Test Access Mechanism Optimization Research Articles

A Branch-&-Bound Test-Access-Mechanism Optimization Method for Multi- $V_{\mathrm{ dd}}$ SoCs

The use of multiple voltage levels introduces new challenges for testing multi- ${V_{\mathrm{ dd}}}$ systems-on-chip (SoCs). Time-division-multiplexing (TDM) tackles many of these challenges and offers very effective test-schedules. However, the effectiveness of TDM for minimizing test time depends on the test-access-mechanism (TAM) in the SoC. Single- $ {V_{\mathrm{ dd}}}$ TAM optimization techniques consider neither the highly constrained test environment of multi- $ {V_{\mathrm{ dd}}}$ SoCs nor the benefits provided by TDM, therefore they are not suitable for multi- $ {V_{\mathrm{ dd}}}$ SoCs. In this paper, we propose the first TAM optimization technique for multi- $ {V_{\mathrm{ dd}}}$ SoCs. The proposed method exploits unique scheduling opportunities and flexibility offered by TDM, and by the means of a branch-&-bound approach, it quickly identifies the most effective TAM configurations. Experiments using large benchmark SoCs as well as SoCs from industry highlight the benefits of the proposed technique on multi- $ {V_{\mathrm{ dd}}}$ designs, for both single-site and multisite test applications.

Test-access mechanism optimization for core-based three-dimensional SOCs

Embedded cores in a core-based system-on-chip (SOC) are not easily accessible via chip I/O pins. Test-access mechanisms (TAMs) and test wrappers (e.g., the IEEE Standard 1500 wrapper) have been proposed for the testing of embedded cores in a core-based SOC in a modular fashion. We show that such a modular testing approach can also be used for emerging three-dimensional integrated circuits based on through-silicon vias (TSVs). Core-based SOCs based on 3D IC technology are being advocated as a means to continue technology scaling and overcome interconnect-related bottlenecks. We present an optimization technique for minimizing the post-bond test time for 3D core-based SOCs under constraints on the number of TSVs, the TAM bitwidth, and thermal limits. The proposed optimization method is based on a combination of integer linear programming, LP-relaxation, and randomized rounding. It considers the Test Bus and TestRail architectures, and incorporates wire-length constraints in test-access optimization. Simulation results are presented for the ITC 02 SOC Test Benchmarks and the test times are compared to that obtained when methods developed earlier for two-dimensional ICs are applied to 3D ICs. The test time dependence on various 3D parameters (e.g. 3D placement, the number of layers, thermal constraints, and the number of TSVs) is also studied.

Low-Area Wrapper Cell Design for Hierarchical SoC Testing

System-on-chip (SoC) integrated circuits are designed and fabricated with multiple levels of hierarchy. However, most previous works on wrapper design, test access mechanism optimization and test scheduling did not take care of the hierarchy properly, thus the corresponding test schedules were often invalid for SoCs with hierarchical cores. We propose a low-area wrapper cell design which can treat SoCs with hierarchy properly and allows simultaneous testing of parent and child cores. The proposed cell uses 13%~23% less area than a recently proposed cell design in equivalent gate count. As a result we achieve up to 21% area reduction for hierarchical ITC '02 SoCs compared to the most recently proposed designs.

Testing of SoCs with Hierarchical Cores: Common Fallacies, Test Access Optimization, and Test Scheduling

Many system-on-chip (SOC) integrated circuits today contain hierarchical (parent) cores that have multiple levels of design hierarchy involving Hierarchy imposes a number of constraints on the manner in which tests must be applied to parent cores and their child cores. However, most prior work on wrapper design, test access mechanism (TAM) optimization, and test scheduling are hierarchy-oblivious, i.e., these techniques treat all cores in an SOC at the same level of hierarchy. We first show that wrappers, TAMs and test schedules designed for non-hierarchical SOCs are not valid for SOCs with hierarchical cores. We next present two approaches for the efficient testing of SOC with hierarchical cores. In the first approach, an existing wrapper design is modified such that that all constraints imposed by the hierarchy are satisfied and full flexibility is provided for TAM optimization and test scheduling. The second approach is based on a hierarchy-aware wrapper architecture for parent cores that operates in two disjoint modes for the testing of parent and child cores. We show how an existing test-architecture design algorithm can be adapted for use with these two methods. Results for the ITC'02 SOC Test Benchmarks show that the first approach offers lower test application times while the second approach requires less area overhead.

Test-Length and TAM Optimization for Wafer-Level Reduced Pin-Count Testing of Core-Based SoCs

Wafer-level testing (wafer sort) is used in the semiconductor industry to reduce packaging and test cost. However, a large number of wafer-probe contacts lead to higher yield loss. Therefore, it is desirable that the number of chip pins contacted by tester channels during wafer sort be kept small to reduce the yield loss resulting from improper contacts. Since test time and the number of contacted chip pins are major practical constraints for wafer sort, not all scan-based digital tests can be applied to the die under test. We propose an optimization framework based on mathematical programming (integer linear programming, nonlinear programming, and geometric programming) and fast heuristic methods. This framework addresses test-access mechanism (TAM) optimization and test-length selection for wafer-level testing of core-based digital system-on-chips (SoCs). The objective here is to design a TAM architecture and determine test lengths for the embedded cores such that the overall SoC defect-screening probability at wafer sort is maximized. Defect probabilities for the embedded cores, obtained using statistical yield modeling, are incorporated in the optimization framework. Simulation results are presented for five of the ITC'02 SoC Test benchmarks.

Test bus assignment, sizing, and partitioning for system-on-chip

The test access mechanism (TAM) is an important element of test architectures for embedded cores and is responsible for on-chip test pattern transport from the source to the core under test to the sink. Efficient TAM design is of critical importance in system-on-chip integration since it directly impacts testing time and hardware cost. In this paper, an efficient genetic algorithm for designing test access architectures while investigating test bus sizing and concurrently assigning cores to test buses is proposed. Experimental results are presented to demonstrate that the proposed TAM optimization methodology provides efficient test bus designs with minimum testing time while outperforming reported techniques.

Optimization of Dual-Speed TAM Architectures for Efficient Modular Testing of SOCs

The increasing complexity of system-on-chip (SOC) integrated circuits has spurred the development of versatile automatic test equipment (ATE) that can simultaneously drive different channels at different data rates. Examples of such ATEs include the Agilent 93000 series tester based on port scalability and the test processor-per-pin architecture and the Tiger system from Teradyne. The number of tester channels with high data rates may be constrained in practice, however, due to ATE resource limitations, the power rating of the SOC, and scan frequency limits for the embedded cores. Therefore, we formulate the following optimization problem: Given two available data rates for the tester channels, an SOC-level test access mechanism (TAM) width W, an upper limit V (V<W) on the number of channels that can transport test data at the higher data rate, determine an SOC TAM architecture that minimizes the testing time. We present an efficient heuristic algorithm for TAM optimization that exploits port scalability of ATEs to reduce SOC testing time and test cost. We present experimental results for the ITC '02 SOC test benchmarks and investigate the impact of dual-speed TAM architectures on power consumption during testing for one of these benchmarks

Optimization of Dual-Speed TAM Architectures for Efficient Modular Testing of SOCs

The increasing complexity of system-on-chip (SOC) integrated circuits has spurred the development of versatile automatic test equipment (ATE) that can simultaneously drive different channels at different data rates. Examples of such ATEs include the Agilent 93000 series tester based on port scalability and the test processor-per-pin architecture and the Tiger system from Teradyne. The number of tester channels with high data rates may be constrained in practice, however, due to ATE resource limitations, the power rating of the SOC, and scan frequency limits for the embedded cores. Therefore, we formulate the following optimization problem: Given two available data rates for the tester channels, an SOC-level test access mechanism (TAM) width W, an upper limit V (V<W) on the number of channels that can transport test data at the higher data rate, determine an SOC TAM architecture that minimizes the testing time. We present an efficient heuristic algorithm for TAM optimization that exploits port scalability of ATEs to reduce SOC testing time and test cost. We present experimental results for the ITC '02 SOC test benchmarks and investigate the impact of dual-speed TAM architectures on power consumption during testing for one of these benchmarks

Test infrastructure design for mixed-signal SOCs with wrapped analog cores

Many system-on-chips (SOCs) today contain both digital- and analog-embedded cores. Even though the test cost for such mixed-signal SOCs is significantly higher than that for digital SOCs, most prior research in this area has focused exclusively on digital cores. We propose a low-cost test development methodology for mixed-signal SOCs that allows the analog and digital cores to be tested in a unified manner, thereby minimizing the overall test cost. The analog cores in the SOC are wrapped such that they can be accessed using a digital test access mechanism (TAM). We evaluate the impact of the use of analog test wrappers on area overhead and test time. To reduce area overhead, we present an analog test wrapper optimization technique, which is then combined with TAM optimization in a cost-oriented heuristic approach for test scheduling. We also demonstrate the feasibility of using analog wrappers by presenting transistor-level simulations for an analog wrapper and a representative core. We present experimental results for three SOCs from the ITC '02 test benchmarks that have been augmented with three analog cores: an I-Q transmit path pair and an audio CODEC path used in cellular phone applications.

Test planning for modular testing of hierarchical SOCs

Multilevel test access mechanism (TAM) optimization is necessary for modular testing of hierarchical systems-on-chip (SOCs) that contain older-generation SOCs as embedded megacores. We consider the case where these older-generation SOCs are used as hard cores in new SOC designs, and they are delivered to the system integrator as optimized and technology-mapped layouts. We present three hierarchical test planning and TAM optimization flows that exploit recent advances in TAM design for flattened SOC hierarchies. These techniques are based on the reuse of existing TAM architectures within megacores and the optimization of the top-level TAM under the constraints imposed by "TAM-ed" megacores that are delivered either with or without a wrapper. We present a new megacore wrapper-design technique for the latter case. Unlike prior methods that assume flat test hierarchies, the proposed methods are directly applicable to real-world design-transfer models involving hard megacores between the core vendor and the system integrator for hierarchical SOCs. Experimental results are presented for four ITC'02 SOC test benchmarks that contain megacores.

SOC test planning using virtual test access architectures

Recent advances in tester technology have led to automatic test equipment (ATE) that can operate at up to gigahertz speeds. However, system-on-chip (SOC) scan chains are typically run at lower frequencies, e.g., 10-50 MHz. The use of high-speed ATE channels to drive slower scan chains leads to an underutilization of resources, thereby resulting in an increase in SOC testing time. We present a new test planning technique to reduce the testing time and test cost by matching high-speed ATE channels to slower scan chains using the concept of virtual test access architectures. We also present a new test access mechanism (TAM) optimization framework based on Lagrange multipliers and analyze the impact of virtual TAMs on the overall SOC test power consumption for one of the ITC'02 benchmarks. Experimental results for TAM optimization based on Lagrange multipliers and virtual TAMs are presented for three industrial circuits from the set of ITC'02 SOC test benchmarks.

Test access mechanism optimization, test scheduling, and tester data volume reduction for system-on-chip

We describe an integrated framework for system-on-chip (SOC) test automation. Our framework is based on a new test access mechanism (TAM) architecture consisting of flexible-width test buses that can fork and merge between cores. Test wrapper and TAM cooptimization for this architecture is performed by representing core tests using rectangles and by employing a novel rectangle packing algorithm for test scheduling. Test scheduling is tightly integrated with TAM optimization and it incorporates precedence and power constraints in the test schedule, while allowing the SOC integrator to designate a group of tests as preemptable. Test preemption helps avoid hardware and power consumption conflicts, thereby leading to a more efficient test schedule. Finally, we study the relationship between TAM width and tester data volume to identify an effective TAM width for the SOC. We present experimental results on our test automation framework for four benchmark SOCs.

Efficient test access mechanism optimization for system-on-chip

Test access mechanisms (TAMs) are an important component of a system-on-chip (SOC) test architecture. TAM optimization is necessary to minimize the SOC testing time. We present a fast, heuristic technique for TAM optimization and demonstrate its scalability for several industrial SOCs. Since the TAM optimization problem is NP-hard, recently proposed methods based on integer linear programming and exhaustive enumeration can be used to design limited test architectures with only a very small number of TAMs in a reasonable amount of time. In this paper, we explore a larger solution-space to design efficient test architectures with more TAMs. We show that the SOC testing times obtained using the new heuristic algorithm are comparable to or lower than the testing times obtained using enumeration. Moreover, significant reduction can be obtained in the CPU time compared to enumeration.

Test bus sizing for system-on-a-chip

System-on-a-chip (SOC) designs present a number of unique testability challenges to system integrators. Test access to embedded cores often requires dedicated test access mechanisms (TAMs). We present an improved approach for designing efficient TAMs and investigate the problems of improved deserialization of test data in the core wrapper, optimal test bus sizing, and optimal assignment of cores to test buses in the system. Place-and-route and power constraints are incorporated in the model. This work represents an important first step towards combining TAM design with efficient wrapper design for test data deserialization. Experimental results demonstrate that the proposed TAM optimization methodology provides efficient test bus designs for minimizing the testing time.