ABSTRACT In this study, S1 and S2 with different Mn-Si contents and Mn/Si mass ratios are prepared for the film deposition and interfacial heat transfer experiments using the droplet solidification technique. The effect of Mn-Si contents and Mn/Si mass ratios on the film deposition and interfacial heat transfer behaviour are investigated. The results revealed that the increase of Mn content (from 0.403 wt.% to 0.621 wt.%) and Si content (from 0.145 wt.% to 0.171 wt.%) resulted in a higher film deposition rate (from 1.23μm to 1.43μm per droplet test), as evidenced by the enhancement of thickness (from 11.07 μm to 12.86 μm), particle size (from 1250 nm to 1340 nm), and surface roughness (from 2.580 μm to 3.217 μm) of the deposited film after 9 experiments. Moreover, an increase in the Mn/Si mass ratio of the sample from 2.78–3.63 leads to a corresponding enhancement (from 65.67 wt.% to 71.02 wt.%) in the MnO content within the film. As a result, the melting point (from 1319°C to 1348°C) and thermal resistance of the obtained film exhibit a gradual increase, thereby limiting the extent of improvement in interfacial contact conditions and ultimately diminishing the enhancement of interfacial heat transfer behaviour by the deposited film. Additionally, the transition point in interfacial heat transfer behaviour occurs earlier for a higher Mn and Si content and higher Mn/Si mass ratio due to a higher film deposition rate and melting point.
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