conductivity and phase change stability, is summarized. Regarding the applications of carbon-enhanced hydrate salt composites, their use for the thermal management of electronic devices, buildings and the human body is highlighted. Finally, research challenges for further improving the overall thermophysical properties of carbon-enhanced hydrated salt PCMs and pushing towards practical applications and potential research directions are discussed. It is expected that this timely review could provide valuable guidelines for the further development of carbon-enhanced hydrated salt composites and stimulate concerted research efforts from diverse communities to promote the widespread applications of high-performance PCM composites.

Thermal conductive enhanced phase change composites with high latent-heat for constant temperature thermal management

Phase change materials (PCMs) can absorb and release heat without the temperature changing to realize the constant temperature thermal management. The low thermal conductivity (K) of PCM molecules leads to slow heat absorbing and releasing. In this study, a polyethylene glycol (PEG) based cross-linked polyurethane network is synthesized to wrap PCMs microcapsules. The composites have a high latent heat (152–164 J g−1) at 38 °C. Carbon fiber (CF) and Al powder with high K is composted to improve the thermal conductivity of the PCMs. After doping with CF, the K increases to two-fold to 0.306 W m−1 K−1. The experimental result reveals that the heat transfer inside the PCMs is improved obviously after doping with CF, which is further verified by a simulation result, and the composites show excellent shape stability and latent heat retention rate (>92 %) under 30 days' cycle test. This thermal conductivity enhanced PCMs composite is also formable which may have the potential applications for the thermal management of electronic devices, such as chips, fast charging, and battery.

Applying machine learning to reveal the microscopic heat transfer mechanism of nanofluids as coolants

Nanofluids are considered as excellent coolants to optimize thermal management of electronic devices, where the nanoparticle morphology and the addition of surfactants can affect the thermal transport performance of nanofluids. Due to the limitations of high economic and computational cost in previous experimental and numerical simulation methods, the design of nanofluids urges for more efficient approaches. In this work, a novel machine learning framework coupled with molecular dynamics methods was proposed to model the multi-component mixing nanofluidic systems and explore the deep heat transfer mechanisms. Multi-input attribute point cloud dataset, dual channel sampling network and multi-nanoscale optimization scheme were used to improve the prediction performance of machine learning. The computational cost of the machine learning method is shortened by 36000 times compared with simulation methods. Moreover, our work can achieve up to 90 % prediction accuracy for surfactant adsorption properties. Furthermore, algorithm optimization strategy can improve the prediction accuracy of nanofluidic heat transfer performance by 40 %. The proposed framework has the potential to shorten the development cycle of nanofluidic design.

Heat Flow Overshooting in Suspended Graphene

ABSTRACT In this work we found that when the hydrodynamic heat conduction in suspended graphene is in the under-damped free oscillation regime the disturbance of heat flux at the boundaries of graphene and the joint action of the initial heat flux and its time change rate can cause the heat flow overshooting which refers to the excess heat flux established in the heat conduction medium when two heat flow wave-fronts meet. The overshooting can make the maximum amplitude of the heat flux more than twice that of the initial heat flux, which poses a great danger to the next high-frequency and high-efficiency electronic devices based on graphene, such as the graphene field-effect transistors. Interestingly, results show that when the scale ratio of graphene with rectangular shape in the heat flow direction to its vertical direction is greater than a certain value, the overshooting caused by the disturbance of the heat flux at the boundaries no longer occurs. For the overshooting induced by the uneven distribution of the initial heat flux and its time change rate, it is shown that if the length in the region with the higher heat flux and time change rate in the direction of heat flow is less than a critical value the overshooting phenomenon can be avoided. These findings provide a new way for thermal management of electronic devices based on graphene.

MXene-modified lemon peel-based composite phase change material with excellent photo-thermal conversion efficiency, thermal storage capacity and thermal conductivity for thermal management of electronic components

The preparation of multifunctional composite phase change materials using green technology to achieve an efficient energy storage and conversion remains an issue of concern. In this paper, a lemon peel-based porous carbon (LPC) composite phase change material (CPCM) was prepared by using polyethylene glycol (PEG) 6000 as a phase change medium and MXene nanosheet-modified carbonized lemon peel as a support carrier. MXene nanosheets were bonded to a lemon peel-based porous carbon skeleton to construct an excellent continuous three-dimensional thermally conductive grid system. What makes it noteworthy is that the presence of MXene nanosheets substantially improves the thermal conductivity (0.66 W/mK) and photo-thermal conversion efficiency (θ = 96.4 %) of MXene-modified lemon peel-based porous carbon/polyethylene glycol composite phase change materials (PEG/LPC@M). It is noteworthy that PEG/LPC@M has remarkable thermal stability and still has high enthalpy after 100 cycles, which further proves the recyclability of PEG/LPC@M and PEG/LPC@M embodies great potential in the field of thermal management of electronic components. In conclusion, a novel multifunctional CPCM was prepared by a simple and green process method in this study, which provides a new idea for waste recycling and reuse, and also has a wide range of applications in thermal management of electronic devices.

Comparative analysis of thermal interface materials for effective thermal management of electronic devices

ABSTRACT Thermal interface materials (TIM) employed to electronic devices enhances interfacial heat dissipation and thermal contact conductance (TCC). This study compares the performance of TIMs (silicon grease, phase change material (PCM) and composite PCM) on a copper-aluminum contact pair under varying range of contact pressure (0.1 to 0.4 MPa) and interface temperature (35 to 65 °C). Composite PCM is prepared by mixing aluminum powder to PCM in different mass concentrations (4, 8 and 25 wt.%). Result shows that addition of aluminum powder > 8 wt.% to PCM reduces its heat storage capacity and delays heat transfer. Moreover, TCC with silicon grease outperforms PCM by 108%, while CPCM (8 wt. %) is 144% more efficient but costlier than others.

Preparation and characterization of eicosane-paraffin/expanded graphite/polyurethane as form-stable composite phase change materials with wide phase change temperature range

Phase change materials (PCMs) with wide phase change temperature range, high latent heat, good thermal conductivity, and shape stability are essential for applications such as solar energy conservation and thermal management of electronic devices. Form-stable composite PCMs (FSCPCMs) with a broad phase change temperature range of 18–65 °C were successfully developed by using a mixture of eicosane and paraffin mixture along with cross-linking polyurethane as PCM, expanded graphite as thermally conductive filler and supporting material. The prepared FSCPCMs demonstrated excellent thermal stability and thermal conductivity with a latent heat up to 142.5 J/g. In conclusion, the synthesized FSCPCMs exhibit promising potential for practical applications in thermal energy storage.

Bubble Interaction and Heat Transfer Characteristics of Microchannel Flow Boiling With Single and Multiple Cavities

Abstract Flow boiling in microchannels can effectively address the challenges of high power density heat dissipation in electronic devices. However, the intricate bubble dynamics during the two-phase flow in microchannel necessitates understanding the characteristics of complex bubble hydrodynamics. In this study, we perform 2D numerical simulations of flow boiling using the Cahn-Hilliard phase-field method for a 200-µm width microchannel with single and multiple cavities in COMSOL Multiphysics (V5.3). The numerical model successfully captures bubble dynamics, encompassing vapor embryo generation, bubble growth, departure, coalescence, sliding, and stable vapor plug formation. The heat transfer mechanism inside the microchannel is dominated by bubble nucleation and thin-film evaporation. Elevated wall superheats in a single nucleation cavity, and increased mass flux facilitates higher bubble departure frequency and heat transfer performance. Temporal pressure fluctuations are observed inside microchannels in multiple cavities due to bubble coalescence, departure, and subsequent nucleation. Increasing the nucleating cavities from 2 to 5 within the microchannel while maintaining consistent cavity spacing of 100 µm has resulted in nearly 32% enhancement in heat transfer performance. This study offers valuable findings that can help improve the thermal management of electronic devices.

Highly thermally conductive composite films by the rational assembly of aramid nanofibers with low-dimensional nanofillers

Highly efficient thermal management of electronic devices has grown in significance with the burgeoning of semiconductor technology and 5th generation communication. It is urgently desired to rationally construct highly thermally conductive composite films for enhancing the performance, service life and operation reliability of electronic equipment. Aramid nanofibers (ANFs), as one of the most promising building blocks to fabricate high-performance and multifunctional composite films, have attracted wide attention of researchers over the past few years due to its impressive mechanical performances, excellent electric insulation, and outstanding thermal stability. Especially, the rational assembly of ANFs with low-dimensional thermally conductive nanofillers exhibits significant opportunity for developing highly thermally conductive flexible composite films. However, there is no specialized review to systematically summarize the research advances and prospective challenges of this area until now. Herein, the preparation strategies, structure and properties, as well as the potential applications of various ANFs-based thermally conductive composite films with different low-dimensional nanofillers are highlighted. Finally, possible challenges and opportunities for ANFs-based thermally conductive composite films are envisioned. This brief review delivers the readers an in-depth understanding of the thermal conduction performances of ANFs-based composite films, which may give meaningful enlightenment for designing advanced thermal management materials and ANFs-based functional composites.

Enhancement of thermal conductivity and insulation of silicone thermal interface material through surface modification and synergistic effects of nanofillers for thermal management of electronic devices

Thermal interface materials (TIMs) play an irreplaceable role in highly integrated microelectronic devices. In this work, the addition of acidified carbon nanotubes modified by 3-aminopropyl triethoxysilane (KH550) had an effective enhancement to the thermal conductivity, thermal stability, and electrical insulation performance of silicone grease. On this basis, multi-filled silicone grease composites with better thermal conductivity and electrical insulation were prepared by introducing zinc oxide (ZnO) and Graphene nanoflakes (GNFs). The thermal conductivity of silicone grease achieved 1.438 W m−1 K−1, while the volume resistivity still exceeded 1013 Ω·cm. Additionally, the study explored the impact of varying filler parameters, temperature, and contact pressure on the interface thermal contact resistance of silicone grease. The best performance silicone grease applied to the cooling of the high-power LED exhibited excellent heat dissipation. This work presented a reference for the design and development of low cost, high performance TIMs.

Optimization of heat dissipation in novel design wavy channel heat sinks for better performance

This research presents a novel design in wavy channel heat sinks, crucial for the thermal management of electronic devices. The design features secondary branches with progressively decreasing spacing and a reduced channel height, enhancing flow mixing and uniform temperature distribution. The novelty of this research lies in the integration of a wavy channel, an innovative secondary branch pattern, lowered channel height, and optimized branch angles and widths. The study examines the impact of the design parameters across flow rates (0.004–0.014 kg/s) under a constant heat flux of 5.17 W/cm2. Key findings reveal that a 90-degree branch angle with a 1 mm width achieves a 5.27% temperature reduction compared to the basic wavy channel heat sinks, reducing the surface temperature by 1.4 °C over 45-degree configurations. Additionally, 45-degree and 90-degree configurations with a 1.5 mm width show pressure drop increases of 12.13% and 20.60%, respectively. Using factorial designs and response optimization, the study identifies an optimal configuration at a 90-degree angle and 2 mm width for a flow rate of 0.008 kg/s, balancing heat transfer enhancement, and hydraulic performance. This design marks a significant advancement in efficient and effective cooling technologies for electronic devices.

Anisotropy Reversal of Thermal Conductivity in Silicon Nanowire Networks Driven by Quasi-Ballistic Phonon Transport.

Nanostructured semiconductors promise functional thermal management for microelectronics and thermoelectrics through a rich design capability. However, experimental studies on anisotropic in-plane thermal conduction remain limited, despite the demand for directional heat dissipation. Here, inspired by an oriental wave pattern, a periodic network of bent wires, we investigate anisotropic in-plane thermal conduction in nanoscale silicon phononic crystals with the thermally dead volume. We observed the anisotropy reversal of the material thermal conductivity from 1.2 at 300 K to 0.8 at 4 K, with the reversal temperature of 80 K mediated by the transition from a diffusive to a quasi-ballistic regime. Our Monte Carlo simulations revealed that the backflow of the directional phonons induces the anisotropy reversal, showing that the quasi-ballistic phonon transport introduces preferential thermal conduction channels with anomalous temperature dependence. Accordingly, the anisotropy of the effective thermal conductivity varied from 2.7 to 5.0 in the range of 4-300 K, indicating an anisotropic heat manipulation capability. Our findings demonstrate that the design of nanowire networks enables the directional thermal management of electronic devices.

A polyurethane solid–solid phase change material for flexible use in thermal management

Phase change materials (PCMs) have received great attention in thermal management of electronic devices due to their high energy storage density and no need for additional energy supply. Yet the leakage problem after phase change limits their application greatly. In this paper, the block copolymerization was used to prepare a novel solid–solid phase change material (SSPCM) with a melting enthalpy of 90.26 J/g, starting pyrolysis at a temperature of more than 300 °C, and its physicochemical and thermal properties remained basically unchanged after 100 heating/cooling cycles. Notably, this SSPCM has excellent shape stability and can be pressed into phase change film with flexibility, thermally induced self-healing capability and recyclability. Finally, we innovatively combined this SSPCM, copper foam (CF), and polyimide tape (PI) to obtain a composite phase change material (CPCM) with both high thermal conductivity (1.1994 W/m·K) and high electrical insulating properties. Thermal management experiment shows that this CPCM has good thermal management performance and can significantly reduce the temperature rise rate of the simulated CPU. The SSPCM prepared in this study shows great potential for application in thermal management of portable electronic devices and flexible wearable electronic devices.

Effect of initial droplet position on coalescence-induced jumping on superhydrophobic surfaces with micropillar arrays

Coalescence-induced droplet jumping holds great potential for applications such as water harvesting, self-cleaning, and the thermal management of electronic devices. This study investigates the impact of the droplet's initial position on coalescence-induced jumping on superhydrophobic surfaces with micropillar arrays. Numerical simulations are conducted to examine the differences in droplet jumping at various initial positions with uniform and nonuniform micropillar distributions, and the effects of the droplet's initial position on its velocity and pressure distribution are analyzed. The findings indicate that altering the initial position produces an asymmetric distribution of the high-pressure region at the droplet's base and the pressure at the solid–liquid contact surface during the contraction of the liquid bridge. This asymmetry allows the droplet to jump away from the surface with both vertical and horizontal components of velocity, and to be transported in the horizontal direction. Furthermore, numerical simulations with various initial droplet positions and radii demonstrate that the direction of the horizontal jumping velocity is influenced by both the offset distance and the direction of the initial droplet position, and that the impact of the initial position decreases as the relative size of the droplet with respect to the micropillars increases. The droplet jumping velocity, direction, and horizontal transport distance can be controlled by adjusting the initial droplet position and size. This work reveals the mechanism of coalescence-induced droplet jumping on superhydrophobic surfaces with micropillar arrays and provides an important reference for practical applications.

Hydrophilicity regulation of carbon nanotubes as phase-change materials for thermal energy storage

Solid-liquid phase-change materials (PCMs) offer exciting prospects for thermal energy conservation, whose performance is greatly affected by the carrier materials. Using expanded vermiculite (EV) as frameworks, carbon nanotube arrays (CNTs) were grown between EV layers by chemical vapor deposition (CVD). Then, the paraffin (PA) was loaded on the EV@CNTs composite by vacuum impregnation to prepare composite PCMs (PA/EV@CNTs), where the PA is organic carrier and the EV@CNTs acts as porous supports with high structural strength. The loading capacity of PA is further regulated by the hydrotropism of CNTs which effectively prevents the leakage of molten PA. The in-situ grown CNTs significantly improves the thermal conductivity of PCMs, improving the efficiency of energy conversion. With maximum PA loading capacity of 95 wt%, the thermal conductivity of PA/EV@CNTs-95% reaching 0.7176 W/mK, which was 1.73 and 2.96 times higher than that of pristine EV and PA. The phase change latent heat of PA/EV@CNTs-95% was measured to be 168.54 J/g, which is 1.48 times higher than that of PA/EV. After 100 cycles, the PA/EV@CNTs still maintains excellent thermal stability, and the enthalpy retention rate is 98.73%. The incorporation of high thermal conductivity amphipathicity CNTs in these PCMs makes them promising candidate for various applications such as energy-efficient buildings, thermal management in electronic devices, and self-cleaning materials.

Enhanced thermal conductivity and self‐healing property of PUDA/boron nitride micro‐sheets composites with a small number of graphene nano‐platelets

AbstractSelf‐healing polyurethane diacrylate (PUDA) composites with outstanding thermal conductivity were prepared with variable boron nitride (BN) and a small number of graphene nanoplatelets (GNPs) (1 wt%). The thermal conductivity of PUDA composites containing 1 wt% GNPs and 29 wt% BN reached 1.73 W/(m·K), showing 27.2% increment compared to PUDA composites only with 30 wt% BN. BN and GNPs mutually promoted the dispersion in the PUDA matrix, and the small number of GNPs was enough to bridge the gaps between BN, so that GNPs and BN exerted a synergistic enhancement effect on the thermal conductivity of PUDA composites with a synergistic efficiency of 1.343. The PUDA composites maintained the tensile strength of 8.21 MPa with good electrical insulation (4.55 × 109 Ω cm). The high degrees of recovery of mechanical strength (&gt;90%) and thermal conductivities (&gt;84%) were also realised by the healing effect of the reversible DA reaction. The PUDA composites with excellent comprehensive properties show broad application potential in the thermal management of electronic devices.