Thermal Design Of Electronic Equipment Research Articles

Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites

• The efficient cooling of electronic device was designed and analyzed. • A flexible ultra-high thermal conductivity nanocomposites material used. • Model analysis, simulation and experiment proved the effectiveness. The efficient heat dissipation of electronic equipment is very important, its heat dissipation performance directly determines the life of the equipment itself. A hand-held electronic communications equipment, when used in surface temperature is exorbitant, need to heat dissipation equipment efficiently, to ensure that the use of comfort in the handheld. In accordance with this requirement, this article presents a flexible composite material based on nano-efficient cooling methods that can keep the layout, through the improvement of internal thermal path, it can achieve the effective heat dissipation. The network thermal resistance method is used to analyze the heat transfer in the equipment, and the thermal analysis of the local thermal resistance is carried out. At the same time, through the modeling of electronic equipment and the analysis of finite elements, the temperature drop of the equipment after improvement is accurately judged. Finally, the device experimental performance comparison before and after the optimization of the standby mode and working mode is verified. The results show that the optimized equipment heat source temperature can be reduced by up to 8.5°C, the surface temperature of the equipment can be reduced by about 5°C~7°C, and the final control equipment in the steady standby state of the temperature of about 39±0.5°C, to ensure the comfort of use, and also improved the service life of the equipment. The efficient thermal design of electronic equipment based on flexible nanocomposites can provide a convenient and reliable cooling solution for high-heat flow density devices.

Novel Development for Thermal Design of Electronic Equipment Using Pulsating Flow from Knowledge of Nature

Novel Development for Thermal Design of Electronic Equipment Using Pulsating Flow from Knowledge of Nature

Phase Change Materials Applied in Thermal Design

Phase change material has been widely used in the fields of solar energy, aerospace, aviation, and buildings. In this paper, paraffin is applied in the thermal design of electronic equipment, in order to maintain a constant working circumstance. Finite-element analysis is implemented to analyze the feasibility of this thermal design.

Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)

AbstractThis study describes the performance of cooling fans in terms of the P–Q curve and the maximum flow rate under various environmental conditions. It focuses on the relationship between fan performance and configuration factors such as the electronic enclosure. The presence of an enclosure wall increased the pressure characteristic of the fan performance. The presence of a narrow inlet decreased the flow rate. When the inlet area of the enclosure became smaller than twice the fan flow area, the flow rate was decreased. The maximum flow rate depended on the ratio of the inlet area to the fan flow area. A model for predicting pressure rise and flow rates in the enclosure is proposed. The model is used in a thermal analysis of a PCB model set in an enclosure. © 2011 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley Online Library (wileyonlinelibrary.com/journal/htj). DOI 10.1002/htj.20347

Effects of Electronic Enclosure and Inlet Area on P - Q Curves of Installed Axial Cooling Fans

This paper describes the effects of the enclosure and its inlet on the performance of axial air-cooling fans installed in electronic equipment. The performance of an air-cooling fan is defined by its P - Q (pressure difference — flow rate) curve. Recent studies have reported that the P - Q curve of cooling fans depends on their operating environment. P - Q curves are normally used to define the performance of fans in the computational fluid dynamics (CFD) codes. Therefore the change of the P - Q curve may cause inaccurate CFD analyses to be performed in the thermal design of electronic equipment, including cooling fans. In this study, we measured the performance of test fans in an enclosure and explored the effects of the inlet size and shape while varying the speed of revolution of the fan. In particular, the static pressure difference between the front and rear of fans installed in a test enclosure was investigated. Our experiments clarified the effect of the enclosure on fan performance. The level of decrease of the maximum flow rate was found to be determined by the size of the inlet area, and was independent of the shape of the inlet and the revolution speed of the fan.

Study on Performance Prediction Model of Cooling Fans for Thermal Design of Electronic Equipment (Modeling and Evaluation of Effects from Electronic Enclosure and Inlet Sizes)

Study on Performance Prediction Model of Cooling Fans for Thermal Design of Electronic Equipment (Modeling and Evaluation of Effects from Electronic Enclosure and Inlet Sizes)

1308 応答曲面法による電力同定手法を適用した上流熱設計 : 汎用インバータ機器への適用(CO2 設計コンテストI)

Thermal design of electronic equipment in early design stage is the most effective way for reducing the material cost, product size and total developing time. To realize the frontloading thermal design, accurate estimation method of device power dissipation must be required. However, there is no way to measure the power dissipation of inverter due to the variation of device properties, test conditions and so on. We apply an identification method using response surface methodology (RSM) with CFD to estimate the power dissipation of multiple devices on printed wired board. As a verification result, identification error in total power is just 3.4%. This practical approach improves the accuracy of early thermal design quality dramatically.

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Computational Fluid Dynamics (CFD) codes have proved their high potential as a tool of thermal design of electronic equipment. However, as the product development cycle is shortened, the CFD-based thermal design needs a new format that allows the packaging designer fast and versatile searches for better design options. The most serious factor that slows the CFD-based design is geometric complexity created by packing various components in a tight space of the system box. In a proposed methodology coined “Build-up Approach (BUA),” CFD simulations are conducted on a set of hardware models to gain insight into the effects of component placement on the junction temperature. Two algorithms are introduced before and after CFD simulations: one defines the geometric parameters through singular value decomposition (SVD) of components placement patterns and the other identifies important geometric parameters by means of the Taguchi method. A case study was conducted on a simple hardware model (benchmark model) that embodies essential features of portable electronic equipment. The results proved the effectiveness of these algorithms in measuring the relative importance of geometric parameters and weeding out unimportant geometric details.

1834 電子機器熱設計ビルドアップアプローチ法 : RC 202 プロジェクト活動のアップデート

1834 電子機器熱設計ビルドアップアプローチ法 : RC 202 プロジェクト活動のアップデート

646 電子機器熱設計のためのビルドアップアプローチ : 複雑幾何形状への対応法

A JSME project is in progress to implement a methodology called the Build-up Approach (BUA). The BUA is designed to expedite thermal design of electronic equipment. Following the description of BUA concept presented earlier at the 02 JSME Annual Meeting, this presentation focuses on one of the key steps involved in the knowledge development phase. Components placement in the system box is represented by two groups of numeral strings. The string groups correspond to the modes of components shuffling on the printed card board or in the system box, tile shuffling and vector shuffling. Strings manipulation enables organised search for a components placement pattern that renders higher thermal performance.

E207 電子機器の熱設計に関するビルドアップアプローチ : 機械学会RCプロジェクト(オーガナイズドセッション21 : 電子機器の熱設計と解析の応用)

In order to expedite thermal design of electronic equipment a hierarchical organisation of the design work is proposed. In the knowledge development level, the computational fluid dynamics (CFD) simulation is performed on a set of template designs in the product development phase. From the solution body a fast-to-use design code will be developed for use in the actual design phase. This paper describes the basic concept, and illustrates the methods of knowledge extraction on some examples.

Application of a semi-empirical approach to the thermal design of electronic equipment

A semi-empirical approach to the thermal design of electronic equipment is presented. Although recent progress in computer technology has enabled a complex analysis to be made, it is difficult to carry out numerical studies for practical electronic equipment cabinets, which have extremely complicated boundary conditions due to the various sized components mounted in the cabinets. It has thus become important to establish an analytical model in order to apply computer simulation to the thermal design of electronic equipment. This paper reports the semi-empirical approach based on a lumped model, and experimental data on the flow resistance coefficient and heat transfer coefficient. A simulation was carried out for a photocopy machine model by using a personal computer. The proposed method is confirmed to be capable of serving thermal designers satisfactorily.

電子機器の熱設計と冷却技術

電子機器の熱設計と冷却技術

Flow Resistance Correlation of Wire Nets in a Wide Range of Reynolds Numbers for Thermal Design of Electronic Equipment

Flow Resistance Correlation of Wire Nets in a Wide Range of Reynolds Numbers for Thermal Design of Electronic Equipment

電子機器の熱設計における流れの可視化

電子機器の熱設計における流れの可視化