Surface Mount Devices Research Articles

Pea-Sized mmW Transceivers: QFN-?Based Packaging Concepts for Millimeter-Wave Transceivers

Enormous technological progress accomplished over the last several decades has facilitated the use of millimeter-wave (mmW) frequencies for mass-produced products such as automotive radars, industrial sensors, highspeed data communication links, and medical devices. The main enablers are new semiconductor technologies, with constantly improving cut-off frequencies reaching several hundred gigahertz. However, the dominant limiting factor for the mass production of low-cost mmW systems above 100 GHz is that suitable packaging technologies are not yet available. Still, a dramatic increase in research and development is taking place in the area of mmW packaging. The goal of this article is to provide a short overview of the topic and then present one particular approach in detail: the idea of integrating a complete mmW front end, including the antenna, into one small solderable surfacemount device (SMD).

3D Metamorphic Stretchable Microphone Arrays

AbstractThis article describes the realization of a metamorphic microphone array. The array morphs from a concave to a planar and then to a convex shape. The morphing array enables a better (12×) sound source localization when compared to existing static and planar arrangements. To enable the realization, a novel stretchable (elongated up to 320% of the original length) printed circuit board fabrication process is reported. The fabrication process enables high‐temperature processing, alignment, and registration. Moreover, conventional and otherwise rigid surface mount devices (SMDs) can be used. The process allows the researcher to increase the number of devices (30 SMDs) and interconnects (60 in total) to the required level. As electrical connections, a polyimide‐cladded metal track design is reported; the design sustained 11 050 stretch and release cycles. Moreover, 3D reinforcement frames are reported as an effective measure to shield the SMD components from high levels of stress. The resulting products are millimeter‐thin stretchable rubber‐embedded and electrically interconnected electronic structures with mechanical rubber‐membrane‐like properties. Morphology changes involve deflation and inflation of the membrane to bulge inward or outward. Finally, the use of 3D‐shaped chaperon is discussed to provide additional shape control.

Localization of component lead inside a THT solder joint for solder defects classification

Purpose: Automatic Optical Inspection (AOI) systems, used in electronics industry have been primarily developed to inspect soldering defects of Surface Mount Devices (SMD) on a Printed Circuit Board (PCB). However, no commercially available AOI system exists that can be integrated to a desktop soldering robotic system, which is capable of identifying soldering defects of Through Hole Technology (THT) solder joints along with the soldering process. In our research, we have implemented an AOI platform that is capable of performing automatic quality assurance of THT solder joints in a much efficient way. In this paper, we have presented a novel approach to identify soldering defects of THT solder joints, based on the location of THT component lead top. This paper presents the methodologies that can be used to precisely identify and localize THT component lead inside a solder joint. Design/methodology/approach: We have discussed the importance of lead top localization and presented a detailed description on the methodologies that can be used to precisely segment and localize THT lead top inside the solder joint. Findings: It could be observed that the precise localization of THT lead top makes the soldering quality assurance process more accurate. A combination of template matching algorithms and colour model transformation provide the most accurate outcome in localizing the component lead top inside solder joint, according to the analysis carried out in this paper. Research limitations/implications: When the component lead top is fully covered by the soldering, the implemented methodologies will not be able to identify the actual location of it. In such a case, if the segmented and detected lead top locations are different, a decision is made based on the direction in which the solder iron tip touches the solder pad. Practical implications: The methodologies presented in this paper can be effectively used to have a precise localization of component lead top inside the solder joint. The precise identification of component lead top leads to have a very precise quality assurance capability to the implemented AOI system. Originality/value: This research proposes a novel approach to identify soldering defects of THT solder joints in a much efficient way based on the component lead top. The value of this paper is quite high, since we have taken all the possibilities that may appear on a solder joint in a practical environment.

Thermal Analysis of Solder Joint Based on Eddy Current Pulsed Thermography

Solder joint provides electronic and mechanical connections between components and substrate. Overheating and excessive temperature gradient can cause solder joint failures and then make the whole system break down. Thus, thermal analysis has been the hotspot in reliability evaluation of electronic packaging. This paper proposes eddy current pulsed thermography (ECPT) to investigate thermal transfer through solder joint in a surface mounted device (SMD). A 3-D electromagnetic-thermal model was built, and the ECPT system was established to analyze transient temperature distribution on the pin surface. This model introduced pseudo soldering and evaluated its impacts on thermal conduction. Thermal resistance of solder joint was calculated to characterize different pseudo soldering defects. With pseudo soldering acreage increased, thermal resistance had an approximate quadratic rise. Both simulation and experimental results indicate that the surface temperature gradually decreases with the increase of pseudo soldering acreage. This ECPT method could be applied to the thermal analysis of solder joint in SMD, and it also could provide guidance for thermal design or reliability evaluation of electronic packages.

Evaluation of current and temperature effects on optical performance of InGaAlP thin-film SMD LED mounted on different substrate packages

The relationship between the photometric, electric, and thermal parameters of light-emitting diodes (LEDs) is important for optimizing the LED illumination design. Indium gallium aluminium phosphide (InGaAlP)-based thin-film surface-mounted device (SMD) LEDs have attracted wide attention in research and development due to their portability and miniaturization. We report the optical characterization of InGaAlP thin-film SMD LED mounted on FR4, 2 W, and 5 W aluminum (Al) packages. The optical and thermal parameters of LED are determined at different injection currents and ambient temperatures by combining the T3ster (thermal transient tester) and TeraLED (thermal and radiometric characterization of power LEDs) systems. Analysis shows that LED on a 5 W Al substrate package obtains the highest luminous and optical efficiency.

AC–DC Disk Resistors Made of Surface Mount Components

Disk resistors are widely used in micropotentiometers up to frequencies in the radio frequency range. They offer very small AC–DC differences but the permissible power dissipation is quite small. Also, the resistance value is poorly defined due to the lack of four-terminal connections. This can be overcome by newly designed disk resistors made of surface mount device components [1]. They are also well suited as AC–DC current shunts for currents up to several amperes.

Ballistic wearable electronic vest design

In present study, electronic vests were designed by using conductive textile material and electronic circuits. The objective was to sense armed assaults and transmit the coordinates and position of gun fire instantly to the headquarters. Another objective is to provide instant emergency respond for injuries at vital sections of the body and to capture perpetrators quickly. To reach the desired targets, silver-coated conductive yarn, polyamide plain weave and various circuit components were used. Silver-coated conductive yarn was used to form sensor unit of the electronic vest and stitched over polyamide fabric in 3 mm intervals. Main vest section was prepared in medium size and conductive-yarn sensor unit was installed to the vest with a velcro system. Classical and Surface Mount Device (SMD) circuit technologies were used in circuit units to sense bullet intrusion and transmit the case to operational center. Two different circuit designs were tested at a shooting range and the outcomes were assessed and ...

Flexible hybrid circuit fully inkjet-printed: Surface mount devices assembled by silver nanoparticles-based inkjet ink

Nowadays, inkjet-printed devices such as transistors are still unstable in air and have poor performances. Moreover, the present electronics applications require a high degree of reliability and quality of their properties. In order to accomplish these application requirements, hybrid electronics is fulfilled by combining the advantages of the printing technologies with the surface-mount technology. In this work, silver nanoparticle-based inkjet ink (AgNP ink) is used as a novel approach to connect surface-mount devices (SMDs) onto inkjet-printed pads, conducted by inkjet printing technology. Excellent quality AgNP ink-junctions are ensured with high resolution picoliter drop jetting at low temperature (∼150 °C). Electrical, mechanical, and morphological characterizations are carried out to assess the performance of the AgNP ink junction. Moreover, AgNP ink is compared with common benchmark materials (i.e., silver epoxy and solder). Electrical contact resistance characterization shows a similar performance between the AgNP ink and the usual ones. Mechanical characterization shows comparable shear strength for AgNP ink and silver epoxy, and both present higher adhesion than solder. Morphological inspections by field-emission scanning electron microscopy confirm a high quality interface of the silver nanoparticle interconnection. Finally, a flexible hybrid circuit on paper controlled by an Arduino board is manufactured, demonstrating the viability and scalability of the AgNP ink assembling technique.

Modeling Spectra of Low-Power SMD LEDs as a Function of Ambient Temperature

The information of spectral changes with various parameters is a key for optimizing the performance and thus improving long-term reliability of light-emitting diodes (LEDs) in solid-state lighting applications. In this paper, the extension of spectrum model was used to estimate the spectral flux of indium gallium aluminum phosphide (InGaAlP)-based low-power surface-mounted device (SMD) LEDs. The spectra and photometric parameters of LED packages were measured at several ambient temperatures to test the spectrum model extension. The spectrum model is constructed at 298 K to predict the spectral fluxes of the LED at any ambient temperature. Carrier temperature, peak frequency, and bandgap energy variations with ambient temperature are included in this extension. The agreement between the measured and theoretical results of spectrum, luminous flux, and International Commission on Illumination (CIE) color coordinates validates the extended spectral model for low-power LEDs.

APLIKASI PERHITUNGAN KAPASITOR SURFACE MOUNT DEVICE

Calculate the capacitor by utilizing the technology will become more enjoyable and easier than counting capacitor using analog avometer. Calculating the capacitor will be easy fun and more interesting if we calculate it using the applications in the gadget that is growing rapidly at this time, especially android. Applications capacitor calculation Surface Mount Device android-based using java language and compiler software as the eclipse. There are three types of calculators capacitors, including two standard calculator ventax place code, calculator samsung alternate two code numbers and calculator samsung standard single place code. Design system used there are four, namely: Activity Diagram, Usecase Diagram, Sequence Diagram, and Deployment diagrams. The fourth component is part of the UML (Unified Modeling Language).

A Wide-Band Test Fixture for Analyzing Parasitic Effects of RF Passive SMD Components

A wide-band test fixture is designed for the measurement of parasitic effects of RF passive SMD (surface mounted devices) components. Two calibration methods, TRM (Thru-Reflect-Match) from 45 MHz to 2 GHz and TRL (Thru-Reflect-Line) from 2 GHz to 12 GHz, are used for error correction. The measurement standards and fixture are designed based on these two calibration methods. For experimental verification, the multilayered ceramic SMD capacitors of Johanson Technology are measured. The parasitic effects of the SMD capacitors are analyzed. The designed fixture is feasible and applicable for quick and accurate measurement of RF passive SMD components.

Balanced Adaptive Tabu Search Algorithm to Optimize Dual-gantry Pick-and-place Assembly

This paper presents an optimization study of dual-gantry high-speed rotary-type pick-and-place surface mount device (SMD) machine. In the dual-gantry SMD machine, there are two feeder bases and gantry heads, such that two placement heads can pick-and-place synchronously in one PCB, which has an advantage in assembly PCB with more component types. The dual-gantry optimization problem is decomposed into nozzle arrangement, feeder assignment, pick-and-place sequence, component allocation, and gantry schedule problems. To balance the workload between gantries and reduce the wait time in the gantry's synchronous movement, a balanced adaptive tabu search (BATS) algorithm is proposed. Based on the 16 industrial data tests, the proposed algorithm yields a 7.04% improvement on average compared to the industrial package.

Time and frequency characteristics of very fast transient overvoltage in ultra high voltage substation

Most work about the measurement of very fast transient overvoltage (VFTO) was carried out in the laboratory and test base. Because of the different GIS arrangement and power capacity, the time and frequency characteristics of VFTO in ultra high voltage (UHV) substation could be different with that obtained in the laboratory and test base. A series of VFTO measurements were carried out in two 1100 kV GIS substations to investigate the characteristics of on-site VFTO. The port-hole sensor based on surface-mounted device was chosen to measure the VFTO for its reliability and wide band-width. The whole measurement system was introduced and the schematic layout of each experiment was given. Measurement results of different switch conditions and measure points were presented for comprehensive understanding of the VFTO characteristics on site. The results indicated that the striking number during one operation was 16 (closing) and 14 (opening), similar to that obtained from test base result. Besides, single strike with front time 5.3 ns and voltage steepness 186.1 kV/ns was recorded, and the steepness was relatively higher than that gained in the test base. Moreover, the spectral analysis based on S transform was investigated to get the duration of different frequency components of VFTO waveform. Compared with the data obtained from the test base, the high frequency components of VFTO were reduced, while the lower frequency components lasted longer. The results provided references for the investigation of the electromagnetic interfere, the insulation coordination, and VFTO mitigation methods.

Deformable printed circuit boards that enable metamorphic electronics

A method to produce single-layer deformable and stretchable printed circuit boards is reported and applied to enable the realization of metamorphic electronic products that can take on new three-dimensional (3D) shapes. The models contain arrays with packaged surface mount devices and bare dies that integrate light-emitting diodes (LEDs) and transistors within a rubber matrix. The test structures morph from planar to spherical to cone-like topologies. In one approach, the thickness of the stretchable printed circuit board is locally adjusted to control the morphological changes. In addition, a three-dimensionally-shaped chaperon is introduced to enable more abrupt topological changes. A comparative study of various designs of the metallization layer and stress-relieving reinforcing elements identified a highly stretchable and deformable design (up to 315% or six thousand 150% stretch and release cycles), which shields the interface between the hard and non-stretchable components from high levels of stress. A slight tweak to normal fabrication procedures has enabled researchers develop circuit boards that turn into new three-dimensional shapes. Flexible electronic devices are usually made by depositing circuits onto rubberized substrates. But delaying the use of a stretchable support until the end of production makes it easier to design, test and process such materials, reports Heiko Jacobs from Technische Universität Ilmenau and colleagues. This approach enabled them to identify meandering metal ribbons and rigid reinforcement bars as ways to provide critical stress relief for ‘metamorphic’ electronics. After integrating light-emitting diodes and other surface-mounted devices into rubber matrices, the team transformed the flat materials into shapes such as spheres and cones by either adjusting the thickness of the rubber substrate or inflating them with the help of geometric ‘chaperones’. A novel approach to produce stretchable and deformable printed circuit boards is reported and applied to enable the realization of metamorphic electronic products, which conform to take on new three-dimensional shapes. The test structures morph from planar, to spherical, to cone-like topologies.

Investigation of Light Extraction by Refractive Index of an Encapsulant, a Package Structure, and Phosphor

The effects of the refractive index of an encapsulant on the light-extraction efficiency (LEE) of white light-emitting diodes (LEDs) are studied. A dome-type blue LED with a high-refractive-index encapsulant (HRE) shows a higher LEE compared to that of a low-refractive-index encapsulant (LRE). In a flat-type surface-mounted device (SMD) package, however, an LED with LRE shows a higher LEE than an LED with the HRE. These results stem from differences in the total internal reflection at the interfaces between the encapsulant and the air. In an SMD package, the LEE at the interface between an LED chip and an HRE is higher than that between an LED chip and an LRE, whereas the LEE at the interface between an HRE and air is lower than that between an LRE and air. The simulation results based on Monte Carlo ray tracing agree well with the experimental results. On the contrary, when a flat-type white LED is fabricated with a high concentration of phosphors, the optical power with LRE is lower than that with HRE because the optical paths within an LED package are modified by phosphor.

A single unit cooling fins aluminum flat heat pipe for 100 W socket type COB LED lamp

Although the LED light has higher energy conversion efficiency compared with the conventional metal halide lamp, it is well known that there is a thermal burden due to the poor photoelectric conversion efficiency of the semiconductor diode. SMD (Surface Mount Device) LED lamp which has been mainly used has induced a problem of poor optical efficiency though it has relatively large heat dissipation area. Much effort has been put to improve the optical efficiency through COB (Chip on Board) LED lamp, but the thermal problem particularly in the over 100W application is still exist. As the studies for applying the heat pipe to the high power LED, an embedding technology the heat pipe in the MCPCB (Metal Core Printed Circuit Boards), loop heat pipe, and a columnar heat pipe for 90W, etc. were developed and may apply to COB LED lamp. In this paper, a single unit cooling fins aluminum flat heat pipe (AFHP) with U shape is developed for the 100W COB LED lamp with 120∗120∗170mm3 of small volume and socket type electric connection. The U shape AFHP module has less than 900g, low price by extrusion method and socket type lamp, therefore replacement and maintenance of the lamp for factory-light or street-light could be easily conducted. Through the study, a single unit cooling fins AFHP is designed and fabricated. And the heat transfer characteristics of the AFHP with two condensers have been investigated, and the junction temperature of the COB LED module was also evaluated within 85°C at 100W of input power.

Automated optical inspection system for surface mount device light emitting diodes

Surface-mount device light emitting diode (SMD-LED) is characterized by small size, wide viewing angle and light weight. It becomes the main package type of LED gradually. The traditional visual inspection is likely to cause misrecognition due to personal subjectivity and different defect recognition standards. Therefore, this study develops an automatic SMD-LED defect detection system, which is characterized by non-contact inspection, defect recognition standardization and upgrading product quality. It detects the common and important defects in LED package components, including missing component, no chip, wire shift and foreign material. In this study the gray scale characteristic of histogram is used as the rapid sieving analysis indicator of missing component defect, and then the component and solder joint are positioned by using fast normalized cross-correlation, and the maximum correlation coefficient value is used as judgment indicator of no chip defect. In order to overcome the difficult identification as the weld line is subject to light rays, the improved Michelson-like contrast (MLC) enhancement is proposed, and the segmentation threshold is selected by entropy information to segment the weld line successfully. Furthermore, in order to overcome the effect of the tolerance of component size and internal electrode and unfixed weld line position resulted from lead frame process on foreign material detection result, the multiscale adaptive Fourier analysis (MAFA) is proposed in the concept of texture anomaly detection for foreign material defect detection. The result proves that the proposed method can segment the defect effectively and correctly compared with the phase-only transform (PHOT) and multiscale phase-only transform (MPHOT), and it can be used in other fields of texture anomaly detection. The overall recognition rate of this system is 98.25%, contributing to the large market demand and high component quality of LED industry.

Comparative Modeling and Analysis of Lead-Free Solder Extrusion for the Design of Reliability

Abstract Due to rapid growth of the microelectronics industry, packaged devices with small form factors, low costs, high power performance, and increased efficiency have become of high demand in the market. To realize the current market development trend, flip chip interconnection and System-in-Package (SiP) are some of the promising packaging solutions developed. However, a surprising amount of surface mount technology (SMT) defects are associated with the use of lead-free solder paste and methods by which the paste is applied. Two such defects are solder extrusion and tombstoning. Through the use of design of experiments (DOE), lead-free solder defect causes can be better understood and subsequently reduced or eliminated. This paper will examine the failure modes of solder extrusion and tombstoning that occurred when two different types of lead-free solders, Sn-Ag-Cu (SAC) and BiAgX were used within a SiP for attachment of surface mount devices (SMD) chip components. The systematic investigation will include the comprehensive failure analysis of the SMD components and compare the modeling and analysis of the two different solder types utilizing the design of experiments methods.

Overview of physical dosimetry methods for triage application integrated in the new European network RENEB

Purpose: In the EC-funded project RENEB (Realizing the European Network in Biodosimetry), physical methods applied to fortuitous dosimetric materials are used to complement biological dosimetry, to increase dose assessment capacity for large-scale radiation/nuclear accidents. This paper describes the work performed to implement Optically Stimulated Luminescence (OSL) and Electron Paramagnetic Resonance (EPR) dosimetry techniques.Materials and methods: OSL is applied to electronic components and EPR to touch-screen glass from mobile phones. To implement these new approaches, several blind tests and inter-laboratory comparisons (ILC) were organized for each assay.Results: OSL systems have shown good performances. EPR systems also show good performance in controlled conditions, but ILC have also demonstrated that post-irradiation exposure to sunlight increases the complexity of the EPR signal analysis.Conclusions: Physically-based dosimetry techniques present high capacity, new possibilities for accident dosimetry, especially in the case of large-scale events. Some of the techniques applied can be considered as operational (e.g. OSL on Surface Mounting Devices [SMD]) and provide a large increase of measurement capacity for existing networks. Other techniques and devices currently undergoing validation or development in Europe could lead to considerable increases in the capacity of the RENEB accident dosimetry network.

Minimum Time Algorithm for Gantry Travel

Surface mount technology is a method of applying lead solder to PCB pads to fix Surface Mount Device (SMD) components on PCBs. SMT facilitates the pickup of the electronic component and accurate placement on PCBs. Heads and nozzles for each axis use suction cups to pick up electronic components from tape feeders. The components are inspected before a vision camera to check pickup location and alignment, and then are moved to PCBs waiting on the conveyer for placement. This paper presents an algorithm that identifies the shortest path from sLa to pLb without stopping before the camera for visual inspection. The simulations verified that the fly motion method reduced the time involved by 16% compared to the stop motion method.