Abstract
Thermal design of electronic equipment in early design stage is the most effective way for reducing the material cost, product size and total developing time. To realize the frontloading thermal design, accurate estimation method of device power dissipation must be required. However, there is no way to measure the power dissipation of inverter due to the variation of device properties, test conditions and so on. We apply an identification method using response surface methodology (RSM) with CFD to estimate the power dissipation of multiple devices on printed wired board. As a verification result, identification error in total power is just 3.4%. This practical approach improves the accuracy of early thermal design quality dramatically.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: The Proceedings of Design & Systems Conference
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
