Thermal Management Applications Research Articles

Self-cleaning PTFE nanofiber membrane for long-term passive daytime radiative cooling

Passive daytime radiative cooling (PDRC) is an innovative, eco-friendly, and electricity-free cooling strategy that involves spontaneously cooling a surface by reflecting sunlight and radiating heat to cold outer space. Currently, many kinds of research focus on the effects of material design and structure construction on PDRC performance. However, the PDRC suffers a significant challenge of performance degradation arising from surface contamination and poor long-term outdoor durability. Herein, we developed a simple, efficient, and scalable strategy to prepare a superhydrophobic poly-(tetrafluoroethylene) (PTFE) nanofiber membrane (SNM-PTFE) with outstanding radiative cooling and self-cleaning performance for various practical applications. The SNM-PTFE has an average infrared emissivity 95.8 % and reflects 95.4 % of solar irradiance. It brought about a sub-ambient cooling performance of ∼ 14.4 °C under direct sunlight. Moreover, it demonstrated excellent above-ambient cooling performance by reducing ∼ 9. °C under sunlight, which exhibited unprecedented heat dissipation and solar heat-shielding properties. The self-cleaning surface of SNM-PTFE maintained its good cooling performance after being exposed to outdoor conditions for a full month. SNM-PTFE showed great promise for PDRC, which can further extend the application for residential, industrial applications, and human thermal management.

Modelling of the microstructure and thermal conductivity of SiC bonded diamond materials

Materials with high thermal conductivity are required in a wide range of thermal management applications. Silicon carbide (SiC) bonded diamond materials, which can be produced without pressure, are a possible candidate for such applications. They exhibit thermal conductivities > 650 W/(m·K) depending on the diamond content, diamond grain size and residual silicon content. It is difficult to experimentally determine the influence of these factors on the thermal conductivity separately, as changing one of these parameters affects the other parameters. Therefore, a method for generating digital microstructures of SiC bonded diamond materials was developed and the thermal conductivity was calculated as a function of the grain size These data were compared with real structures.

Mastering thermal transport across carbon nanotube contacts through morphological control

Thermally conductive nanomaterials hold great promise for applications in thermal management. However, the interfaces between nanomaterials can significantly impede heat flow, and a comprehensive understanding of thermal transport across nanoscale contacts is highly desired. Here, by integrating a movable nano-manipulator within an electron microscope with a nanofabricated thermal sensor, we adjusted the contact positions, overlapping length, and crossing angles between two carbon nanotubes (CNTs) as desired, while concurrently measuring the thermal contact resistance (TCR) at the van der Waals junction. The TCR far surpassed that of the studied 6 μm-long CNTs, particularly in contacts affected by inevitable nanoscale surface contamination. The TCR per unit area exhibited significant variations across different contact morphologies, spanning two orders of magnitude even for identical pairs of samples, attributable to structural non-uniformity within the CNTs. This in-situ approach and the notable morphology effects can guide the control of heat at the nanoscale.

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

The interface structure holds paramount significance in enhancing the thermal conductivity (TC) of diamond/Cu composites, positioning them as a promising candidate for thermal management applications. Diamond/Cu composites (55% volume fraction) with three distinct interfacial carbides were fabricated via sintering at 950 °C using Cu and diamond powder coated with Ti, Cr, and W. During the sintering process, interfacial layers of TiC, Cr3C2, and W2C carbides formed at the composite interfaces. The findings reveal that the interfacial bonding strength among these three composites adheres to the following hierarchy: Ti-D/Cu exceeds Cr-D/Cu, which surpasses W-D/Cu. This hierarchy stems from the varying degrees of carbide coating integrity attained at 950 °C. Furthermore, the coating morphology differs on the diamond-{100} and -{111} crystal planes. Notably, among the interfacial carbides, TiC coating exhibits the most compact and contiguous structure postsintering. Consequently, Ti-D/Cu composites boast the highest density, reaching 95.49%, along with a remarkable TC of 317.66 W/mK. A comparative analysis of the fracture morphology of these composites reveals that Ti-D/Cu, characterized by the most robust interfacial bonding, exhibits a intransgranular fracture mechanism. This study offers profound insights and theoretical implications for the interface design of diamond/Cu composites, paving the way for their effective utilization in heat dissipation materials.

(Invited) Near-Field Optics and Its Applications in Nanoscale Materials: A Review

In this paper, we first offer an overview of aperture-type scanning near field optical microscopy –a family of super-resolution imaging techniques based on evanescent waves, which can be combined with atomic force microscopy and are capable of subwavelength resolution nano-optical imaging. In the second part of this review, we will discuss a few applications in which our group capitalized on the super-resolution resolving power of SNOM to design specific nano-optical and nano-photonic systems for light harvesting, resistive memory device applications and nanoscale thermo-optical management. Specific case studies that will be presented include the characterization of weakly photoluminescent and curved carbon dots for memory device applications, the three-dimensional characterization of plasmon-enhanced nanophotonic devices, as well as the development of near-field thermoreflectance imaging for nanophotonic-based thermal management applications. Collectively, our study well represents the versability of SNOM as a unique super-resolution nanophotonic tool for the investigation of light-matter interaction at the nanoscale.

Prestrain Guided Yield of Large Single-Crystal Nickel Foils with High-Index Facets.

Single-crystal metal foils with high-index facets are currently being investigated owing to their potential application in the epitaxial growth of high-quality van der Waals (vdW) film materials, electrochemical catalysis, gas sensing and other fields. However, the controllable synthesis of large single-crystal metal foils with high-index facets remains a great challenge because high-index facets with high surface energy are not preferentially formed thermodynamically and kinetically. Herein, single-crystal nickel foils with a series of high-index facets are efficiently prepared by applying prestrain energy engineering technique, with the largest single-crystal foil exceeding 5×8 cm2 in size. In terms of thermodynamics, the internal mechanism of prestrain regulation on the formation of high-index facets is proposed. Molecular dynamics simulation is utilized to replicate and explain the phenomenon of multiple crystallographic orientations resulting from prestrain regulation. Additionally, large-sized and high-quality graphite films are successfully fabricated on single-crystal Ni(012) foils. Compared to the polycrystalline nickel, the graphite/single-crystal Ni(012) foil composites show more than five-fold increase in thermal conductivity, thereby showing great potential applications in thermal management. This study hence presents a novel approach for the preparation of single-crystal nickel foils with high-index facets, which is beneficial for the epitaxial growth of certain two-dimensional materials. This article is protected by copyright. All rights reserved.

MXene-modified lemon peel-based composite phase change material with excellent photo-thermal conversion efficiency, thermal storage capacity and thermal conductivity for thermal management of electronic components

The preparation of multifunctional composite phase change materials using green technology to achieve an efficient energy storage and conversion remains an issue of concern. In this paper, a lemon peel-based porous carbon (LPC) composite phase change material (CPCM) was prepared by using polyethylene glycol (PEG) 6000 as a phase change medium and MXene nanosheet-modified carbonized lemon peel as a support carrier. MXene nanosheets were bonded to a lemon peel-based porous carbon skeleton to construct an excellent continuous three-dimensional thermally conductive grid system. What makes it noteworthy is that the presence of MXene nanosheets substantially improves the thermal conductivity (0.66 W/mK) and photo-thermal conversion efficiency (θ = 96.4 %) of MXene-modified lemon peel-based porous carbon/polyethylene glycol composite phase change materials (PEG/LPC@M). It is noteworthy that PEG/LPC@M has remarkable thermal stability and still has high enthalpy after 100 cycles, which further proves the recyclability of PEG/LPC@M and PEG/LPC@M embodies great potential in the field of thermal management of electronic components. In conclusion, a novel multifunctional CPCM was prepared by a simple and green process method in this study, which provides a new idea for waste recycling and reuse, and also has a wide range of applications in thermal management of electronic devices.

Enhancing thermal conductance between graphene and epoxy interfaces through non-covalent cation-π interactions

Although graphene has high thermal conductivity, its application in thermal management remains challenging because of the large interfacial thermal resistance between graphene and adjacent materials. This work demonstrates that non-covalent cationic-π interaction can significantly improve the thermal conductance between graphene and substrate interfaces. Cationic polyacrylamide (CPAM) bridges substrate and graphene with hydrogen bonding and cation-π interaction, respectively. The cation-π interaction between graphene and CPAM is confirmed by Raman, UV–Vis and NMR spectroscopy. The results show that CPAM increases the interfacial adhesion of graphene/epoxy from 18.7 ± 2.2 mN to 37.4 ± 7.6 mN (100.0 % improvement) and improves the interfacial thermal conductivity (ITC) from 22 ± 2 MW/m2K to 51 ± 5 MW/m2K (131.8 % improvement). Enhancing the ITC of graphene/epoxy by introducing CPAM assembled layer has advantages over covalent modifications because it provides a similar level of ITC improvement rate, but has little effect on the intrinsic thermal conductivity of graphene. Finally, it is demonstrated that the sample with graphene/cationic polyelectrolyte/substrate structure exhibits great potential for applications in the area of thermal management and printed circuit boards.

General strategy for developing thick-film micro-thermoelectric coolers from material fabrication to device integration

Micro-thermoelectric coolers are emerging as a promising solution for high-density cooling applications in confined spaces. Unlike thin-film micro-thermoelectric coolers with high cooling flux at the expense of cooling temperature difference due to very short thermoelectric legs, thick-film micro-thermoelectric coolers can achieve better comprehensive cooling performance. However, they still face significant challenges in both material preparation and device integration. Herein, we propose a design strategy which combines Bi2Te3-based thick film prepared by powder direct molding with micro-thermoelectric cooler integrated via phase-change batch transfer. Accurate thickness control and relatively high thermoelectric performance can be achieved for the thick film, and the high-density-integrated thick-film micro-thermoelectric cooler exhibits excellent performance with maximum cooling temperature difference of 40.6 K and maximum cooling flux of 56.5 W·cm−2 at room temperature. The micro-thermoelectric cooler also shows high temperature control accuracy (0.01 K) and reliability (over 30000 cooling cycles). Moreover, the device demonstrates remarkable capacity in power generation with normalized power density up to 214.0 μW · cm−2 · K−2. This study provides a general and scalable route for developing high-performance thick-film micro-thermoelectric cooler, benefiting widespread applications in thermal management of microsystems.

Preparation and thermal conductivity of bimodal diamond particles reinforced phenolic resin composites

AbstractThermal conductive polymer composites have broad application prospects in the field of thermal management. However, due to intrinsically low thermal conductivity of polymers, even if fillers with high mass fraction are filled, the thermal conductivity of polymer composites cannot be significantly improved. In this paper, bimodal diamond particles (70 wt.% 150 μm and 22 wt.% 25 μm) were incorporated into phenolic resin to construct continuous heat transfer pathways by close packing, thereby enhancing its thermal conductivity. The results indicated that diamond particles with smaller particle size can effectively bridge the gaps between larger ones, forming a continuous for heat conduction. As a result, a maximum thermal conductivity value of 12.45 W/(m·K) can be achieved, which is 65.5 times, 9.8 times and 8.4 times higher than pure phenolic resin, 25 μm diamond particles reinforced phenolic resin composite and 150 μm diamond particles reinforced phenolic resin composite, respectively. Furthermore, heat dissipation and water cooling experiments also confirm the superior heat dissipation performance of phenolic resin composites reinforced with bimodal diamond particles. When the heating voltage is 10 V and the water cooling rate is 30 mL/min, the upper surface temperature of bimodal diamond composites is 129.2°C lower than that of pure phenolic resin. This investigation provides a new type of polymer composite with high thermal conductivity, which has promising prospects for application in thermal management. It also provides new insights for preparing polymer composites with high thermal conductivity by close packing of bimodal particles.Highlights Surface modification of the filler enhances its combination with resin. The interfacial bonding will be enhanced by D–OH bond on diamond surface. Bimodal diamond particles lead to the formation of a closely packed structure. This special structure can form a three‐dimensional heat conduction network. The highest TC of the DD/PR composite is 12.45 W/(m·K).

Alloying Effects on the Transport Properties of Refractory High-entropy Alloys

Additive Manufacturing (AM) has opened new frontiers for the design of refractory high-entropy alloys (HEAs) for high-temperature applications. The thermal conductivity of the AM feedstock is among the most important thermo-physical properties that control the melting and solidification process. Despite its significance, there remains a notable gap in both computational and experimental research concerning the thermal conductivity of HEAs. Here, we use density functional theory (DFT) to systematically investigate the alloying effects on the transport properties of Ti-Cr-Mo-W-V-Nb-Ta RHEAs, including electrical and thermal conductivities and Seebeck coefficient. The relaxation time of charge carriers is a key underlying parameter determining thermal conductivity that is exceedingly challenging to predict from first principles alone, and we thus follow the approach by Mukherjee, Satsangi, and Singh [Chem Mater 32, 6507 (2022)] to optimize the relaxation time for RHEAs. We validated thermal conductivity predictions on elemental solids, binary and ternary alloys, and RHEAs and compared them against thermodynamic (CALPHAD) predictions and our experiments with good correlations. To understand observed trends in thermal conductivity, we assessed the phase stability, electronic structure, phonon, and intrinsic- and tensile strength of down-selected RHEAs. Our electronic structure and phonon results connect well with the observed compositional trends for thermal transport in RHEAs. Our DFT assessment and CALPHAD predictions provide a unique design guide for RHEAs with tailored thermal conductivity, a critical consideration for AM and thermal-management applications.

An approach for topology optimization of heat sinks for two-phase flow boiling: Part 1 – Model formulation and numerical implementation

Two-phase flow boiling in heat sinks and cold plates is attractive for various thermal management applications due to high effective heat capacity rates and high heat transfer coefficients compared to single-phase operation. In addition, multi-physics topology optimization is sought for generation of high performance thermal management components. Yet, the design of heat sinks using topology optimization has been restricted to single-phase flow physics, due to incompatibility between available two-phase flow models and traditional single-phase topology optimization approaches. Interface-capturing two-phase flow models are too computationally expensive for optimization; mixture and two-fluid models that treat the liquid and vapor phases as an interpenetrating continuum with interfacial transport phenomena captured through empirical correlations are computationally tractable for heat-sink-scale optimization. However, the penalization approaches commonly used to define the structures formed during topology optimization results in arbitrary fin and channel geometries for which a universal two-phase flow correlation is not available. To enable coupling with two-phase mixture models, this work leverages a homogenization approach to topology optimization wherein heat sink designs are represented using spatially varying microstructures with optimized dimensions. A predefined microstructure geometry is chosen for which two-phase flow correlations exist and therefore topology optimization can be performed. This work is the first to develop a topology optimization algorithm using a mixture model for simulating two-phase flow boiling to design heat sinks and cold plates. Part 1 of this study develops and implements the algorithm to investigate topology optimized heat sinks at various heat inputs, topology optimization grid sizes, and maximum vapor quality constraints. Topology optimized heat sinks designed for single-phase versus two-phase flow are compared. There are significant differences in hydraulic and thermal responses of the single-phase and two-phase designs due to high effective heat capacity rates and high heat transfer coefficients of flow boiling. A companion paper (Part 2) focuses on manufacturing, model calibration, and experimental validation of the topology optimized heat sinks under two-phase flow boiling. The algorithm demonstrated in this work extends the capabilities of topology optimization to two-phase flow physics, and thereby enables the design of various two-phase flow components such as evaporators, condensers, heat sinks, and cold plates.

Flash soldering of boron nitride nanosheets for all-ceramic films

The assembly of boron nitride nanosheets (BNNSs) into strong, flexible thin films capable of withstanding extreme conditions, such as high/low working temperatures and corrosive environments, holds immense promise for numerous applications. However, BNNSs are difficult to assemble and sinter to achieve the dense thin film structure observed in graphene thin films. We report the rapid fabrication of dense BNNS all-ceramic films (BACFs) in 30 s by combining the fabrication strategies for 2D and ceramic materials. In this process, densely arranged and highly oriented BNNSs are flash soldered into a monolith achieved by precisely controlled ultrafast sintering. This fusion of BNNS leads to an ultrahigh in-plane thermal conductivity of 134.5 W·m−1·K−1, which was among the highest values for BNNS films (mostly ≤ 70 W·m−1·K−1). The as-prepared BACF exhibits the combined advantages of sintered ceramics (durability, stability, acid-alkali resistance) and 2D material films such as flexibility and shock resistance, which is important for practical uses but rarely found in existing ceramics. It also has excellent cooling performance, dielectric properties, and good thermal stability, which is promising for demanding thermal management applications in emerging technologies.

Are Local Heat Transfer Quantities Useful for Predicting the Working Behavior of Different Pulsating Heat Pipe Layouts? A Comparative Study

Despite a continuous effort devoted by the scientific community, a large-scale employment of Pulsating Heat Pipes for thermal management applications is still nowadays undermined by the low reliability of such heat transfer systems. The main reason underlying this critical issue is linked to the strongly chaotic thermofluidic behavior of these devices, which prevents a robust prediction of their working behavior for different geometries and operating conditions, consequently hampering proper industrial design. The present work proposes to thoroughly compare data referring to previous infrared investigations on different Pulsating Heat Pipe layouts, which have focused on the estimation of heat fluxes locally exchanged at the wall–fluid interfaces. The aim is to understand the beneficial contribution of local heat transfer quantities in the prediction of the complex physics underlying such heat transfer systems. The results have highlighted that, regardless of the considered geometry and working conditions, wall-to-fluid heat fluxes are able to provide useful quantities to be employed, to some extent, to generalize Pulsating Heat Pipe operation and to improve their existing numerical models.

A Critical Review on Recent Advancements in Aluminium-Based Metal Matrix Composites

Aluminum matrix composites (AMCs) have garnered significant attention across various industrial sectors owing to their remarkable properties compared to conventional engineering materials. These include low density, high strength-to-weight ratio, excellent corrosion resistance, enhanced wear resistance, and favorable high-temperature properties. These materials find extensive applications in the military, automotive, and aerospace industries. AMCs are manufactured using diverse processing techniques, tailored to their specific classifications. Over three decades of intensive research have yielded numerous scientific revelations regarding the internal and extrinsic influences of ceramic reinforcement on the mechanical, thermomechanical, tribological, and physical characteristics of AMCs. In recent times, AMCs have witnessed a surge in usage across high-tech structural and functional domains, encompassing sports and recreation, automotive, aerospace, defense, and thermal management applications. Notably, studies on particle-reinforced cast AMCs originated in India during the 1970s, attained industrial maturity in developed nations, and are now progressively penetrating the mainstream materials arena. This study provides a comprehensive understanding of AMC material systems, encompassing processing, microstructure, characteristics, and applications, with the latest advancements in the field.

Vertically aligned carbon fiber/polydimethylsiloxane composites prepared by lyophilization with exceptional thermal conductivity and electromagnetic interference shielding performance

Composites with high thermal conductivity and exceptional electromagnetic interference (EMI) shielding properties are crucial for ensuring the long-term stability of electronic devices. One-dimensional carbon fibers (CFs) stand out as promising materials due to their excellent thermal and electrical conductivity. However, the anisotropic nature of CFs limits the overall electrical and thermal conductivity of the composite, thus impeding its practical application. To address this limitation, we investigated the effect of different freezing methods on CF orientation using the ice template method. Subsequently, CF-150/PDMS and CF-250/PDMS composites with varying average lengths of CFs were prepared using the unidirectional freezing technique. We studied the influence of CF content and average length on the anisotropic thermal conductivity and EMI shielding properties of the composites. The CF-250/PDMS composite, with a CF content of 15.71 vol%, exhibits a remarkable thermal conductivity of 9.07 W·m−1·K−1 and a low thermal resistance of 2.61 °C·cm2‧W−1. The thermal conductive mechanism of CF/PDMS composites was simulated by thermal conduction model and finite element analysis. Furthermore, it demonstrates longitudinal electromagnetic interference shielding effectiveness (EMI SE) reaches up to 39.66 dB, while the transverse EMI SE reaches up to 52.55 dB. The vertically aligned CF/PDMS composites exhibit significant potential for a range of applications in thermal management and EMI shielding.

Revisiting lattice thermal conductivity of CsCl: The crucial role of quartic anharmonicity

Thermal conductivity (κL) plays a critical role in thermal management applications. Usually, crystals with simpler structures exhibit higher κL due to fewer phonon scatterings. However, cesium chloride (CsCl) presents an anomaly, demonstrating an unexpectedly low κL of 1.0 W m−1 K−1 at 300 K, as observed in Professor Iversen's experimental measurement despite its simple structure. This prompts a need for understanding anomalous low κL and matching theory with experimental observations. Our study brings forth several findings for CsCl: (i) relying solely on three-phonon scattering inadequately captures κL. (ii) Anharmonic phonon renormalization significantly contributes to increased κL. (iii) Coherent phonons align temperature-dependent κL closely with the experiment. This work not only enhances understanding of anomalous κL in CsCl but also provides an approach to bridge the gap between experiment and theory in other crystals.

Epoxy resin/ aluminium hydroxide/expanded graphite synergistic effects on advancing flame retardancy, mechanical structure and thermal management of octadecanoic acid and octadecanol-based eutectic phase change materials

In the present research, a novel approach wherein a flame-retardant composite phase change material (PCMs) is devised by incorporating eutectic PCMs, epoxy resin (ER), aluminium hydroxide (ATH), and expanded graphite (EG). This innovative formulation capitalizes on the synergistic interaction between ER and ATH, alongside the porous structure of EG, resulting in a triple-layer encapsulation of the eutectic PCMs. The outcome of this formulation is marked by remarkable thermal stability, even under extreme conditions such as exposure to temperatures as high as 800 °C. Notably, one of the representative samples, denoted as S5, showcases impressive attributes with a thermal conductivity of 1.335 W∙m-1K−1 and a substantial phase change latent heat of 150.4 J∙g−1. It was observed an increase in latent heat up to 181.3 J∙g−1 after 100 heating–cooling cycles of composite PCMs. This indicates the good thermal reliability of the form-stable composite PCMs synthesized. Moreover, the composite PCMs exhibit outstanding mechanical properties, especially S5 which showed a 14.69 % and 400.12 % increase in compression strength and compression modulus compared with pure eutectic PCM (S0), respectively. Besides, the ternary composition of ER, ATH, and EG enhances the flame retardancy of the composite PCMs, yielding a substantial reduction of 67.33 % in peak heat release rate and 50.38 % in total heat release. This collaborative effect also establishes a robust defense mechanism against the rapid propagation of flames, as exemplified by the attainment of a V-0 rating in the UL-94 test. As a result, the flame-retardant ER/ATH/EG ternary-based form-stable composite PCM presents itself as a promising candidate for ensuring both safety and efficiency in thermal management applications.

Dual-polarization small-angle strong nonreciprocal thermal radiator with Weyl semimetal

The development of dual-polarization irreversible radiators that can operate without external magnetic field is an arduous task. To avoid the need of strong magnetic field, a dual-polarization nonreciprocal thermal radiator with the introduction of Weyl semimetal is demonstrated. It consists of cross-shaped silicon nanopores, Weyl semimetal, and Ag reflective layer. The simulation results show that the proposed radiator offers both TE- and TM-polarized strong irreversible radiation with an incident angle of 1.6°. The TE-polarized absorptivity and TM-polarized emissivity are 98.8% and 97.6%, respectively. The dual-polarization nonreciprocity exceeds 80%. The physical principle is explained by the electric field energy distribution and impedance matching theory. The demonstrated scheme and radiator have potential application in dual-polarization multi-band irreversible radiation and thermal management.

Anisotropic Lattice Thermal Conductivity in Highly Ordered PEDOT Fibers

AbstractWhen it comes to sustainable and efficient energy solutions, organic semiconductors can play an important role in thermoelectric applications, since they are non‐toxic, cheap, made of abundant chemical species, and show intrinsically low thermal conductivities. Their electrical conductivity can be optimized via doping. Yet, thermal conduction should be as low as possible and, to this end, the atomic scale mechanisms behind heat transport –e.g. the correlation between morphology and thermal conductivity or the role of doping– should be understood in detail. Fully atomistic molecular dynamics calculations of the lattice thermal conductivity of doped poly(3,4‐ethylenedioxythiophene) (PEDOT) highly ordered, quasi‐crystalline nanofibers are presented here. It is found that the conductivity along the backbone direction is not necessarily the highest, but it depends on the length of the PEDOT chains, thus the degree of anisotropy depends on the the aspect ratio of the nanofiber. Indeed, transport along the lamellar direction can be of the same order or higher than that of the backbone if their lengths are comparable. These results challenge the usual expectation that thermal conduction along the backbone largely exceeds those along the lamellar and π − π direction and have the important consequence that the anisotropy could be leveraged in thermal management applications.