Packaging Technology Research Articles

Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components

The 2.5D packaging technology is a high–performance method for electronic packaging. This study addresses the reliability issues of 2.5D packaging during the manufacturing process. A multi–physics field coupling Finite Element Method (FEM) has been developed, combined with sub–modeling techniques, to investigate the curing of underfill adhesive, the curing of Epoxy Molding Compound (EMC), and the reflow soldering between the interposer and substrate in a 2.5D packaging entity during various manufacturing procedures. The focus is on the thermo–mechanical–chemical behavior of viscoelastic components within the packaging structure, as well as the viscoplastic characteristics of the micro solder balls and microbumps. A systematic analysis is conducted on the warpage deformation and stress distribution of the 2.5D packaging at crucial time points. The results demonstrate that after curing, the overall warpage of the packaging exhibits a ‘concave’ warpage profile. Additionally, as the thickness of the EMC above the chip increases, the warpage value of the packaging also increases. The warpage value defined by linear elasticity is larger than that defined by viscoelasticity. The maximum Von Mises stress value in the key areas of the submodel is greater than the maximum Von Mises stress value in the corresponding key areas of the global model. After reflow soldering, the stress concentration in the micro solder balls occurs at the edge of the micro solder ball array. The maximum stress values for each component of the packaging are observed in the interface areas between the components. Packaging components that undergo the curing process have notably higher warpage and Von Mises stress values than those that do not undergo the curing process. The simulation method established in this study can accurately predict the warpage deformation and stress distribution state of 2.5D packaging, providing significant engineering application value for process optimization and reliability enhancement of 2.5D packaging in the production process.

Mini-LED Backlight: Advances and Future Perspectives

Miniaturized-light-emitting diode (mini-LED) backlights have emerged as the state-of-the-art technology for liquid crystal display (LCD), facilitating the improvement in a high dynamic range (HDR) and power saving. The local dimming technology divides the backlight into several dimming zones. Employing mini-LEDs, whose size ranges from 100 to 200 μm, as the light sources can enlarge the number of zones in the local dimming backlight, fulfilling the requirement for HDR. However, the halo effect still acts as one of the primary technological bottlenecks for mini-LED backlights. In this review, packaging technology of LEDs, color conversion, and the driving scheme of mini-LED backlights have been discussed. The strategies to reduce optical crosstalk in adjacent areas by various improved optical structures or to suppress the halo effect of LCDs by mini-LED backlights are summarized. The development trends of mini-LED backlights are also discussed.

Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications

This study presents the development of a highly robust, pressureless, and void-free silver sinter-bonding technology for power semiconductor packaging. A bimodal silver paste containing silver nanoparticles and sub-micron particles was used, with polymethyl methacrylate (PMMA) as an additive to provide additional thermal energy during sintering. This enabled rapid sintering and the formation of a dense, void-free bonding joint. The effects of sintering temperature and PMMA content on shear strength and microstructure were systematically investigated. The results showed that the shear strength increased with rising sintering temperatures, achieving a maximum of 41 MPa at 300 °C, with minimal void formation due to enhanced particle necking facilitated by PMMA combustion. However, at 350 °C, the shear strength decreased to 35 MPa due to cracks and voids at the copper substrate–copper oxide interface caused by thermal expansion mismatch. The optimal PMMA content was found to be 5 wt.%, balancing sufficient thermal energy and void reduction. This pressureless sintering technology demonstrates significant potential for high-reliability applications in power semiconductor modules operating under high-temperature and high-stress conditions.

Smart conducting polymer innovations for sustainable and safe food packaging technologies.

Biofilm formation on food packaging surfaces is a major issue in the industry, as it leads to contamination, reduces shelf life, and poses risks to human health. To mitigate these effects, developing smart coatings that can actively sense and combat microbial growth has become a critical research focus. This study is motivated by the need for intelligent packaging solutions that integrate antimicrobial agents and sensors for real-time contamination detection. It is hypothesized that combining conducting polymers (CPs) with nanomaterials can enhance antimicrobial efficacy while maintaining the mechanical integrity and environmental stability required for food packaging applications. Through the application of numerous technologies like surface modification, CP-nanoparticle integration, and multilayered coating, the antimicrobial performance and sensor capabilities of these materials were analyzed. Case studies showed a 90% inhibition of bacterial growth and a tenfold decrease in viable bacterial counts with AgNPs incorporation, extending strawberries' shelf life by 40% and maintaining fish freshness for an additional 5 days. Moreover, multilayered CP coatings in complex systems have been shown to reduce oxidative spoilage in nuts and dried fruits by up to 85%, while maintaining the quality of leafy greens for up to 3 weeks under suboptimal conditions. Environmental assessments indicated a 30% reduction in carbon footprint when CP coatings were combined with biodegradable polymers, contributing to a more transparent and reliable food supply chain. CP-based films integrated with intelligent sensors exhibit high sensitivity, detecting ammonia concentrations below 500ppb, and offer significant selectivity for sensing hazardous gases. These findings indicate that CP-based smart coatings markedly enhance food safety and sustainability in packaging applications.

Empowering farmer community with technology modernisation to improve rice farming performance through demonstration farms in East Java, Indonesia

Purpose Rice is a strategic commodity and staple food; thus, rice productivity should grow faster than the population. A public agricultural agency launched technology modernisation to improve rice farm performance. This study aims to assess the impact of technology modernisation on rice farming performance and evaluate farmer acceptance of such technology. Design/methodology/approach This study was conducted in 2023-2024, based on selected demonstration farms (demfarm) carried out during 2021-2022 in East Java, Indonesia, one of the rice bowls. Microeconomic theory of production and the double-differences approach were used as fundamental analyses. Farmers were purposively selected to participate in the demfarm. For comparison, farmers with existing technology adjacent to the demfarm were chosen accordingly. Rice production is considered an economic performance indicator, and factors related to socio-demographic and technical aspects were conceptualised using innovation and diffusion theory. Findings The results of demfarm were apparent. Technology modernisation improved rice farming’s economic performance. Farmer acceptance of such technology was relatively high at the first stage. There was no conflict between technology and local culture and norms. The technological package will likely be disseminated to farmers after adequate socialisation. Research limitations/implications This study engaged farmer innovators and early adopters in the demonstration farm. This needs more actions from farmers who are not categorised as innovators and early adopters, which dominate the farmer population. Practical implications Extension officials need field guidance to ensure continual technology adoption because of technology complexity. Originality/value The originality of the study is based on a field experiment and direct observation throughout a crop cycle, and the analysis is established using a solid theory and analytical framework.

Active Modified Atmosphere Packaging Helps Preserve Quality of Edible Flowers

Edible flowers are becoming increasingly popular as food products, since they give aroma, color, and visual appeal and are also health-promoting compounds. However, they are a highly perishable product, thus post-harvest technologies are needed to extend their marketability. In this study, active (N2: 100%) and passive modified atmosphere packaging (MAP) technologies were applied to three edible flower species, namely Begonia grandiflora ‘Viking’, Tropaeolum majus, and Viola cornuta, stored at 4 °C. Even if the flowers’ quality decay occurred differently according to the species, active MAP better maintained petal colors and slowed down the edible flowers’ decay than passive MAP by decreasing flower respiration in all three species and sugars consumption in begonia; there was weight loss in nasturtium, and better preserved total phenolic content in begonia and viola. Coupling cold storage with active MAP can be an effective method to extend edible flowers’ post-harvest life.

Intensity of Adoption of Improved Malt Barley Production Technologies in Ethiopia: A Case Study in Oromia Region

Improved malt barley production technology packages are not yet widely adopted in Ethiopia. Stakeholders, including brewers, malt factories, research institutes, and farmer-based organizations, have been collaborating and promoting new malt barley production technologies in order to boost the intensity of acceptance. The aim of this study was to find out the intensity of improved malt barley production technologies adoption in Arsi zones, Oromia region, Ethiopia. A stratified random sampling approach with multiple stages was employed to collect primary data from 384 malt barley household heads. The data was analyzed using descriptive statistics, and the intensity of adoption of improved malt barley production technologies was determined using an econometric Tobit regression model. The findings specified that the most adopted improved malt barley variety was Traveler (47.92%), which was followed in descending order by Iboni (14.58%), Sabini (9.38%), Grace (5.47%), Holker (4.43%), and 18.23% unnamed varieties. The Tobit model result also depicted that the intensity to which improved malt barley varieties adopted were affected by, taking into account factors including contract farming involvement, cooperative membership, off-farm income, size of livestock holdings, access to training, and mobile ownership. Enhancing farmers’ knowledge of the advantages of contract farming, income diversification, and mobile phone-based information delivery are among the many ways to support access to and accelerate the adoption of improved malt barley technology in the research area and beyond.

Advancements in metal oxide bio‐nanocomposites for sustainable food packaging: Fabrication, applications, and future prospectives

AbstractThe research on metal oxide bio‐nanocomposites for sustainable food packaging has witnessed significant advancements, offering a promising alternative to traditional food packaging materials. This review briefly describes their fabrication techniques, applications, superiority over conventional packaging, challenges, limitations, and potential trends. These new materials are derived by incorporating metal oxide nanoparticles into the biopolymers and show better properties, such as better antimicrobial properties, which are vital in food packaging. The advantages of using metal oxide bio‐nanocomposites over typical food packaging films include enhanced mechanical properties, better moisture and oxygen resistance, bacterial resistance, and light protection. These versatile materials not only serve the purpose of properly preserving the quality and possibly even the wholesomeness of packed food products, but they are also environmentally friendly. Moreover, the review presents current developments and areas of use of metal oxide bio‐nanocomposites in food packaging and it also proposes future developments to meet the modern challenge of the food industry in the development of advanced packaging technologies.

TCL Technology's Merger and Acquisition of Central Electronics: Analysis of Corporate M&A and Restructuring Strategies

Benefiting from national policy support and market economy, China's semiconductor industry has made significant progress in technological innovation, especially in the context of 5G, smart Internet and big data era, the center of gravity of the industry is shifting from South Korea and Taiwan to mainland China.Through the acquisition of Azeus, which is equipped with profound semiconductor packaging and testing technology, TCL Technology aims to enhance its competitiveness in the semiconductor field, optimize supply chain management and improve product quality control capability. supply chain management and improve product quality control. This paper examines TCL's acquisition of Azeus and discusses six aspects of the acquisition: overview of the two parties, industry background, progress of the acquisition, performance evaluation (including financial and non-financial), risk analysis, and characteristics of the acquisition. The results show that the acquisition has had a positive impact on TCL's development in semiconductors and related fields.

A system readiness approach to support the packaging and scaling of innovation bundles for farming systems transformation

CONTEXTA newly established ‘systemic approach to technology packaging’ for improved scaling has emerged in the literature. This approach suggests that core transformative innovations can be scaled more effectively through scaling readiness, which helps identify complementary innovations that support and facilitate the scalability of the core innovation. Since these packaging approaches start with single core innovations, we propose that they can benefit from the broader literature on sustainable agricultural systems transformation and readiness. OBJECTIVEThe objective of this paper is to advocate for a more comprehensive packaging of innovations for sustainable agricultural system transformations by better understanding gaps in the agricultural system – and its capacity for change. This approach provides a stronger rationale for the selection of relevant innovations to be packaged together. We introduce the concept of agricultural ‘system readiness’ as a possible framework for guiding such bundles. METHODSThe paper begins with a comprehensive literature review that identifies the current gaps in tools and methods to guide system transformation. It also focuses on the specific literature on innovation packaging for scaling, and builds on the gaps of existing approaches as a rationale for introducing the concept of system readiness (mostly used in infrastructure engineering), and adapting it to agricultural science. We also use illustrative hypothetical examples from mixed crop-livestock systems in the drylands to show how two approaches – ‘packaging for scaling’ and ‘packaging for transformation’ – can lead to different innovation packages. RESULTS AND CONCLUSIONSThe concept of system readiness is introduced, defined and advocated. We show that it can help identify performance gaps in agricultural systems and guide better planning for system strengthening and integration. We conclude with possible complementarities between the two approaches of scaling and system readiness. SIGNIFICANCEThe agricultural system readiness approach, as outlined in this paper, would be particularly beneficial for agricultural research-for-development, as well as other agricultural investment programs that seek to identify strategies for fostering sustainable transition in farming systems. Such programs would typically entail complexity-aware theories of change that focus on stimulating sustainable transformation pathways related to key target areas, such as agroecology, sustainable intensification, and system integration (e.g., crop-livestock integration and integrated pest management). The system readiness approach can support such programs through the identification, prioritization, targeting, and empowerment of the most significant (and transformative) system components by identifying respective innovations to be packaged.

Effect of packaging technology on ripening events occurring during storage of portioned PDO Italian semi-hard cheese

The aim of the present study was to assess the ability of the packaging technology (vacuum, VAC, and modified atmosphere, MAP) to preserve the microbiological, physicochemical, and sensorial properties of already ripened and portioned PDO Italian semi-hard cheese during 120 days of storage at 8 °C. Results were compared with those obtained by analyzing the original not-packed cylindrical wheel stored at 8 °C (NP). Samples packed under MAP showed yeasts’ proliferation with a final count of 4.68 Log cfu g−1, similar to that detected in the NP cheese wheels at 120 days of storage. In VAC samples yeasts did not proliferate, maintaining constant levels during time. Differently from the original wheels which showed a hardness increase in concomitant with a moisture loss during storage, packed samples under both VAC and MAP did not lose water preserving the original hardness of the product. At the same time, the packaging technology did not influence the proteolysis index in comparison to NP cheese. However, in MAP samples already at 30 days of storage different volatile compounds were produced in comparison with NP and VAC cheeses, suggesting that the modified atmosphere into the MAP pack promoted alternative microbial metabolisms and final products characterized by different volatile profiles. The study clearly demonstrated that the choice of packaging technology has an impact on the development of peculiar attributes of PDO cheeses, that are required by specific regulations in order to preserve their typicality and satisfy the consumers.

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder

As electronic packaging technology advances towards miniaturization and integration, the issue of electromigration (EM) in lead-free solder joints has become a significant factor affecting solder joint reliability. In this study, a Sn-3.0Ag-0.5Cu (SAC305) alloy was used as the base, and different Bi content alloys, SAC305-xBi (x = 0, 0.5, 0.75, 1.0 wt.%), were prepared for tensile strength, hardness, and wetting tests. Copper wire was used to prepare EM test samples, which were subjected to EM tests at a current density of approximately 0.6 × 104 A/cm2 for varying durations. The interface microstructure of the SAC305-xBi alloys after the EM test was observed using an optical microscope. The results showed that the 0.5 wt.% Bi alloy exhibited the highest ultimate tensile strength and microhardness, improving by 33.3% and 11.8% compared to SAC305, respectively, with similar fracture strain. This alloy also displayed enhanced wettability. EM tests revealed the formation of Cu6Sn5 and Cu3Sn intermetallic compounds (IMCs) at both the cathode and anode interfaces of the solder alloy. The addition of Bi inhibited the diffusion rate of Sn in Cu6Sn5, resulting in similar total IMC thickness at the anode interface across different Bi contents under the same test conditions. However, the total IMC thickness at the cathode interface decreased and stabilized with increasing EM time, with the SAC305-0.75Bi alloy demonstrating the best resistance to EM.

Unlocking superior preservation: The synergy of lignin and zeolite in chitosan-based composite films for perishable foods

Chitosan-based films are confronted with several technical challenges that impede their broad application in the preservation of perishable foods, such as suboptimal mechanical properties and insufficient antioxidant activity. In this work, we have introduced lignin (LG) and natural clinoptilolite zeolite (NCZ) into pure chitosan-based films to address the above limitations. The synergistic incorporation of LG and NCZ has endowed the composite films, designated as CTSLC, with a suite of enhanced attributes, including improved thermostability, enhanced UV-shielding capability and hydrophobicity, augmented antioxidant activity, refined gas selectivity, and bolstered mechanical properties. The enhancements in the antioxidant activity, gas selectivity, and mechanical properties of CTSLC are notably pronounced, reflecting a substantial advancement in their overall performance. These attributes surpass those of both pure chitosan-based film or commercial polyethylene film. Consequently, CTSLC could keep the freshness and appearance of strawberries and mangoes at least 60 hours and 10 days, respectively. The findings suggest that CTSLC has the potential to be a promising material for the preservation of perishable foods, offering a significant advancement in the field of food packaging and preservation technology.

Antibacterial, antioxidant and barrier properties of clay-doped electrospun fibers

Nowadays, packaging technologies have been extensively developed, including active and intelligent packages able to promote quality, safety, and the product shelf life. At this purpose, the aim of the study was focused on the design and development of polyvinyl alcohol-based nanofibers doped with two natural clays, montmorillonite or clinoptilolite, and loaded with chlorogenic acid, as nanofibrous membranes to control microbial contamination and oxidative state upon direct contact. The results showed that the 1 % w/w clay doping was the optimal concentration to obtain continuous and uniform nanofibers. In addition, chlorogenic acid loading (5 % w/w) into the nanofibers did not change the systems morphology, resulting in a chlorogenic acid sustained release, achieving 100 % within 24 h for all the systems with enhanced antioxidant and antimicrobial activities. Depending on their structure, the presence of the clays mineral was able to affect the aqueous vapor permeability. These results suggested the promising applications of the clay doped polyvinyl alcohol-based nanofibrous membranes as smart advanced material able to control microbial contamination and oxidative degradation to be used in biomedical field or as active packaging.

Sputtering of (111) highly-oriented nanotwinned Ag on polycrystalline Si3N4 substrates for high-power electronic packaging

Nanotwinned silver (NT-Ag) exhibits excellent mechanical and electrical properties, attributed to its high-density and (111) highly-oriented twinning structure in nanoscale. Therefore, it has recently drawn much attention in the field of electronic packaging, where it can be utilized as interconnection or metallization materials. However, it has been a critical challenge to fabricate the high-density and highly-oriented NT-Ag onto polycrystalline ceramic substrates, whose crystal structure does not support the epitaxial growth of NT-Ag films. In the current work, a high-density and highly-oriented NT-Ag film has been fabricated onto a polycrystalline ceramic substrate, i.e., NT-Ag on silicon nitride (NT-Ag@Si3N4), using the magnetron sputtering method. As results, a close-packed arrangement of high-density NT-Ag has been observed within columnar grains aligned along its growth direction, whereas the nanoindentation hardness of the NT-Ag film reached 1.82 GPa, with an electrical resistivity of 2.06 μΩ‧cm. Moreover, this study has discussed and explained the growth kinetics and mechanism of NT-Ag films, by controlling magnetron sputtering process parameters, such as sputtering power and argon flow rate. Additionally, the differences in the growth mechanism of NT-Ag on (100) Si and polycrystalline Si3N4 have also been investigated. With its superior material properties, NT-Ag@Si3N4 holds great promise in the applications of advanced packaging technology for high-power electronics.

Fertilizer management practices for cassava in acid dryland of Sukabumi Regency, West Java

The productivity of cassava in acid dryland is generally still low. Fertilization, land amelioration, and superior varieties are the main solutions for increasing cassava productivity. This research aimed to determine the response of high-yielding varieties and fertilization technology packages to the growth and yield of cassava in acid dryland of Sukaharja Village, Warung Kiara District, Sukabumi Regency, West Java. The contents of organic carbon, nitrogen, and magnesium of the soil is below the minimum threshold, so the application of N fertilizer, organic matter, and ameliorant is expected to increase plant growth. The research consisted of two treatment factors: two cassava varieties and three fertilization technologies. The treatments were arranged in a completely randomized split-plot experimental design with three replications with variety as the main plot and fertilization technology package as the subplots. The treatment effect was observed on the character of plant height, wet biomass weight, stem diameter, number of tubers, tuber length, tuber diameter, tuber weight (large and small) per plant, and tuber yield per plot to be converted per ha. Tuber quality was observed by observing water content, percent dry matter, and starch yield. The results showed that the fertilization technology package increased plant height, fresh biomass weight, stem diameter, large tuber weight per plant, and yield per hectare in both varieties. Differences in varieties and fertilization technology packages have no effect on starch levels.

Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging

Advanced 2.5D/3D wafer-level fan-out packaging technologies have been studied widely in literature and industry in recent years. Miniaturization, reduction in manufacturing costs, improvement in performance, and lower power consumption using packaging technologies drive increase in interconnect density and pitch scaling. Heterogeneous systems in package used in advanced packaging often include a combination of silicon, epoxy underfill or mold compounds, and organic or inorganic passivation or redistribution layers. This heterogeneity poses challenges with manufacturability, process selection, package architecture, and test vehicle design. The coefficient of thermal expansion mismatch, wafer warpage, and wafer yield are some of the critical process challenges. Delamination of silicon side wall or passivation to epoxy underfill or mold compound, joint fatigue are critical reliability challenges. This article explores various processes and reliability challenges with 3D wafer-level fan-out packaging and provides package design and architecture guidelines to overcome these failure modes. Stacked die-to-wafer test vehicles have been used for data collection. Different assembly materials, processes, and tooling have been evaluated to define comprehensive design rules.

High-entropy processed high quality and low-temperature cofired LiMgPO4-based dielectric ceramics for low-loss packaged millimeter-wave filters

In this work, we successfully integrated the high-entropy concept into LiMgPO4-based ceramics by strategically substituting Mg2+ with various divalent ions. Through a low-temperature solid-phase reaction method, a series of high-entropy LiMg0.9R0.1PO4 (R = Ni, NiCo, NiCoZn, NiCoZnCu, NiCoZnCuMn) ceramics were prepared successfully, and their MW dielectric properties were found to be heavily influenced by the ionic character, lattice energy, bond energy, entropy, ion radius disorder, and electronegativity of chemical bonds. Remarkably, LiMg0.9(Ni0.2Co0.2Zn0.2Cu0.2Mn0.2)0.1PO4 (LM5RP) ceramics exhibited exceptional MW dielectric properties (εr = 7.43, τf = − 27.6 ppm/°C, and Q × f = 83,216 GHz@13 GHz and 105,889 GHz@28 GHz) when sintered at an extraordinarily low temperature of 900 °C for 2 h. To demonstrate the real-world applicability of the LM5RP high-entropy ceramic, we designed and fabricated a state-of-the-art millimeter-wave (mmWave) filter, operating at 28 GHz, using low-temperature co-fired ceramic (LTCC) packaging technology. The filter exhibited unparalleled performance, featuring a low insertion loss (0.9 dB) and wide stopband suppression (> 17 dB @ 2.14 f0). These groundbreaking findings underscore the immense potential of high-entropy ceramics in revolutionizing advanced MW applications, particularly in the domain of B5G/6 G mmWave communication systems.

Polyvinyl Alcohol–Red Cabbage Nanofibers as pH-Responsive Freshness Sensors for Advanced Food Packaging Technology

Polyvinyl Alcohol–Red Cabbage Nanofibers as pH-Responsive Freshness Sensors for Advanced Food Packaging Technology

Effect of γ-irradiation and antimicrobial agent on properties of poly(L-lactide) active films

Data on irradiation of poly(L-lactide) (PLLA) based active packaging is still limited. Therefore, effect of γ-irradiation on neat PLLA and active packaging with oligohexamethylene guanidine hydrochloride (OHMG·HCl) has been studied. Combined use of irradiation and active packaging technology is promising approach to maintain food safety and prolong shelf life. It has been found that regardless of the OHMG·HCl content PLLA undergoes chain scission during irradiation and this process becomes less pronounced at doses higher than 50 kGy. Slight racemization of PLLA during exposure has been observed using polarimetry and 13C NMR spectroscopy. Mechanical properties of films have been examined. Biocide addition led to a 30% decrease in films elongation at break. Irradiation either caused elongation decrease. Dose of 50 kGy and higher made PLLA active films brittle. Multiple melting behavior of irradiated PLLA has been analyzed by differential scanning calorimetry. Fraction of crystals with higher melting temperature rose with dose. Possible reason for this phenomenon is formation of α′ form with less ordered chain packaging that recrystallizes during heating. The biocide addition has not affected this process. Furthermore, in vitro antimicrobial test has shown efficacy of films with 2 wt.% of OHMG·HCl against gram-negative, gram-positive bacteria and fungi.