Integration Technology Research Articles

Technologies for customized housing in modular construction

In the modular construction, the range of customization options is limited compared to traditional construction, which can be seen as a negative aspect. Different customization strategies can be adopted by companies, but the choice of the appropriate strategy is related to the technologies used in the operational process, with emphasis on the design and production stages. This study aims to compare the technologies used in the design, production and exchange of information in the development of customized housing in modular construction companies in Brazil and England. To achieve that, three case studies were conducted in English modular construction companies operating in the residential sector. The results of the case studies were compared with the literature on technologies used by Brazilian companies. It was noted that English companies, regardless of their size and type of customization offered, use Revit software to develop the design, and communication between different designers is done via cloud computing. However, communication between designers and production is often done on paper, which leads to errors. The machinery used on the shop floor varies between companies. The results found are similar to the Brazilian reality. It was noted that companies do not make use of all available potential; however, larger companies that are able to perform mass customization invest more in technologies for control and integration between operations. To ensure greater productivity and efficient use of technologies, companies should adopt mass customization.

Heterogeneous monolithic 3D integration for hybrid vertical CMOS inverter using n-type IGTO TFT on p-type Si FET

In this work, a complementary metal oxide semiconductor (CMOS) vertical inverter using heterogeneous monolithic 3D (M3D) integration with p-type Si field-effect transistor (FET) and n-type indium-gallium-tin-oxide (IGTO) thin film transistor (TFT) was implemented and characterized. This CMOS inverter was attained by vertical stacking n-type IGTO TFT on p-type Si FET. Oxide semiconductor materials such as indium-gallium-zinc-oxide (IGZO), indium-tungsten-oxide (IWO), indium oxide (In2O3) and IGTO are being considered as potential options for channel materials in M3D integration technology due to high electrical characteristics and low temperature process. Among them, IGTO was employed as a channel material to achieve high mobility. We fabricated a n-type IGTO TFT using HfO2 and tungsten as a gate dielectric and electrode, respectively. The post-annealing process was conducted at 200–500 °C with 50 °C intervals. The IGTO TFT exhibits a high field-effect mobility (32.9 cm2/Vs), low sub-threshold swing (0.070 V/dec) and stable reliability behaviour (ΔVth < 0.4 V) against various external gate bias temperature stress tests in a low temperature (<500 °C). The stable heterogeneous vertical inverter performance such as voltage-transfer curve (VM = 1.66 V), voltage gain (30.1 V at VDD = 3 V), and noise margin (NMH = 1.22 V, NML = 1.34 V) were well behaved. This M3D integration-based hybrid CMOS inverter can be an alternative knob toward various device applications.

The Role of Technology in Enhancing Work-Study Integration for Chinese Students

The rapid integration of technology into education and the workforce demands innovative approaches in order to the gap between classroom learning and real-world experience. This review paper analyses the growing role of technology in enhancing work-study integration for Chinese students, specifically focusing on virtual internships, online learning platforms, and AI-powered assessments. In the context of higher education, the integration of work and study is one of the key components, as a result of which the students not only study theoretical materials but also receive practical knowledge and first-hand experience. The Chinese students’ perception of technology is of paramount importance because apart from merely creating an integrated relationship between work and study, the latest technological advancements enable an individual to pursue new ways of learning, cooperation, and sharpening particular abilities. This paper reveals the complex nature of technology-related integration between work and in-school study for Chinese learners and contributes to the wider holistic view of education. The analysis of the existing research and successful initiatives coupled with how these technologies facilitate workplace learning, and develop essential skills is core to improving overall work-study experiences for Chinese students.

Using AI to Increase Heat Exchanger Efficiency: An Extensive Analysis of Innovations and Uses

Artificial intelligence (AI) has made significant strides toward cost reduction and performance optimization in heat exchanger technologies. Artificial intelligence (AI) methods in machine learning, deep learning, and expert systems provide significant advancements in diagnostics, performance optimization, and predictive maintenance. While deep learning is superior at recognizing intricate patterns, machine learning offers flexibility through data analysis. Expert systems use domain expertise to make decisions, although they might not be as flexible as data-driven methods. Hybrid approaches integrate these strategies to improve flexibility and performance. New developments include smart heat exchangers with IoT capabilities for real-time monitoring, compact designs for a variety of applications, and new materials and coatings that improve durability and efficiency. Reducing environmental effect is also reflected in sustainable solutions like waste heat recovery. Nevertheless, issues like computing costs, data quality, and interaction with current systems still need to be resolved. Optimized computational methodologies, modular integration, and sophisticated sensor technology are required to address these problems. AI has the power to completely transform heat exchanger technology by enhancing sustainability and efficiency. Future breakthroughs will be fueled by ongoing improvements in materials, designs, and AI approaches, offering more complex solutions to satisfy changing environmental and performance requirements.

Milletomics: a metabolomics centered integrated omics approach toward genetic progression.

Producing alternative staple foods like millet will be essential to feeding ten billion people by 2050. The increased demand for millet is driving researchers to improve its genetic variation. Millets include protein, dietary fiber, phenolic substances, and flavonoid components. Its climate resilience makes millet an appealing crop for agronomic sustainability. Integrative omics technologies could potentially identify and develop millets with desirable phenotypes that may have high agronomic value. Millets' salinity and drought tolerance have been enhanced using transcriptomics. In foxtail, finger, and pearl millet, proteomics has discovered salt-tolerant protein, phytohormone-focused protein, and drought tolerance. Metabolomics studies have revealed that certain metabolic pathways including those involving lignin, flavonoids, phenylpropanoid, and lysophospholipids are critical for many processes, including seed germination, photosynthesis, energy metabolism, and the synthesis of bioactive chemicals necessary for drought tolerance. Metabolomics integration with other omics revealed metabolome engineering and trait-specific metabolite creation. Integrated metabolomics and ionomics are still in the development stage, but they could potentially assist in comprehending the pathway of ionomers to control nutrient levels and biofortify millet. Epigenomic analysis has shown alterations in DNA methylation patterns and chromatin structure in foxtail and pearl millets in response to abiotic stress. Whole-genome sequencing utilizing next-generation sequencing is the most proficient method for finding stress-induced phytoconstituent genes. New genome sequencing enables novel biotechnological interventions including genome-wide association, mutation-based research, and other omics approaches. Millets can breed more effectively by employing next-generation sequencing and genotyping by sequencing, which may mitigate climate change. Millet marker-assisted breeding has advanced with high-throughput markers and combined genotyping technologies.

The Relationship Between Economic Integration, Economic Growth and High Technology: Eurasian Economic Integration and Turkey

Abstract Subject and purpose of work Economic integration is an extremely important institutional structure for countries in international trade, which is highly competitive, with the level of globalisation, innovation and communication technology. Materials and methods Economic integration, which leads to the formation of a resilient economic wall, such as risk sharing, increasing investment opportunities, free trade structure, technology transfer opportunities, common competitiveness against countries outside the union, began in the modern world with the Second World War, and examples began to be seen around the world in the 1990s when globalisation accelerated. The analysis was carried out using the Todo-Yamamoto method in the SPSS program. Results Due to its geopolitical position (both historical and geographical proximity to Europe, Asia and the Middle East), Turkey is in a more advantageous position than other countries in the world in terms of establishing or becoming economically integrated. However, Turkey’s history of economic integration has been rather unsuccessful. The fact that it has not made a sufficient contribution to the integration it has established or attempted to become a member of, and that it has become a unipolar rather than a multipolar integrator, means that it has not achieved sufficient efficiency in terms of international trade. For this reason, our study analyses Turkey’s relationship with Eurasian economic integration, with the idea that Turkey is striving for multipolar integration. In our study, the impact of the Eurasian Economic Integration’s foreign trade with Turkey on Turkey’s economic growth and exports of high-tech products was analysed with the Todo-Yamamoto Co-Integration Test in two periods, 2002-2015 and 2015-2022. Conclusions As a result of the analysis, it is found that Eurasian Economic Integration has a positive effect on Turkey’s economic growth and exports of high-tech products. In the light of the data obtained, it has been assessed that the expansion of economic integration relations with the EEE and the benefits to be derived from the membership relationship will contribute to both Turkey’s economic growth and its technological infrastructure.

Knowledge of recommended integrated pest management technology by cotton growers

Knowledge of recommended integrated pest management technology by cotton growers

“Be prepared to be humbled, to listen, and learn a lot”

AbstractThe head of the German producer of photonics packaging and integration technology shares his insights with EPIC's photonics technologies program manager.

A review of physical heat dissipation methods for 3D integrated technology

Three-dimensional integrated circuits have higher integration than two-dimensional integrated circuits, and can obtain higher performance and lower power consumption in a certain space. In order to fulfill higher efficiency, thermal management becomes particularly important in 3D integration technology. However, the traditional heat dissipation method cannot satisfy the heat dissipation needs of three-dimensional integrated circuits, which require better heat dissipation methods to be developed. This paper introduces the realization of three-dimensional integrated circuit using silicon via (TSV) technology, which allows the chip to be vertically stacked to transmit information. This paper summarizes the research methods and findings of three-dimensional integrated circuit heat dissipation in recent years, including thermal through silicon via (TTSV) and microchannel cooling. It also emphasizes the advantages and disadvantages of both mehods, and the challenges faced in current research via an overview. The future research trend for both heat dissipation methods mainly consists of combining special algorithms to achieve thermal-electrical codesign and thermal management of three-dimensional integrated circuits.

Sustainable investigation and process intensification on the separation of ternary organic wastewater with heterogeneous characteristics

The tetrahydrofuran (THF)/water/n-propyl acetate (PROAC) mixture, which is categorized into class 2.0-2b-C, exhibits pressure-sensitive property along with heterogeneous regions in its phase diagram. Conventional pressure-swing distillations with different separation sequences (PSD-PTW, PSD-PWT) and a novel three-column heterogeneous azeotropic pressure-swing distillation (T-HAPSD) are designed to complete the separation. The PSD section of T-HAPSD combines three columns into two columns. The HAD section of T-HAPSD is more energy-efficient owing to the automatic separation in the decanter. T-HAPSD is more economical than conventional pressure-swing distillation. Heat integration and Self-heat recuperation technology (SHRT) are then introduced to reduce energy consumption and costs. Finally, the five processes are evaluated from four aspects (economy, energy, environment and exergy). The best of five processes is T-HAPSD-SHRT with 37.83% reduction in TAC, 51.17% reduction in TEC, 48.83% reduction in gas emissions and 52.63% reduction in exergy destruction when compared with PSD-PTW.

Two-Dimensional Semiconductors for State-of-the-Art Complementary Field-Effect Transistors and Integrated Circuits.

As the trajectory of transistor scaling defined by Moore's law encounters challenges, the paradigm of ever-evolving integrated circuit technology shifts to explore unconventional materials and architectures to sustain progress. Two-dimensional (2D) semiconductors, characterized by their atomic-scale thickness and exceptional electronic properties, have emerged as a beacon of promise in this quest for the continued advancement of field-effect transistor (FET) technology. The energy-efficient complementary circuit integration necessitates strategic engineering of both n-channel and p-channel 2D FETs to achieve symmetrical high performance. This intricate process mandates the realization of demanding device characteristics, including low contact resistance, precisely controlled doping schemes, high mobility, and seamless incorporation of high- κ dielectrics. Furthermore, the uniform growth of wafer-scale 2D film is imperative to mitigate defect density, minimize device-to-device variation, and establish pristine interfaces within the integrated circuits. This review examines the latest breakthroughs with a focus on the preparation of 2D channel materials and device engineering in advanced FET structures. It also extensively summarizes critical aspects such as the scalability and compatibility of 2D FET devices with existing manufacturing technologies, elucidating the synergistic relationships crucial for realizing efficient and high-performance 2D FETs. These findings extend to potential integrated circuit applications in diverse functionalities.

Wafer‐scale single‐crystal two‐dimensional materials for integrated optoelectronics

AbstractSince the pioneering research on graphene, two‐dimensional (2D) materials have been considered as the most promising candidates to continue advancing Moore's Law, and an emerging material family, which has bred a lot of novel functional applications beyond the Si‐based integrated circuit. Unfortunately, abundant challenges in the synthesis of wafer‐scale single‐crystal (WSSC) 2D materials and their on‐chip integration technology severely hinder their commercialization road. Over the past few years, significant technique breakthroughs of WSSC 2D materials have been increasingly achieved, accordingly a comprehensive review and critical evaluation of these new advances are pressingly required. In this review article, the outstanding research progress on the synthesis of WSSC 2D materials and 2D material‐based on‐chip integration technology, including 2D materials integration, nanopatterning, electrode integration, and dielectric integration, are summarized in detail. Then, the major application prospect of different types of WSSC 2D materials in optoelectronics is discussed. Finally, a critical assessment of these advancements is given, as well as the potential challenges and opportunities in the foreseeable future.

Effect of Data Integration Techniques on Operational Efficiency in Manufacturing Industries in Iran

Purpose: The aim of the study was to assess the effect of data integration techniques on operational efficiency in manufacturing industries in Iran. Materials and Methods: This study adopted a desk methodology. A desk study research design is commonly known as secondary data collection. This is basically collecting data from existing resources preferably because of its low cost advantage as compared to a field research. Our current study looked into already published studies and reports as the data was easily accessed through online journals and libraries. Findings: The study found that by seamlessly amalgamating data from disparate sources across production lines, supply chains, and customer feedback systems, manufacturers have been able to streamline processes, optimize resource allocation, and achieve significant cost savings. For instance, real-time data integration facilitates timely decision-making, allowing for adaptive production planning and inventory management. Furthermore, the integration of advanced analytics and machine learning algorithms has enabled predictive maintenance strategies, reducing downtime and enhancing overall equipment effectiveness (OEE). These technological advancements not only bolster operational efficiency but also foster innovation, as companies leverage integrated data insights to drive continuous improvement initiatives and meet evolving consumer demands. Implications to Theory, Practice and Policy: Resource-based view (RBV), technology acceptance model and dynamic capabilities theory may be used to anchor future studies on assessing the effect of data integration techniques on operational efficiency in manufacturing industries in Iran. Manufacturing firms should prioritize strategic implementation plans for data integration technologies to ensure that investments in IoT, AI, ETL, data warehousing, data virtualization, and APIs are aligned with their overall business objectives. Policymakers should provide incentives and support for the adoption of advanced data integration technologies in the manufacturing sector.

Artificial Amacrine Retinal Circuits.

Event-based imaging represents a new paradigm in visual information processing that addresses the speed and energy efficiency shortcomings inherently present in the current complementary metal oxide semiconductor-based machine vision. Realizing such imaging systems has previously been sought using very large-scale integration technologies that have complex circuitries consisting of many photodiodes, differential amplifiers, capacitors, and resistors. Here, we demonstrate that event-driven sensing can be achieved using a simple one-resistor, one-capacitor (1R1C) circuit, where the capacitor is modified with colloidal quantum dots (CQDs) to have a photoresponse. This sensory circuit emulates the motion-tracking function of the biological retina, in which the amacrine cells in the bipolar-to-ganglion synaptic pathway produce a transient spiking signal only in response to changes in light intensity but remain inactive under constant illumination. When extended to a 2D imaging array, the individual sensors work independently and output signals only when a change in the light intensity is detected; hence, the concept of the frame in image processing is thereby removed. In this work, we present the fabrication and characterization of a CQD photocapacitor-based 1R1C circuit that has a spectral response at 1550 nm in the short-wave infrared (SWIR). We report on the key performance parameters including peak responsivity, noise, and optical noise equivalent power and discuss the operating mechanism that is responsible for spiking responses in these artificial retinal circuits. The present work sets the foundation for expanding the bioinspired vision sensor capability toward midwave infrared (MWIR) and long-wave infrared (LWIR) spectral regions that are invisible to human eyes and mainstream semiconductor technologies.

Design and theoretical analysis of near-infrared multiband metamaterial absorber with concentric sub-resonators for solar applications

Metamaterial absorbers with multiple frequency bands can be designed by stacking sub-resonators vertically or arranging them co-planarly. However, to increase the number of absorption peaks, we often need more sub-resonators. Therefore, a study explores dynamic infrared multiband metamaterial absorbers to enhance electromagnetic wave absorption and addresses tunability challenges by utilizing a periodic sub-wavelength structure-based unit cell. The novel design comprises a concentric triangular strip within a central hollow of a square patch, with four hollow cylindrical spaces at the patch corners, each containing four small square pillars. The design comprises a metal–dielectric–metal architecture, with silver as the top patch and the ground metal layer separated by a thin magnesium fluoride dielectric layer. A temperature-controlled material vanadium dioxide layer is introduced below the upper metal layer to enhance the absorbance. Moreover, extensive parametric investigations have been conducted involving the manipulation of shape while keeping other dimensions constant. The goal is achieving perfect multiple absorptions within the 90–300 THz frequency range, ensuring impedance match and exhibiting plasmonic resonance characteristics. The study also investigates unit cell behavior regarding polarization and incident angle variations. Simulations are conducted using CST Microwave Studio Suite® with finite integration technology and validated with COMSOL Multiphysics® using the finite element method in the frequency domain. The simulated results reveal multiple absorption peaks in the terahertz range, averaging 98.32% with a maximum absorption of up to 99.99% and exhibiting high absorption coefficients at discrete resonance frequencies, suggesting promising applications in terahertz technology-related fields.

TiO2-based nitrogen dioxide gas sensor with transparent ordered micro-hollow bump structure prepared by 3D heterogeneous integration technology

This study produces the TiO2 membrane for a transparent ordered micro-hollow-bump (TOMHB) structure using a micro electro mechanical system (MEMS) and 3D heterogeneous integration (HI). The SEM image shows that the diameter and depth of each MHB are 12.5 μm and 8.5 μm. The TEM image shows that a 70 nm-thick TiO2 membrane is uniformly coated onto the MHB using atomic layer deposition (ALD). For NO2 gas sensing, the TiO2 TOMHB gas sensor is measured with and without UV irradiation at a working temperature for the sensor of room temperature, and a measurement time from NO2 injection to exhaust of about 5 min. Without UV irradiation, the gas response is good but the response time is slow and difficult-recoverable. With UV irradiation, the TiO2 TOMHB gas sensor has a fast response and recovery time. Four consecutive stability experiments show that the sensor response has an average value of 9.5 % for NO2 4.25 ppm. The average response time is 7 s and the average recovery time is 144 s. In addition, the TiO2 TOMHB gas sensor is a good selective for NO2 gas. These results show that the TiO2 TOMHB NO2 gas sensor has good stability, reproducibility and selectivity.

A comprehensive review of deep learning-based models for heart disease prediction

Heart disease (HD) is one of the leading causes of death in humans, posing a heavy burden on society, families, and patients. Real-time prediction of HD can reduce mortality rates and is crucial for timely intervention and treatment of HD. Deep learning (DL)-related methods have higher accuracy and real-time performance in predicting HD. In this study, we comprehensively compared and evaluated the contributions and limitations of DL algorithms, extended deep learning (ETDL) algorithms, and integrated deep learning (integrated DL) algorithms that combine DL with other technologies for predicting HD. The articles considered span the period from 2018 to 2023, and after rigorous screening, 64 articles were selected for preliminary research. A systematic literature review of real-time HDP will provide future researchers with a comprehensive understanding of existing deep learning methods and related integrated technologies in the healthcare industry. Furthermore, it discusses popular datasets employed in deploying numerous prediction models. Additionally, it reveals existing open problems or challenges encountered by previous researchers. Notably, the most prevalent challenge is the scarcity of large discrete datasets, followed by the need for further improvement of existing models.

CILF: CRISPR/Cas9 based integration of large DNA fragments in Saccharomyces cerevisiae.

Genome integration technology has markedly expedited the construction of cell factories. However, its application is currently limited by the inefficient integration of large DNA fragments. Here, we report a CRISPR/Cas9 based integration of large DNA fragments (CILF) method to efficiently integrate large DNA fragments in Saccharomyces cerevisiae. In this approach, a fusion protein, Cas9-Brex27-FadR, was employed for the targeted delivery of donor plasmid to double-strand breaks (DSBs), while simultaneously recruiting Rad51 to enhance the efficiency of homologous recombination (HR). Our findings demonstrate that this method can achieve an integration efficiency of 98% for 10 kb DNA fragments and nearly 80% for 40 kb DNA fragments at a single site, using donor plasmids with 1000 bp homology arms (HAs) and 12 FadR binding sites (BSs). The CILF technique significantly enriches the synthetic biology toolbox of S. cerevisiae, offering significant potential to propel advancements in both synthetic biology and metabolic engineering.

Enhancing exergy efficiency and environmental sustainability in pressure swing azeotropic distillation

This study explores the economic, energetic, exergy efficiency, and environmental benefits of energy integration in pressure-swing distillation, focusing on the separation of tetrahydrofuran/water and acetone/chloroform azeotropes. Heat integration and heat pump techniques are applied to reduce energy consumption. Three energy-efficient configurations are examined, comparing total annual cost (TAC), total energy consumption (TEC), CO2 emissions, and second-law efficiency. In the tetrahydrofuran/water system, heat integration and heat pump technologies outperform conventional processes, achieving up to 50.2% TAC reduction, 59.6% TEC reduction, 82.8% CO2 emission reduction, and thermodynamic efficiencies up to 23.5%. In the acetone/chloroform system, similar improvements are observed, with up to 70.9% TAC reduction, 87.2% CO2 emission reduction, and thermodynamic efficiencies up to 17.6%. These findings demonstrate the effectiveness of energy-saving strategies, endorsing process intensification for environmentally sustainable azeotropic mixture separations.

Securing Data Privacy in the Food Supply Chain Using Integrated BC-FL Technology

Securing Data Privacy in the Food Supply Chain Using Integrated BC-FL Technology