Layer Superlattices Research Articles

750 V Breakdown in GaN Buffer on 200 mm SOI Substrates Using Reverse-Stepped Superlattice Layers

In this work, we demonstrated the epitaxial growth of a gallium nitride (GaN) buffer structure on 200 mm SOI (silicon-on-insulator) substrates. This epitaxial layer is grown using a reversed stepped superlattice buffer (RSSL), which is composed of two superlattice (SL) layers with different Al component ratios stacked in reverse order. The upper layer, with a higher Al component ratio, introduces tensile stress instead of accumulative compressive stress and reduces the in situ curvature of the wafer, thereby achieving a well-controlled wafer bow ≤ ±50 µm for a 3.3 µm thick buffer. Thanks to the compliant SOI substrate, good crystal quality of the grown GaN layers was obtained, and a breakdown voltage of 750 V for a 3.3 µm thick GaN buffer was achieved. The breakdown field strength of the epitaxial GaN buffer layer on the SOI substrate is estimated to be ~2.27 MV/cm, which is higher than the breakdown field strength of the GaN-on-Si epitaxial buffer layer. This RSSL buffer also demonstrated a low buffer dispersion of less than 10%, which is good enough for the further processing of device and circuit fabrication. A D-mode GaN HEMT was fabricated on this RSSL buffer, which showed a good on/off ratio of ~109 and a breakdown voltage of 450 V.

Proximal High-Index Metamaterials based on a Superlattice of Gold Nanohexagons Targeting the Near-Infrared Band.

Plasmonic nanoparticles can be assembled into a superlattice, to form optical metamaterials, particularly targeting precise control of optical properties such as refractive index (RI). The superlattices exhibit enhanced near-field, given the sufficiently narrow gap between nanoparticles supporting multiple plasmonic resonance modes only realized in proximal environments. Herein, the planar superlattice of plasmonic Au nanohexagons (AuNHs) with precisely controlled geometries such as size, shape, and edge-gaps is reported. The proximal AuNHs superlattice realized over a large area with selective edge-to-edge assembly exhibited the highest-ever-recorded RI values in the near-infrared (NIR) band, surpassing the upper limit of the RI of the natural intrinsic materials (up to 10.04 at λ = 1.5µm). The exceptionally enhanced RI is derived from intensified in-plane surface plasmon coupling across the superlattices. Precise control of the edge-gap of neighboring AuNHs systematically tuned the RI as confirmed by numerical analysis based on the plasmonic percolation model. Furthermore, a 1D photonic crystal, composed of alternating layers of AuNHs superlattices and low-index polymers, is constructed to enhance the selectivity of the reflectivity operating in the NIR band. It is expected that the proximal AuNHs superlattices can be used as new optical metamaterials that can be extended to the NIR range.

The role of grain boundary and alloy scattering within the Callaway model to calculate lattice thermal conductivity in GaN/AlN superlattice

The grain boundary and alloy scattering within the Debye-Callaway model were introduced to calculate the temperature-dependent lattice thermal conductivity (LTC) in the GaN/AlN superlattice. The superlattice layers are assumed to be grains, and the sample is then treated as a multigrain material. The computations include various physical parameters related to Aluminum alloy compositions, such as Debye temperature, atomic mass, lattice volume, density, alloy scattering factor and deformation energy. In general, the sample size effect on LTC in this superlattice structure was similar to any single component solids, but it has a significant influence from the grain boundaries represented by the thickness of layers in the form of LTCPeakpoint.=5.9925e0.0005L2 at the peak point maximum and LTC(600K)=0.344L at 600K, L is the sample size. The dislocations in these samples are controlled by the inbuilt AlN layers with the dependence of NDisl.=−0.542LAlN+7.4.

Time-dependent conduction mechanisms in reversed stepped superlattice layers of GaN HEMTs on 200 mm engineered substrates

Time-dependent conduction in epitaxial superlattice (SL) strain relief layers of GaN high electron mobility transistors on 200 mm engineered substrates with a poly-AlN core was observed and analyzed. This phenomenon occurs when the devices were operated with substrate bias of ∼−300 V for 101–103 s. The formation of the conduction path is related to trap-assisted leakage through the SLs on the engineered substrates; de-trapped carriers spread out vertically and laterally within a portion of the SLs, leading to a higher electrical field across the rest of the layers. This conduction mechanism may be hidden during the devices' normal operation (target 650–1200 V). It could lead to undesired effects during the operation of the devices, such as a time-dependent dynamic Ron. More resistive SLs will potentially reduce the impact of this phenomenon.

Observation of 2D-magnesium-intercalated gallium nitride superlattices

Since the demonstration of p-type gallium nitride (GaN) through doping with substitutional magnesium (Mg) atoms1,2, rapid and comprehensive developments, such as blue light-emitting diodes, have considerably shaped our modern lives and contributed to a more carbon-neutral society3–5. However, the details of the interplay between GaN and Mg have remained largely unknown6–11. Here we observe that Mg-intercalated GaN superlattices can form spontaneously by annealing a metallic Mg film on GaN at atmospheric pressure. To our knowledge, this marks the first instance of a two-dimensional metal intercalated into a bulk semiconductor, with each Mg monolayer being intricately inserted between several monolayers of hexagonal GaN. Characterized as an interstitial intercalation, this process induces substantial uniaxial compressive strain perpendicular to the interstitial layers. Consequently, the GaN layers in the Mg-intercalated GaN superlattices exhibit an exceptional elastic strain exceeding −10% (equivalent to a stress of more than 20 GPa), among the highest recorded for thin-film materials12. The strain alters the electronic band structure and greatly enhances hole transport along the compression direction. Furthermore, the Mg sheets induce a unique periodic transition in GaN polarity, generating polarization-field-induced net charges. These characteristics offer fresh insights into semiconductor doping and conductivity enhancement, as well as into elastic strain engineering of nanomaterials and metal–semiconductor superlattices13.

Performance of long-wave infrared band of microstructured heavily doped InAsSb on type II superlattice layer part 1: the photonic study

This article deals with the optical study of nanostructured components which absorb light across the entire long-wave infrared (LWIR) spectral band. The components are made of type-II superlattice (T2SL) absorber and highly doped InAsSb, the latter being nanostructured to ensure multiple resonances. We studied two components: in the first one, the T2SL has a thickness of 1.6 μm, and in the second its thickness is 300 nm. The calculated absorption spectra were shown and the components revealed high absorption thanks to optical resonance and high angular acceptance. A fabrication process has been developed, and optical measurements have confirmed the reliability of the model.

Enhancement mode β-(Al0.19Ga0.81)2O3/Ga2O3 HFETs with superlattice back-barrier layer

In this study, we numerically investigate the improvement in maximum drain current of an enhancement-mode β-(Al0.19Ga0.81)2O3/Ga2O3 heterostructure field-effect transistor (HFET) that employs a superlattice back-barrier layer. The measured transfer characteristics of a recently reported enhancement-mode β-(Al0.19Ga0.81)2O3/Ga2O3 HFET are reproduced using a device simulation and modeling tool. Subsequently, the transfer, output, radio frequency (RF), and off-state breakdown characteristics of the proposed device are revealed. The calculated off-state breakdown voltage is drastically enhanced from 26 V to 93 V for a gate length (LG) of 195 nm and a gate-to-drain separation (LGD) of 190 nm because of the superlattice back-barrier, which is one of the highest breakdown voltages reported for submicron Beta-Gallium Oxide (β-Ga2O3) transistors. Moreover, the insertion of the superlattice back-barrier layer improves subthreshold characteristics, resulting in a positive shift in the threshold voltage. The results indicate that using the superlattice back-barrier can dramatically enhance both the off-state current characteristics and RF characteristics of the enhancement mode in highly scaled β-Ga2O3 HFETs.

Material Design of Ultra-Thin InN/GaN Superlattices for a Long-Wavelength Light Emission.

GaN heterostructure is a promising material for next-generation optoelectronic devices, and Indium gallium nitride (InGaN) has been widely used in ultraviolet and blue light emission. However, its applied potential for longer wavelengths still requires exploration. In this work, the ultra-thin InN/GaN superlattices (SL) were designed for long-wavelength light emission and investigated by first-principles simulations. The crystallographic and electronic properties of SL were comprehensively studied, especially the strain state of InN well layers in SL. Different strain states of InN layers were applied to modulate the bandgap of the SL, and the designed InN/GaN heterostructure could theoretically achieve photon emission of at least 650 nm. Additionally, we found the SL had different quantum confinement effects on electrons and holes, but an efficient capture of electron-hole pairs could be realized. Meanwhile, external forces were also considered. The orbital compositions of the valence band maximum (VBM) were changed with the increase in tensile stress. The transverse electric (TE) mode was found to play a leading role in light emission in normal working conditions, and it was advantageous for light extraction. The capacity of ultra-thin InN/GaN SL on long-wavelength light emission was theoretically investigated.

InGaAs-Based MSM Photodetector: Researching Absorption Layer, Barrier Layer, and Digital Graded Superlattice Layer with 3D Simulation

The effects of absorption, barrier, and digital graded layer thickness on dark current and photocurrent in Metal Semiconductor Metal (MSM) photodetectors by using 3D Silvaco TCAD are reported. The photo-dark current ratio (Iphoto/Idark) is calculated using the photocurrent and dark current values obtained by simulation. In study A (absorption layer thickness variation) the photocurrent, dark current and photo-dark current ratio are increased with increased absorption layer thickness, and the dark current is 1.138x10-7 A levels. In Study B (barrier layer thickness variation), when the barrier layer is added to the absorption layer, the dark current is decreased to 1.56x10-11 A levels. It is reported that the photo-dark current ratio with increasing barrier layer thickness increases. In study C (digital graded superlattice layer thickness variation), the dark current increases, and photocurrent decreases with the increase of the digital graded superlattice layer thickness. However, the photo-dark current ratio with increasing digital graded superlattice layer thickness decreases. Furthermore, a similar trend of development is observed on photo-dark current with adding of the barrier layer and digital graded superlattice layer on the absorption layer. These findings demonstrate the importance of optimizing layer thickness in MSM photodetectors for improved device performance.

Effect of varying threading dislocation densities on the optical properties of InGaN/GaN quantum wells with intentionally created V-shaped pits

The effect of varying threading dislocation densities on the internal quantum efficiencies (IQEs) of InGaN quantum wells (QWs), with and without intentionally created “V-pits,” is reported here. InGaN QW samples grown on GaN-on-sapphire templates with threading dislocation densities of <1 × 108 and <1 × 109 cm−2 are compared, with and without GaN/InGaN superlattice (SL) layers incorporated to intentionally open up the threading dislocation cores and form large-size “V-pits.” The formation of “V-pits” is confirmed by cross-sectional transmission electron microscopy to initiate from threading dislocations in the SL layers. The densities of the pits are confirmed by plan-view SEM to agree with the substrate threading dislocation densities. The experimental room temperature IQEs of the “V-pit” QW samples are enhanced to 15% ± 1% compared to 6% ± 2% for conventional QW samples. Both conventional and “V-pit” samples show insensitivity to the magnitude of the dislocation densities with respect to IQE performance, while the “V-pit” samples show shifts in the peak emission wavelengths compared to the conventional samples, attributed to strain modulation. This study provides additional understanding of the causes of the observed insensitivity of the IQEs to different threading dislocation densities.

Microstructural characterization of AlxGa1−xN/GaN high electron mobility transistor layers on 200 mm Si(111) substrates

Realization of high crystal quality GaN layers on silicon substrates requires a great control over epitaxy as well as detailed characterization of the buried defects and propagating dislocations within the epilayers. In this Letter, we present the microstructural characterization of AlxGa1−xN/GaN high electron mobility transistor (HEMT) structures epitaxially grown on 200 mm Si (111) substrates with superlattice (SL) buffers. The HEMT stack is also composed of an intermediate thick AlxGa1−xN layer sandwiched between the short-period and long-period AlxGa1−xN/AlN SLs. Structural and morphological characteristics of the GaN-based epilayers are studied to assess the quality of the HEMT stack grown on such 200 mm diameter substrates. The detailed microstructural uniformity of the epilayers is addressed by the transmission electron microscopy (TEM) technique. In depth scanning TEM with electron energy loss spectroscopy (EELS) investigations have been carried out to probe the microstructural quality of the HEMT stack comprising of such short- and long-period AlxGa1−xN/AlN SLs. The EELS-plasmon maps are utilized to address the sharp interface characteristics of the SL layers as well as the top active p-GaN/AlxGa1−xN/GaN layers. This work highlights the capability of high-resolution TEM as a complementing characterization method to produce reliable AlxGa1−xN/GaN HEMTs on such a large diameter silicon substrate.

Research on plasma devices and antenna systems based on superlattice structures

To decrease the effect of carrier concentration on the skin depth, a new SPiN diode based on superlattice structure is discussed. Compared with traditional plasma diode, the intrinsic region of the SPiN diode is designed with SiGe/Si superlattices layer, and the thickness of the plasma islands is reduced from 80 μm to 5 μm, which dramatically reduced the design complexity and technical difficulty of microwave devices. Besides, a high-integration solid-state plasma inverted-F antenna based on this diode is also demonstrated in this paper. The resonant frequency of the inverted-F plasma antenna is in the order of 2.45 GHz, and the maximum gain reaches to 2 dB, which verify the effectiveness of the designed superlattice SPiN diode.

InGaN/GaN superlattice underlayer for fabricating of red nanocolumn μ-LEDs with (10-11) plane InGaN/AlGaN MQWs

In this study, the growth behavior of Indium gallium nitride (InGaN)-based nanocolumn arrays was investigated, and red emission nanocolumn micro-light emitting diodes (μ-LEDs) were fabricated. The internal structure of the InGaN/GaN superlattice (SL) layer under the multiple-quantum-well (MQW) active layers was evaluated using scanning transmission electron microscopy (STEM) analysis. It was revealed that the InGaN crystal plane at the top of the nanocolumn changed from the c-plane, (1-102) plane, to the (10-11) plane as the number of SL pairs increased. A semipolar (10-11) plane was completely formed on top of the nanocolumn by growing InGaN/GaN SLs over 15–20 pairs, where the InGaN/GaN SL layers were uniformly piled up, maintaining the (10-11) plane. Therefore, when InGaN/AlGaN MQWs were grown on the (10-11) plane InGaN/GaN SL layer, the growth of the (10-11) plane semipolar InGaN active layers was observed in the high-angle annular dark field (HAADF)-STEM image. Moreover, the acute nanocolumn top of the (10-11) plane of the InGaN/GaN SL underlayer did not contribute to the formation of the c-plane InGaN core region. Red nanocolumn μ-LEDs with an φ12 μm emission window were fabricated using the (10-11) plane MQWs to obtain the external quantum efficiency of 1.01% at 51 A cm−2. The process of nanocolumn μ-LEDs suitable for the smaller emission windows was provided, where the flat p-GaN contact layer contributed to forming a fine emission window of φ5 μm.

High-quality AlGaN epitaxial structures and realization of UVC vertical-cavity surface-emitting lasers

AlGaN-based vertical-cavity surface-emitting lasers (VCSELs) have garnered recent interest due to their superior material properties and device benefits. Nevertheless, AlGaN-based VCSELs are extremely difficult to realize due to numerous technical limitations associated with both material epitaxial growth and chip fabrication. This study fabricated a high-quality AlGaN multiple quantum wells (MQWs) structure using epitaxial lateral overgrowth and analyzed it using X-ray diffraction (XRD) and photoluminescence (PL) measurements. With an edge dislocation density (DD) of 109 cm−2, XRD measurements reveal that the AlN template is nearly fully relaxed. The subsequent AlGaN/AlN superlattice (SL) layer is introduced to decrease the edge DD, and the edge DD in the MQWs is ∼108 cm−2. According to PL measurements, the internal quantum efficiency of the MQWs is as high as 62%, and radiative recombination dominated the emission of the MQWs at room temperature. Using these epitaxial wafers, ultraviolet radiation C (UVC) VCSELs were fabricated using various techniques, including laser lift-off (LLO) and chemical mechanical polishing (CMP). The crystallinity of the MQWs was unaffected by sapphire substrate removal using LLO. After removing the sapphire substrate using LLO and CMP, UVC surface-stimulated emission was observed in MQWs. AlGaN-based UVC VCSELs with lasing wavelengths of 275.91, 276.28, and 277.64 nm have been fabricated. The minimum threshold for UVC VCSELs is 0.79 MW cm−2, which is a record low.

Geometric defects induced by strain relaxation in thin film oxide superlattices

Functional thin film superlattices with stability in extreme environments can lead to transformative performance in optical and thermal applications such as thermophotovoltaics. In this work, key issues associated with defects that prevent layer-by-layer growth in epitaxial, low-miscibility oxide superlattices are investigated. Layer protrusions, approximately 8 nm wide and 3 nm thick, arise from a strain relaxation mechanism in 8 nm bilayer superlattices of Ba(Zr0.5Hf0.5)O3/MgO and propagate through the subsequent superlattice layers forming an inverted pyramid structure that is spatially phase offset from the matrix. The density and size of these defects scales with the number of interfaces in the sample, indicating that surface roughness during growth is a significant factor in the formation of these defects. In situ high temperature transmission electron microscopy (1000 °C, in vacuo) measurement reveals that phase decomposition of Ba(Zr0.5Hf0.5)O3 and decoherence of the superlattice is nucleated by these defects. This work highlights that achieving optimum growth conditions is imperative to the synthesis of single-crystalline superlattices with sharp interfaces for optimized performance in extreme environments.

Anisotropic Strain Relaxation in Semipolar (112¯2) InGaN/GaN Superlattice Relaxed Templates.

Semipolar (112) InGaN/GaN superlattice templates with different periodical InGaN layer thicknesses were grown on m-plane sapphire substrates using metal-organic chemical vapor deposition (MOCVD). The strain in the superlattice layers, the relaxation mechanism and the influence of the strain relaxation on the semipolar superlattice template were explored. The results demonstrated that the strain in the (112) InGaN/GaN superlattice templates was anisotropic and increased with increasing InGaN thickness. The strain relaxation in the InGaN/GaN superlattice templates was related to the formation of one-dimension misfit dislocation arrays in the superlattice structure, which caused tilts in the superlattice layer. Whereas, the rate of increase of the strain became slower with increasing InGaN thickness and new misfit dislocations emerged, which damaged the quality of the superlattice relaxed templates. The strain relaxation in the superlattice structure improved the surface microtopography and increased the incorporation of indium in the InGaN epitaxial layers.

Atomic-scale mapper for superlattice photodetectors analysis.

In this work, a new Python-based tool for atomic-scale mapping of high-angle annular dark-field (HAADF) and annular bright-field (ABF) scanning transmission electron microscopy (STEM) images using the Z-contrast method is introduced, aimed to help in the analysis of superlattice layers' composition, and in the determination of material of interfaces. The operation principle of the program, as well as specific examples of use, are explained in many details. Good customization flexibility using the user-friendly graphical user interface (GUI), allows the processing of a wide range of images, demonstrating a decent accuracy of coordinates extraction and performance.

Magnetic Structure and Strain State in Fe/V Superlattices Studied by 57Fe+ Emission and Conversion Electron Mössbauer Spectroscopy

The magnetic properties of the Fe/V superlattices were studied by conventional Conversion Electron Mössbauer Spectroscopy (CEMS) and online 57Fe+ emission Mössbauer Spectroscopy (eMS) at room temperature (RT) at ISOLDE/CERN. The unique depth-enhanced sensitivity and ultradiluted regime of the probe atoms adopted in this eMS facility enabled the investigation of the magnetic structures and the strain state in the superlattice layers and at the interfaces. The magnetic spectra of the superlattices were found to depend on both the local lattice environment and the strain state of the Fe-lattices. The magnetic polarisation in the V-layers or at the interfaces was not detected at RT. Spectral broadening was evident in the single line component of the eMS due to Fe ions substituted at V-lattice sites in the V-layers of the superlattice, attributable to the lattice strain in the V-layers. Our study demonstrate that with the online eMS technique the effects of the strain state of the superlattice on the magnetic properties of the Fe-layer in the Fe/V multilayer structures can be detected.

Methods for controlling the properties of nanoregions formed due to self-organization during electronic phase separation in Eu0.8Ce0.2Mn2O5 multiferroics

Methods for controlling (by magnetic field, changing temperature, and optical pumping) the properties of nanoregions forming due to self-organization during phase separation in Eu0.8Ce0.2Mn2O5 multiferroics are studied. Such nanoregions are superlattices (semiconductor heterostructures). The dynamically equilibrium states of superlattices (their long-lived ground states) are formed during cycling under magnetic field. Such states of superlattices are electrically neutral and consist of ferromagnetic layers. A set of ferromagnetic resonances from superlattices layers make it possible to distinguish the states of superlattices. The optical pumping of various powers allows controlling both the magnetic and electrical properties of superlattices.

Features of electronic phase separation in multiferroic ErMn2O5

The effect of rare-earth ions Er3+, which has a large orbital contribution to the magnetic moment, on the phase transitions and states of the phase separation nanoregions has been studied in multiferroic ErMn2O5. These nanoregions are semiconductor heterostructures formed due to self-organization processes in the ErMn2O5 matrix. A significant effect of Er3+ ions, the moments of which are rigidly oriented along the c axis of the crystal, on the magnetic dynamics, heat capacity, and multiferroic properties of superlattices layers in a wide temperature range of 5 ÷ 300 K has been revealed.