Thermal Management Of Electronic Devices Research Articles

Numerical investigation of nanofluid deposition in a microchannel cooling system

Nanofluid-microchannels (NF-MCs) have emerged as an important topic for thermal management of electronic devices. However, deposition of nanoparticles is a tricky problem, and this paper conducts a numerical study to identify the best working conditions to prevent deposition of nanofluids in a microchannel cooling system. According to the findings, large nanoparticles, high velocity, low inlet temperature, high nanoparticle density, low nanofluid density, and high base fluid viscosity are the best working conditions for improving nanofluid stability. However, heat transfer rates and pressure drop must also be taken into account. The nanoparticle deposition rate and average heat transfer coefficient only increase by 2.71% and 0.92% respectively as the heat flux increases from 20 kW/m2 to 100 kW/m2, but the pressure drop decreases by 10.57%. Therefore, changing the heat flux is not the best option. Moreover, the inlet temperature has only a minor effect on the heat transfer coefficient, so it is crucial to balance the pressure drop and nanoparticle deposition when designing systems.

Competition between phonon-vacancy and four-phonon scattering in cubic boron arsenide by machine learning interatomic potential

Point defects can strongly suppress the thermal conductivity $\ensuremath{\kappa}$ of solid materials, which is crucial for a broad range of applications, such as thermal management of electronic devices and thermoelectrics. Understanding thermal transport in materials containing point defects often relies on atomistic simulations based on density functional theory (DFT) or empirical potentials (EPs). However, modeling thermal transport in defective materials using DFT is very computationally expensive or even prohibitive due to the breaking of crystal symmetry while EPs suffer from low accuracy. Recently, machine learning has been applied to the development of interatomic potentials, offering opportunities to model defective systems accurately and efficiently. Here, we present a Gaussian approximation potential (GAP) developed for crystalline cubic boron arsenide (c-BAs) with vacancies, which can achieve DFT-level accuracy in predicting its $\ensuremath{\kappa}$ and phonon transport properties at four orders of magnitude reduced computational cost, especially for phonon-vacancy and four-phonon scatterings. Particularly, we applied the GAP to investigate the effect of vacancies on the $\ensuremath{\kappa}$ of c-BAs by considering both three-phonon and four-phonon scattering. Special attention was paid to the competition between phonon-vacancy and four-phonon scattering, which tend to decrease and increase the temperature dependence of $\ensuremath{\kappa}$, respectively. Specifically, when the vacancy concentration is much lower than $0.07%$ $(2.56\ifmmode\times\else\texttimes\fi{}{10}^{19}\phantom{\rule{4pt}{0ex}}{\mathrm{cm}}^{\ensuremath{-}3})$, four-phonon scattering plays stronger roles in determining the temperature dependence of $\ensuremath{\kappa}$. As the vacancy concentration increases to $0.07%$, the temperature dependence of $\ensuremath{\kappa}$ becomes close to that considering only three-phonon scattering, indicating the comparable effect of phonon-vacancy and four-phonon scattering. As the vacancy concentration further increases, the phonon-vacancy scattering becomes more dominant and pushes the $\ensuremath{\kappa}$ towards a temperature-independent behavior. Our work deepens the understanding of the phonon scattering landscape in c-BAs with vacancies and will be helpful for tailoring its thermal properties. Atomistic simulations combined with machine learning interatomic potentials are expected to be able to greatly advance the understanding of thermal transport in defective materials.

Graphene-based conformal coating for heat dissipation on printed circuit boards

Thermal management of electronic devices poses a constant challenge due to the ever-increasing heat fluxes and a great variety of cases that require non-standard engineering solutions. In this work, a novel conformal coating with enhanced thermal conductivity is suggested, which spreads heat effectively from a hot spot on a printed circuit board (PCB). This heat-dissipating composite is created by loading a polymer with graphene nano-platelets (GnP), yielding a two orders of magnitude higher thermal conductivity (33 W/m K) than the neat polymer (0.2 W/m K). The concept, processing and application of the coating to a model PCB, bearing a heat generating component, are presented. It is demonstrated experimentally that, depending on the filler loading levels, the component temperature is substantially lowered when the coating is applied, with the temperature drop reaching up to 35 °C under the given conditions. The numerical simulations offer further insights into the analysis of system performance and corroborate the experimental results. The suggested thin conformal coating can be easily used for thermal management in a wide range of applications in the electronic industry.

Magnetic-field tuning of thermal conductivity via bionic nanochain and droplet deformation

Thermal conductivity of nanofluids has garnered widespread attention because of its potential applications in heat dissipation and insulation. There is a high need for advanced thermal management solutions on an urgent basis, which may rely on dynamic tuning of the thermal conductivity in liquid/solid system. Designing a controllable liquid/solid system has emerged as an effective strategy for achieving tunable heat transfer methods, which is a crucial problem for energy storage systems and electronic devices in energy conversions. In this study, magnetically dynamic tuning of liquid deformation and particle chains for heat transfer was explained. The particle movement in the droplet could be adjusted by an external magnetic intensity and direction, causing the liquid deformation and then altering the heat transfer. The dynamic tuning of heat transfer within different particle distributions was explained and verified. In particular, thermal conductivity of nanofluids within concentration gradient distribution and magnetic nano-chain was regulated by magnetic field. This work formed a magnetic-controlled nanofluid manipulation methodology and explained the heat transfer mechanism within magnetic nanoparticles movements, which can be utilized for thermal management of electronic devices by controlling the droplet and fluid.

Performance improvement of loop heat pipe by micro-pin-fins/powders composite surface

The loop heat pipe incorporating flow boiling (LHPFB) achieves much higher heat flux than conventional loop heat pipes (LHPs). However, the operating temperature is too high for the thermal management of electronic devices. In this study, various surfaces are fabricated on the boiling chamber baseplate of the LHPFB to reduce the junction temperature. The micro-pin-fins/powders composite surface has the best performance with the junction temperature reduced by 9.7℃, but it can hardly increase the heat transfer limit. When the coolant temperature is 25℃ and the evaporator thermal load is 200 W, the LHPFB with composite surface achieves a heat transfer limit of 500 W with the corresponding heat flux of 103.3 W·cm−2, and the operating temperature is 90.4℃. A theoretical model for heat transfer limit is proposed, based on which several methods to further improve the thermal performance are put forward. Compared with the conventional LHPs, the LHPFB with composite surface has the advantages of high heat transfer limit and low operating temperature, and therefore is a promising candidate for the thermal management of high-heat-flux electronic devices.

Effect of four-phonon scattering on anisotropic thermal transport in bulk hexagonal boron nitride by machine learning interatomic potential

The highly anisotropic thermal conductivity in layered materials is crucial for a broad range of applications such as thermal management of electronic devices, thermal insulation, and thermoelectrics. Understanding of anisotropic thermal transport in layered materials largely depends on atomistic simulations based on density functional theory (DFT) or empirical potentials, which however suffer either low computational efficiency or accuracy. Recently, machine learning interatomic potentials (MLIPs) are emerging as a powerful tool to bridge the gap. Despite the recent progress in developing MLIPs, little attention has been paid to constructing a potential that can accurately predict the thermal properties of layered materials, which is more challenging compared with the case of isotropic materials because of the highly anisotropic bonding and weak van der Waals interactions in layered materials. Here, we introduce a MLIP within the Gaussian approximation potential (GAP) framework for bulk hexagonal boron nitride (h-BN) with a typical layered structure. We demonstrate that the GAP can well predict the highly anisotropic phonon transport properties and thermal conductivity of bulk h-BN with DFT-level accuracy at 3 orders of magnitude reduced cost. Particularly, we investigate the effect of four-phonon scattering on the thermal conductivity of bulk h-BN using the GAP. The suppression of thermal conductivity by four-phonon scattering is negligible below 300 K due to the orders of magnitude weaker four-phonon scattering than three-phonon scattering, which is mainly attributed to the breaking of the reflection symmetry selection rule and the splitting of the flexural acoustic branch in bulk h-BN. As temperature increases, four-phonon scattering results in a larger reduction in thermal conductivity, which increases up to 21.64% (in-plane) and 35.71% (cross-plane) at 1000 K. Atomistic simulations based on MLIPs are expected to be able to greatly promote the understanding of phonon transport and the prediction of thermophysical properties in layered materials.

Magneto-thermal-switching properties of superconducting Nb

Recently, thermal switching has been extensively studied because it is a key component for thermal management in electronic devices. Here, we show a huge magneto-thermal-switching ratio (MTSR) in pure Nb at temperatures lower than its superconducting transition temperature (T c = 9.2 K). The MTSR increases with decreasing temperature, and an MTSR of 650% was observed at T = 2.5 K under H = 4.0 kOe. Thermal switching in superconductors with a huge MTSR will be useful for the improvement of the performance of low-temperature electronic devices.

Enhancing thermal conductivity of epoxy composites via f‐BN@f‐MgO hybrid fillers assisted by hot pressing

AbstractHigh thermal conductive polymeric composites are extremely desired for the thermal management of electronic devices due to the rapid development of the modern microelectronic industry. Herein, the functionalized boron nitride (BN) and magnesium oxide (MgO) hybrid fillers (f‐BN@f‐MgO) were synthesized and used to prepare the enhanced thermal conductive epoxy (EP) composites through the hot‐pressing method. The results demonstrated that the covalent binding of BN and MgO in the hybrid fillers reduced the interface thermal resistance effectively between fillers and matrix and the hot‐pressing induced force facilitated the construction of the continuous thermal conduction paths. Consequently, the as‐prepared epoxy composite at 40 wt% hybrid fillers loading had high thermal conductivity (TC) (1.97 W/[m·K]), outstanding insulating performance (6.9 × 1015 Ω cm) and excellent thermal stability. Furthermore, a probable thermal conduction mechanism was proposed to illustrate the high TC of the epoxy composite. Therefore, this study provides a new approach to preparing epoxy composites with outstanding performances.

3D fluid–structure simulation of innovative composites for the design and thermal management of electronic devices

Thermal management of electronic devices remains a challenging issue, especially the cooling of electronic components. Current methods mostly involve noisy, cumbersome and underperforming fans. It has recently been shown that phase change materials (PCMs) can perform better and offer more efficient damping of temperature variations in electronic components. Here, we present three novel contributions. First, we consider a triply-periodic minimal surface, called a gyroid, as a porous architectured structure containing the PCM. Such a topology mathematically maximizes the exchange surface between the copper structure and the PCM. Heat transfer and thus the performance of such a composite are therefore optimized. Second, we set up a complete 3D coupled fluid–structure model of the composite. This model simulates the heat transfer (conduction and convection) inside both the PCM and the porous structure, as well as the mechanical stresses induced on the container by thermal expansion of the PCM. The 3D coupled theoretical model is based on open-source software codes, OpenFOAM, CalculiX and preCICE. With this novel model, deformation of the structure and mechanical stresses are now predictable. It is therefore possible to anticipate whether a configuration will be prone to leakage due to mechanical failure. Thermal contact resistance is also computed, giving information on heat transfer quality at the interface between the composite and the electronic component. Third, the application of this model to the innovative composite shows that reducing the initial filling level of PCM is a better solution than strengthening the container to maximize thermal management.

Pie-rolling-inspired construction of vertical carbon fiber high thermal conductivity hybrid networks

Carbon fiber (CF) with a high thermal conductivity (Tc) of 1100 W m−1 K−1 along its one-dimensional (1D) direction is considered a promising filler for fabricating high-performance thermal interface material (TIM). However, Tc in the radial direction of CF is far less than 10 W m−1 K−1 determines that Tc highly depends on the orientation of CF. In this study, polydimethylsiloxane (PDMS)/short carbon fibers (SCFs)/Al spherical particle (PDMS/SCFs/Al) composite is firstly prepared. SCFs are then arranged into horizontal (0°), inclined (45°), and vertical (90°) orientations, respectively, utilizing a convenient “pie-rolling” method that does not rely on any specific instrument. As a result, the vertically oriented SCFs together with Al spherical particles establish an effective thermal conductivity-three-dimensonal (3D) network, and the Tc of the through-plane is as high as 10.46 W m−1 K−1, while the in-plane Tc is 6.23 W m−1 K−1 measured from a steady-state method. The anisotropic thermal conductivity is also verified by a hot-disk method. The working mechanism and thermal conductivity of oriented SCFs and Al spherical particles composites are being studied using finite element simulation. In addition, the change in surface temperature of the composites during heating and cooling stage is observed using an infrared thermal imaging camera. A 16 ℃’s temperature decline demonstrates that the high-efficiency heat transfer along the vertical orientated carbon fiber-based 3D network was successfully realized in SCF-90 when it was used as a TIM between a bare die and heat pipe of a laptop. This work illustrates the prospect of using SCFs to prepare a high thermally conductive 3D network could be used in the future thermal management of electronic devices.

Experimental study on the thermal characteristics of a 3D thermosyphon heat sink

Phase change heat transfer has received extensive attention in the thermal management of electronic devices. Most studies of heat pipe or vapor chamber were limited to one- or two-dimensional heat transfer mode. Enhancing the phase change heat transfer to three-dimensional mode in heat sinks and exploring the thermal behavior of the heat sinks deserve a dedicated study. In this paper, a three-dimensional thermosyphon (3D-TS) heat sink combining the superiorities of the vapor chamber, thermosyphon and folded fins was experimentally investigated. The experimental reliability was validated and consolidated by the heat loss analysis, and an iteration method was proposed to estimate the saturation temperature to facilitate the in-depth analysis of the results. The coupling characteristics of the air forced convection and phase change heat transfer, and the effects of the heating power and air volume flow rate on the thermal resistance of 3D-TS were involved in the discussion. The main results indicate that the overall thermal resistance exhibits a negative correlation with the heating power and the air volume flow rate. The lowest thermal resistance of 0.14 K·W−1 was achieved with Qtotal = 300 W and 100 CFM air volume flow rate. High temperature on the folded fins indicates that the phase change heat transfer extends from the flat vapor chamber to the vertical thermosyphon tubes. It is also found that for a small heating power, a relatively large air volume flow rate is not able to further reduce the overall thermal resistance due to inadequate phase change intensity. The proposed heat sink is expected to solve the heat dissipation problems for densely packed electronic devices, which can produce favorable performance according to the input heating power and appropriate air volume flow rate.

Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

With the ever-shrinking characteristic dimension of chips and the increasing of packaging density, heat dissipation has become the most critical technology challenge for electronic devices. The development of high-performance thermal interface materials (TIMs) for enhancing thermal coupling and minimizing thermal resistance between heterogeneous components is the key to achieving efficient thermal management of electronic devices. Herein, we report a high-performance carbon fiber/polydimethylsiloxane (CF/PDMS) TIM based on the construction of vertically oriented carbon fiber arrays and the modulation of PDMS's crosslinking density. The resulting CF/PDMS TIM exhibits highly desirable characteristics of through-plane thermal conductivity up to 43.47 W/m∙K (only 20 vol% loading), outstanding elastic compliance similar to soft biological tissues (stress ∼ 35 kPa at 35% compressive strain), and excellent resilience performance (resilience rate of 85% after compression cycles). In addition, the heat dissipation capability of CF/PDMS TIM is improved further by forming interconnected heat-conducting structures on the CF/PDMS TIM's surface. The optimal CF/PDMS TIM in microprocessor cooling application exhibits superior heat dissipation capability and stability during 1000 power cycles, resulting in a 68 °C reduction in the chip temperature compared with the state-of-the-art commercial TIM. This work opens up a new avenue for fabricating high-performance TIMs that meet the heat dissipation requirements of high-performance computing.

MXene based flexible composite phase change material with shape memory, self-healing and flame retardant for thermal management

Paraffin-based composite phase change materials used for thermal management of electronic devices generally suffers the defects of strong rigidity, low thermal conductivity and flammability. Herein, a flexible and flame retardant composite phase change material (CPCM) of paraffin (PA)/olefin block copolymer (OBC)/MXene is prepared to conduct efficient and safe thermal management. The polymer network of OBC and the layered porous structure of MXene achieve double coupling encapsulation of PA, so PA/OBC/MXene CPCM shows superior thermal stability and high relative enthalpy efficiency (≥97%). Benefiting from phase separation structure of OBC and the photo-thermal conversion capability of MXene, the thermal sensitive flexible CPCM exhibits thermal/light driven shape memory property and self-healing efficiency of 89.60%. The MXene can enhance thermal conductivity of CPCM above 2.3 times that of PA to facilitate rapid heat transfer and dissipation, and the average solar cell temperatures without thermal management and using PA and PA/OBC/MXene as thermal management material are 64.7 °C, 53.5 °C and 47.5 °C, respectively. Moreover, the MXene notably enhances the flame retardancy of CPCM, which can self-extinguish within 12 s. In general, present flexible composite phase change materials achieves higher thermal conductivity, shape adaptation and fire retardancy properties, and those have promising applications in thermal management with rapid heat dispersion and safe operation.

Enhanced boiling heat transfer of HFE-7100 on copper foams under overflow conditions

Boiling of dielectric liquids on structured surfaces is a powerful option for thermal management of electronic devices, whose cooling performance depends strongly on liquid supply and vapor departure. Herein, saturation boiling of HFE-7100 on copper foams with a pore density of 30 pores per inch (PPI) under overflow conditions is proposed to enhance liquid supply and facilitate vapor departure. Liquid HFE-7100 is fed to the copper foam by a peristaltic pump and un-vaporized liquid is discharged by gravity. The higher flowrate leads to higher critical heat flux (CHF) and heat transfer coefficient (HTC) only if the copper foam is not flooded. Visual observations reveal evolution of vapor bubbles with heat flux on the copper foam under overflow conditions. Dependence of CHF and HTC on foam thickness is experimentally evaluated and an optimal thickness of 4.7 mm is derived from the experimental data. The optimal foam thickness is related to submergence level of bulk flow and capillary height. CHF and HTC are enhanced by the forced liquid supply in combination with the reduced hindrance of hydrostatic pressure to vapor departure, reaching 860 kW m−2 and 47.3 kW m−2 K−1, respectively. The overflow boiling offers an efficient way to improve heat transfer of boiling on porous medium for efficient thermal management.

3D printing of alumina ceramic heat sink with mini‐channels for thermal management

AbstractThermal management has become one of the most challenging issues for high‐power, integrated, and miniaturized electronic devices. In this paper, an alumina ceramic heat sink with mini‐channels was fabricated using a digital light processing 3D printing technology. Microstructures of the ceramic were investigated by scanning electron microscopy. A proper flow rate of water in the mini‐channels was figured out for efficient cooling by infrared thermal imaging and micro‐thermocouple characterizations. The ceramic heat sink was further integrated with a high‐power laser diode module; cooling performance was evaluated by investigating the thermal resistance of the ceramic heat sink and the optoelectronic property of the laser diode module. Results indicated that the laser diode module could be operated at high driving power of 115.6 W. This study provided a new strategy for a highly efficient thermal management of electronic devices and highlighted the technical potential of ceramic heat sink with more compact coolant channels.

Nanodot embedding based optimization of interfacial thermal conductance

Regulating the interfacial thermal conductance is a key task in the thermal management of electronic devices, and implanting nanostructures at the interface is an effective way to improve the interfacial thermal conductance. In order to study the effect of the embedding of nanostructures on the thermal conductivity of the interface, the effect of embedding tin (Sn) nanodots at the interface on the interfacial thermal conductance of silicon-germanium (Si/Ge) composite material is investigated by using a non-equilibrium molecular dynamics simulation. It is found that the phonon transmission function of the hybrid interface with embedded nanodots is significantly larger than that of the perfect interface (there are no nanodots at interface). The enhanced transmission function plays a role in facilitating the thermal transport at the interface, which enhances the interfacial thermal conductance. The simulation results also indicate that the interfacial thermal conductance changes nonlinearly with the increase of the number of Sn nanodots, firstincreasing and then decreasing. This is attributed to the competition between two phonon transport mechanisms, which are elastic scattering of phonons and inelastic scattering of phonons. When four nanodots are inserted, the interfacial thermal conductance reaches a maximum value, which is 1.92 times that of a perfect interface. In order to reveal the reason why the interfacial thermal conductance varies nonlinearly with the number of nanodots, the transmission function and density of states of photons are calculated, and the result indicates that the increasing of interfacial thermal conductance is due to the enhancement of phonons inelastic scattering, which opens new channels for the interfacial phonons transport. As the number of nanodots increases to a certain value, the elastic scattering of phonons gradually dominates, and the interfacial thermal conductance starts to decrease. In addition, temperature is also a key factor affecting the interfacial thermal conductance. This study shows that as the temperature increases, more and more high-frequency phonons are excited, the phonons transmission function at the interface keeps increasing, and the enhanced inelastic scattering makes the interfacial thermal conductance keep increasing. This study provides theoretical guidance for improving the interfacial thermal conductance of electronic devices.

Self-assembled boron nitride nanosheet-based aerogels as support frameworks for efficient thermal energy storage phase change materials.

Phase change materials (PCMs) are promising in many fields related to energy utilization and thermal management. However, the low thermal conductivity and poor shape stability of PCMs restrict their direct thermal energy conversion and storage. The desired properties for PCMs are not only high thermal conductivity and excellent shape stability, but also high latent heat retention. In this study, the boron nitride nanosheets (BNNSs) were bridged by small amounts of GO nanosheets and successfully self-assembled into BNNS/rGO (BG) aerogels by hydrothermal and freeze-drying processes. The BG aerogels with interlaced macro-/micro-pores have been proven to be ideally suited as support frameworks for encapsulating polyethylene glycol (PEG). The obtained composite PCMs exhibit high thermal conductivity (up to 1.12 W m-1 K-1), excellent shape stability (maintain at 90 °C for 10 min), and high latent heat (187.2 J g-1) with a retention of 97.3% of the pure PEG, presenting great potential applications in energy storage systems and thermal management of electronic devices.

Soft and thermally conductive gels by introducing free-movable polymer chains into network

The rapid development of electronic devices has been putting forward requirements for higher thermal conductivity, softness, and stability of thermal interface materials. However, thermal interface materials simultaneously achieving softness, stability, and thermal conductivity is still challenging. Here, we propose a strategy of introducing free-movable polymer chains to prepare thermally conductive gels possessing high thermal conductivity (6.91 W m−1 K−1), good softness (Young's modulus ∼400 KPa, and stretchability increasing 262.4%). The high thermal conductivity is due to the high addition of microscale spherical Aluminum. The good softness is attributed to the free-movable poly (ethylene propylene diene), which reduces the interaction between polymer networks. When thermally conductive gels simulate practical applications, it shows excellent heat-dissipation ability and thermal stability after 1000 heating-cooling cycles. This work provides a simple strategy for constructing thermally conductive gels with high performance and promotes their potential applications in the thermal management of electronic devices.

Fabrication of 3D printing extrusion-based Nylon 12/Bi2O3 composite filaments for thermal interface device application

Fused deposition modeling (FDM), an additive manufacturing (AM) technique, is capable of printing electronic devices by employing functional filaments. Fabrication of polymer composite filament with active fillers seems promising for printing various electronic devices. This study is focused to fabricate functional Nylon 12 based composite filaments reinforced with Bismuth oxide(Bi 2 O 3) for AM technique. Bi 2 O 3 at variable concentration was reinforced within Nylon 12 matrix, 5 wt% of Polyethylene glycol (PEG) was mixed with each composition to enhance the flexibility of Nylon-12 composites. XRD and FTIR study confirmed the presence of Bi 2 O 3 within the Nylon12 while scanning electron microscope study (SEM) revealed the meticulous dispersion of Bi 2 O 3 particles within the polymer. The filaments displayed excellent improvement in thermal conductivity (TC) with the addition of semiconducting Bi 2 O 3 and the TC values complemented with theoretical models. There was significant improvement in tensile strength of filaments with addition of Bi 2 O 3 and produced refined FDM printed prototypes with minimum dimensional inaccuracies. This harnesses the potential application of 3D printed Nylon 12/Bi 2 O 3 composites in thermal interface devices for thermal management in electronic devices.

Thermal performances of finned heat sink filled with nano-enhanced phase change materials: Design optimization and parametric study

The present numerical study proposes a novel heat sink model with combined NANO- enhanced Phase Change Materials (NANOPCM) and pin fins for the thermal management of electronic devices. The governing equations, model the heat transfer and the NANOPCM melting process, resolved by using CFD software (ANSYS Fluent) based on a finite volume method scheme. First, a comparison between heat sink with and without phase change material (PCM) was carried out. Then, different configurations of finned-heat sinks are studied to investigate the effect of 2 key parameters: the pin fin thickness and the pin fin numbers on the performance of the PCM-based heat sink. Furthermore, the effects of nanoparticles: graphene (GNP), copper oxide (CUO), and aluminium oxide (AL2O3) are investigated. The same volume fraction of nanoparticles 1.65%vol (5%wt weight fraction) was adopted to explore the most efficient NANOPCMs. Further, the impact of nanoparticle weight fractions (5%wt and 7%wt) are also detailed.This study demonstrated that the rise of pin fins volume fraction and the nanoparticles concentration don't improve the heat sink performances; the insertion of 9% pin fins volume fraction and the dispersion of 1.65 %vol graphene showed advanced performances (the operating time has been extended by 2.75 times). The results demonstrated also that the nanoparticle dispersion inside the finned heat sink does not have a significant effect on the thermal response due to the high thermal conductivity of the pin fins.