Abstract

Abstract Nowadays, numerous techniques are used to quantify the resistance of cellular polymers against a thermal load. These techniques differ in significance and reproducibility and are all dependent on foam density, structure (i.e., cell size and -distribution) and sample geometry. Very different behaviors are expected for extrusion- and bead foams, as well as for amorphous and semi-crystalline polymers. Moreover, established tests use temperature ramps which would lead to temperature gradients within the sample and thus to faulty results. In this study, we developed a new approach from an engineering perspective to minimize these influences. In this approach, the resistance against the thermal load is derived from a steady creep test with defined temperature steps under a mechanical load, which is specifically set for each foam sample depending on its static compression behavior at room temperature. The two-stage test therefore combines (i) a standard quasi-static compression test at room temperature and (ii) a creep test with stepwise increased thermal loading. For each foam type, a rather low mechanical load (stress) is determined from the quasi-static compression test at room temperature; low enough to remain below the collapse strength and avoid irreversible deformation (i.e., buckling and/or breaking of the cell walls). This load is then applied in a creep test where the temperature is increased in defined steps from room temperature to a temperature close to T g or T m . The stepwise increase and holding of the temperature for a defined time enables a homogeneous temperature in the test specimen. The approach was applied to (i) polystyrene extrusion and bead foams (i.e., XPS and EPS), which have different foam structure, (ii) amorphous and semi-crystalline bead foams of polystyrene (EPS) and polypropylene (EPP), (iii) bead foams with different densities (30, 60, 120, and 210 kg/m3) and (iv) to a new type of bead foam made of the engineering polymer polybutylene terephthalate (E-PBT). The termination criterion for the test is defined as the temperature at which a relative compression of 10% is reached in the creep test with temperature steps. We suggest calling it the heat stability temperature T HS. For the studied foams, the procedure delivers characteristic T HS values that allow a good comparison between different polymer matrices and densities. The heat stability temperature T HS of amorphous PS foams (i.e., XPS and EPS) was determined to be 98 °C, which is close to the glass transition temperature T g . Using the same approach, values of 99–107 °C were determined for EPP and 186 °C for the semi-crystalline bead foam E-PBT.

Highlights

  • The mechanical behavior of foams was well described in fundamental studies by Ashby [1, 2], stating that the typical compression curve consists of three areas

  • The resistance against the thermal load is derived from a steady creep test with defined temperature steps under a mechanical load, which is set for each foam sample depending on its static compression behavior at room temperature

  • The principle of the chosen engineer-technical approach to use a low test load, that would not lead to plastic deformation at room temperature enables the determination of a quantitative temperature value for the withstand of foams against a thermal load

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Summary

Introduction

The mechanical behavior of foams was well described in fundamental studies by Ashby [1, 2], stating that the typical compression curve consists of three areas. This includes (i) a linear-elastic region at the beginning, where the deformation of the foam is reversible as the cell struts and walls elastically bend, followed by (ii) a plateau, where they get plasticly deformed (i.e., irreversible) by buckling and breakage, and (iii) a steep increase of stress, which is called densification, where the compressed foams start to behave like a compact material [3, 4]. In the works of Ramsteiner et al [7] and Lim et al [8] it was clearly shown that for cellular materials the compressive deformation is not homogeneously distributed over the whole foam bulk but stress bands appear in which the deformation accumulates while other regions stay unaffected

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