Abstract Nowadays, numerous techniques are used to quantify the resistance of cellular polymers against a thermal load. These techniques differ in significance and reproducibility and are all dependent on foam density, structure (i.e., cell size and -distribution) and sample geometry. Very different behaviors are expected for extrusion- and bead foams, as well as for amorphous and semi-crystalline polymers. Moreover, established tests use temperature ramps which would lead to temperature gradients within the sample and thus to faulty results. In this study, we developed a new approach from an engineering perspective to minimize these influences. In this approach, the resistance against the thermal load is derived from a steady creep test with defined temperature steps under a mechanical load, which is specifically set for each foam sample depending on its static compression behavior at room temperature. The two-stage test therefore combines (i) a standard quasi-static compression test at room temperature and (ii) a creep test with stepwise increased thermal loading. For each foam type, a rather low mechanical load (stress) is determined from the quasi-static compression test at room temperature; low enough to remain below the collapse strength and avoid irreversible deformation (i.e., buckling and/or breaking of the cell walls). This load is then applied in a creep test where the temperature is increased in defined steps from room temperature to a temperature close to T g or T m . The stepwise increase and holding of the temperature for a defined time enables a homogeneous temperature in the test specimen. The approach was applied to (i) polystyrene extrusion and bead foams (i.e., XPS and EPS), which have different foam structure, (ii) amorphous and semi-crystalline bead foams of polystyrene (EPS) and polypropylene (EPP), (iii) bead foams with different densities (30, 60, 120, and 210 kg/m3) and (iv) to a new type of bead foam made of the engineering polymer polybutylene terephthalate (E-PBT). The termination criterion for the test is defined as the temperature at which a relative compression of 10% is reached in the creep test with temperature steps. We suggest calling it the heat stability temperature T HS. For the studied foams, the procedure delivers characteristic T HS values that allow a good comparison between different polymer matrices and densities. The heat stability temperature T HS of amorphous PS foams (i.e., XPS and EPS) was determined to be 98 °C, which is close to the glass transition temperature T g . Using the same approach, values of 99–107 °C were determined for EPP and 186 °C for the semi-crystalline bead foam E-PBT.